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SMART CUT® Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8″/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
These types of blades may last as much as 3 to 4 standard blades with steel core put together. Since the entire blade is diamond and same thickness from OD to ID (with no thinner steel core to flex, warp, or loose its flatness). The fully sintered (metal bond) blades is more rigid. Providing minimum heat generation and stress to material being cut. This allows for thinner kerf thicknesses that would not be normally possible with wafering blades made with steel core, longer blade life, better cut quality and more rigidity. These are an excellent choice for sectioning large variety of ultra-hard and brittle materials, delicate samples, crystals, teeth, bones, composites, metals, and much more.
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SMART CUT™ blades are fully sintered from the Outside Diameter (OD) to Inside Diameter (ID), meaning they have diamonds impregnated throughout the entire blade, unlike the conventional blades which have a steel core and a diamond edge. This construction allows for enhanced performance and longer blade life.
These blades offer a range of advantages:
⦁ Longer lifespan
⦁ Enhanced stability and rigidity
⦁ Consistent cutting performance
⦁ Better heat resistance
⦁ Ideal for sectioning hard and brittle materials
⦁ Reduced blade flex
⦁ Thinner kerf thickness than steel core blades
A SMART CUT™ blade may last as long as 3 to 4 standard steel core blades combined due to its fully sintered diamond composition.
They’re perfect for sectioning a wide range of materials, including fragile crystals, ultra-hard ceramics, brittle materials, teeth, bones, composites, metals, and much more
Yes! Discounts are available when purchasing in larger quantities. For example, the price per blade decreases when buying two or three at a time.
Kerf thickness refers to the width of the cut a blade makes. A thinner kerf means less material is removed, which can be crucial for precision cuts or when working with expensive materials.
Yes, the blades come in different abrasive types like Diamond (Fine or Medium) and CBN (Medium). The grit size determines the coarseness of the blade, affecting the finish and speed of the cut.
Absolutely! Since the blade is fully sintered, you can use it until the entire Outside Diameter of the blade is consumed.
CBN stands for Cubic Boron Nitride, a synthetic abrasive second only to diamond in terms of hardness. It’s particularly effective for cutting metals.
“Fully sintered” means that the blade is manufactured in a way where the diamonds are impregnated throughout the entire matrix of the blade, from the outside diameter (OD) to the inside diameter (ID), as opposed to just on the edge.
The unique construction of SMART CUT™ blades provides more rigidity, reducing friction during cutting, which, in turn, minimizes heat generation. This ensures the material being cut doesn’t get damaged due to excessive heat.
Due to their fully sintered design, the blades continuously expose new diamond grits as they wear, maintaining their sharpness. Therefore, there’s typically no need for external sharpening.
The arbor size refers to the diameter of the hole in the center of the blade. It’s essential to match the arbor size of the blade with the spindle of your cutting equipment to ensure compatibility and secure fitting.
Always follow standard safety procedures when using wafering blades. This includes wearing appropriate protective gear, such as safety glasses, gloves, and ensuring the equipment is in good working condition. Also, avoid forcing the blade through the material, which can lead to blade damage or breakage.
Store the blades in a cool, dry place away from direct sunlight. It’s recommended to keep them in their original packaging to protect them from dust and potential damage.
The choice of blade depends on the material you are cutting, the required precision, and the desired finish.
Yes, SMART CUT™ blades can cut metals, especially when using the CBN (Cubic Boron Nitride) variant, which is well-suited for cutting hard metals.
Regularly inspect the blade for wear or damage. Clean it after use to remove any debris and avoid storing it in locations where it could be exposed to corrosive elements. Proper maintenance ensures optimal performance and longevity.
Due to their thin kerf and uniform diamond distribution, SMART CUT™ blades provide precise cuts, making them ideal for delicate samples where minimal material loss is crucial.
While SMART CUT™ blades provide clean and precise cuts, achieving a mirror finish may require further polishing or finishing processes depending on the material.
The fully sintered design of SMART CUT™ blades offers enhanced rigidity, reducing the risk of warping, especially when compared to blades with steel cores.
Yes, SMART CUT™ blades are versatile and can be used on multi-material samples. However, it’s essential to consider the hardness and properties of each material to ensure the best results.
The listed sizes are the most we keep in stock. We can manufacture almost any blade specification, diameter, inside diameter, kerf thickness grit size or abrasive type
Since the blade is fully sintered with diamonds from the OD to ID, the lifespan is typically longer than standard blades. The blade can be used until its entire Outside Diameter is consumed. Regular inspection will help gauge its remaining life.
The blades are designed for durability and longevity, reducing the need for frequent replacements.
While many blades benefit from a break-in period to ensure even diamond exposure, the fully sintered design of SMART CUT™ blades typically means they’re ready to perform optimally right out of the box.
