Nickel Bond (plated)

Band Saw Blades

Band Saw Blades All diamond band saw blades are custom manufactured to fit your exact material, needs and application requirements.

Diamond Wire

SMART CUT  Diamond wire produces minimum kerf loss, less sub-surface damage, and contamination free coolant. Used for precision cutting of various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials. Diamond Wire cutting is an environmentally friendly cutting process as it eliminates slurry recycling and disposal issues.

Diamond, Nickel Bond Cut Off Blades for Laboratory & Other Saws

Diamond, Nickel Bond Cut Off Blades for Laboratory & Other Saws Nickel Bond Diamond Cut off blades Blades usually have

Nickel Bond Hubbed Dicing Blades

Nickel Bond Diamond & CBN Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. Recommended for cutting softer and more gummy materials

SMART CUT 105N Diamond, Nickel Bond Wafering Blades INTERRUPTED RIM

SMART CUT™  Series 105N more freer cutting & aggressive than continuous rim nickel bond wafering blades. Best Suited for cutting larger variety of micro-electronics packages, pcb boards, plastics, composites, soft and precious metals, fish and human bones, graphite, GRP, FR4. Core steel with memory. Always snaps back to its original shape no matter how much bent. Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed) Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. 

SMART CUT® 2010

Diamond, Nickel Bond Cut Off Blades for Laboratory & Abrasive Cut Off Saws
Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.  Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Unlike sintered (meal bond) cutting blades where diamond is impregnated inside metal binder matrix based on bronze, copper, nickel and other alloys.

SMART CUT® Series 100N Wafering Blade, Nickel Bond

NICKEL BOND, DIAMOND CONTINUOUS RIM
SMART CUT™ Series 1o0N will provide finer cut quality than interrupted rim nickel bond wafering blades. Best suited for cutting soft and fragile crystals, silicon wafers & substrates, fiberglass, glass fibers. made with stainless steel core Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed) Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.