Metallography
Silicon Carbide Paper
SMART CUT® Silicon Carbide Abrasive Paper is meticulously designed for preparing metallographic specimens, incorporating superior silicon carbide grains embedded in a resilient, waterproof backing for both dry and wet grinding. This versatile paper transitions smoothly from coarse cutting to fine polishing, ensuring that specimens are precisely prepared for microscopic analysis.
SMART CUT 105N Diamond, Nickel Bond Wafering Blades INTERRUPTED RIM
SMART CUT™ Series 105N more freer cutting & aggressive than continuous rim nickel bond wafering blades. Best Suited for cutting larger variety of micro-electronics packages, pcb boards, plastics, composites, soft and precious metals, fish and human bones, graphite, GRP, FR4. Core steel with memory. Always snaps back to its original shape no matter how much bent.
Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed)
SMART CUT® 2020
Diamond, Nickel Bond Cut Off Blades for Laboratory & Abrasive Cut Off Saws
Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Unlike sintered (meal bond) cutting blades where diamond is impregnated inside metal binder matrix based on bronze, copper, nickel and other alloys.
SMART CUT® 205M
SMART CUT Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
SMART CUT® CBN WAFERING BLADES SINTERED (METAL BOND)
SMART CUT® DIAMOND WAFERING BLADES SINTERED (METAL BOND)
SMART CUT® Fully Sintered (Metal Bond) Diamond & CBN, Wafering Blades
SMART CUT® Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
Smart Cut® Glass Blade
SMART CUT Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
SMART CUT® Resin Bond Diamond Polishing Discs
SMART CUT® Segmented Turbo Diamond Cup Wheel
SMART CUT® Series 100N Wafering Blade, Nickel Bond
NICKEL BOND, DIAMOND CONTINUOUS RIM
SMART CUT® Series 100N will provide finer cut quality than interrupted rim nickel bond wafering blades. Best suited for cutting soft and fragile crystals, silicon wafers & substrates, fiberglass, glass fibers. made with stainless steel core Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed) Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.