The ideal cutting speed can vary based on the material being cut and the specific blade type. These blades can be used on both low and high speed saws. Minimum recommended rpm’s is 100 and max rpm’s 12,500. Optimal rpm’s will be based on material properties, shape, and preferred cut quality and surface finish.
Thanks to the fully sintered design, as the blade wears, new diamond particles get exposed, ensuring consistent cutting performance throughout its life.
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Image | Name | COMPATIBILITY WITH DRILL SERIES | Price | Quantity | Add to cart |
|---|---|---|---|---|---|
 | Recommended for use in Diamond Tools 150 Grit Size (mesh… | $15.39 | Max: Min: 1 Step: 1 | ||
 | Recommended for coarser grits found in segment wheels, core drills… | $15.99 | Max: Min: 1 Step: 1 | ||
 | SMART CUT® General Materials Formula Synthetic Water Soluble Coolant | $34.81 | Max: Min: 1 Step: 1 | ||
| Recommended for use in Diamond Tools 150 Grit Size (mesh… | $39.47 | Max: Min: 1 Step: 1 | ||
| Recommended for coarser grits found in segment wheels, core drills… | $39.47 | Max: Min: 1 Step: 1 | ||
 | SMART CUT® General Materials Formula Synthetic Water Soluble Coolant | $99.81 | Max: Min: 1 Step: 1 | ||
 | SMART CUT® General Materials Formula Synthetic Water Soluble Coolant | $317.41 | Max: Min: 1 Step: 1 | ||
 | SMART CUT® General Materials Formula Synthetic Water Soluble Coolant | $1,745.00 | Max: Min: 1 Step: 1 |
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Image | Item No | Outside Diameter | Kerf Thickness | Arbor Size / Inside Diameter | Abrasive Type / Grit Size | Price | Quantity | Add to cart |
|---|---|---|---|---|---|---|---|---|
 | 3" (76.2mm) | .006" (0.15mm) | 1/2" (12.7mm) | Diamond / Fine | $165.00 2 pcs - $160.00 ea ⋅ 3 pcs - $155.00 ea | Max: Min: 1 Step: 1 | ||
| 3" (76.2mm) | .006" (0.15mm) | 1/2" (12.7mm) | Diamond / Fine | $165.00 2 pcs - $160.00 ea ⋅ 3 pcs - $155.00 ea | Max: Min: 1 Step: 1 | ||
| 3" (76.2mm) | .004” (0.10mm) | 1/2" (12.7mm) | Diamond / Fine | $185.00 2 pcs - $160.00 ea ⋅ 3 pcs - $155.00 ea | Max: Min: 1 Step: 1 | ||
| 3" (76.2mm) | .006" (0.15mm) | 1/2" (12.7mm) | CBN / Medium | $185.00 2 pcs - $180.00 ea ⋅ 3 pcs - $175.00 ea | Max: Min: 1 Step: 1 | ||
| 3" (76.2mm) | .006" (0.15mm) | 5/8” (15.87mm) | Diamond / Fine | $185.00 2 pcs - $180.00 ea ⋅ 3 pcs - $175.00 ea | Max: Min: 1 Step: 1 | ||
| 4" (101.6mm) | .006" (0.15mm) | 1/2" (12.7mm) | Diamond / Medium | $185.00 2 pcs - $180.00 ea ⋅ 3 pcs - $175.00 ea | Max: Min: 1 Step: 1 | ||
| 4" (101.6mm) | .008” (0.20mm) | 1/2" (12.7mm) | Diamond / Medium | $185.00 2 pcs - $180.00 ea ⋅ 3 pcs - $175.00 ea | Max: Min: 1 Step: 1 | ||
| 4" (101.6mm) | .010” (0.25mm) | 1/2" (12.7mm) | Diamond / Medium | $185.00 2 pcs - $180.00 ea ⋅ 3 pcs - $175.00 ea | Max: Min: 1 Step: 1 | ||
| 4" (101.6mm) | .013" (0.33mm) | 1/2" (12.7mm) | Diamond / Fine | $185.00 2 pcs - $180.00 ea ⋅ 3 pcs - $175.00 ea | Max: Min: 1 Step: 1 |
Sintered (Metal Bond) diamond tools have multiple layers of diamonds impregnated inside the metal matrix. Diamonds are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. Metal bonded diamond tools are “impregnated” with diamonds. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any materials such as sapphire, advanced ceramics, optics, glass, granite, tile and etc. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting. Sintered (metal bonded) diamond tools are recommended for machining hard materials from 45 to 75 on rockwell scale (5 to 9.5 on mohe’s scale of hardness).
Diamond & CBN tools with SMART CUT® technology require minimum dressing, the bond renews itself.
Diamond drills made utilizing SMART CUT® technology are much more aggressive than your conventional drills. They can drill faster, while still leaving behind a smooth finish free of material deformation.
Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.
SMART CUT® Multi Layered Electroplated Diamond Drills are the best investment you can make! Although they may cost more than electroplated (nickel bond), Diamond Drills. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.
In most cases tools manufactured utilizing SMART CUT® technology, will outlast other conventional nickel bonded diamond & CBN drills. SMART CUT® diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.
SMART CUT® Multi Layered Electroplated Diamond Drills have three diamond layers impregnated inside the bond matrix. Unlike Many Other drill Types, they wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing even on the hardest to cut materials
The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT® Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.
Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.
This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.
Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning. For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.
The thickness of diamond and CBN (Cubic Boron Nitride) grinding wheels varies widely to suit different applications and material processing needs. For precision grinding tasks, wheels are typically thinner, ranging from about 0.5 mm to 10 mm, allowing for meticulous and detailed material removal. Cut-off wheels, used primarily for slicing through materials, tend to be even thinner, with thicknesses from 0.1 mm to 3 mm to facilitate precise cuts. Conversely, surface and tool grinding wheels, which are used for more extensive surface grinding, generally have thicknesses from 3 mm to 40 mm. For heavy-duty grinding operations involving large workpieces or substantial material removal, wheel thickness can be significantly greater, often from 10 mm up to 100 mm or more.
The thickness of a diamond or CBN grinding wheel directly impacts its grinding performance. Thicker wheels facilitate higher material removal rates, making them suitable for heavy-duty grinding tasks but tend to generate more heat and require more power. Thinner wheels excel in precision grinding tasks due to their ability to produce finer finishes and more detailed work. They also dissipate heat more effectively, minimizing thermal damage to both the wheel and the workpiece.
Stability increases with wheel thickness; thicker wheels resist bending under pressure, thereby enhancing their lifespan and ensuring consistent performance. However, they may require multiple dressings over their lifespan to maintain effectiveness. Thinner wheels, while more flexible for precision work, wear out quicker as they contain less material for dressing.
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Load/Feed Rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.
The RPM (Revolutions Per Minute) of diamond and CBN grinding wheels plays a key role in determining grinding performance. Harder materials like ceramics and hardened steel typically require lower RPMs to prevent overheating and excessive wear, while softer materials can be ground at higher RPMs. Larger wheels, due to their size, should run at lower speeds compared to smaller wheels, which can handle higher RPMs.
For fine precision and smooth surface finishes, lower RPMs are ideal, providing better control and reducing the risk of surface damage. Higher RPMs can be used for faster material removal but require careful attention to heat generation and wheel wear. Excessive RPMs can cause overheating, damaging both the wheel and the workpiece, particularly with heat-sensitive materials.
In general, diamond and CBN wheels operate effectively within a range of 3,000 to 6,000 RPM, depending on the material and wheel size. Adhering to optimal RPMs ensures efficient grinding, longer wheel life, and better overall results.
In diamond and CBN grinding wheels, the particle or grit size profoundly influences several aspects of the wheel's performance. Coarser grits enable faster material removal rates due to their aggressive cutting action, which is beneficial for increasing productivity in scenarios where high grinding speeds are necessary. Conversely, finer grit sizes produce a smoother finish, as the smaller particles make less aggressive cuts, reducing surface roughness. This is crucial for applications that demand a high-quality finish.
The amount of chipping during grinding is also impacted by the grit size. Finer grits typically result in less chipping, making them suitable for grinding brittle materials or when precise, clean edges are essential. However, coarser grits might cause more significant damage to the material’s microstructure because of their aggressive nature, which could be problematic in precision engineering applications where the integrity of the material is critical.
Selecting the appropriate grit size is vital for optimizing both the material removal rates and the quality of the finished surfaces. Coarse grits are preferred for rapid material removal when finish quality is less critical, while finer grits are ideal for achieving high-quality finishes and minimizing damage, particularly in delicate or precise grinding tasks.
Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness. Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.
Typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades.
Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.
Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning. For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.
Typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades.
Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness. Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.
Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.
Load/Feed Rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.
Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.
We produce diamond consumables for some of the leading world OEM manufacturers. We offer Manufacturers Direct Prices
We have the largest variety of diamond & cbn wafering blades available in stock. As well as large inventory of diamond & abrasive consumables. We also custom manufacture diamond and cbn tools, consumables and machines to better fit customer specific needs. Just about any tools & consumables can be designed and manufactured per client drawing or specificrtion
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UKAM Industrial Superhard Tools is a U.S. High Technology, Specialty Diamond Tool & Equipment manufacturer. We specialize in producing ultra thin & high precision cutting blades and precision cutting machines diamond drills, diamond micro tools, standard & custom advanced industrial diamond tools and consumables.
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