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SMART CUT® Series 3000R

Resin Bond Diamond Cut off blades (Fine Size Diamond) for use on manual tile saws

SMART CUT®  Series 3000R Resin Bond Diamond Cut Off Blades are Finer Diamond Grit Size, and Slightly Higher Diamond Content then the SMART CUT Series 3000 blades. They are used for cutting very thin wall tubing, more fragile material, that need best surface finish possible to achieve. Cutting speed would be slower then the 3000 series.

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Resin Bond Diamond Cut off blades/wheels
7" (177.8mm)
.050" (1.27mm)
5/8" (15.875mm)
we can change the arbor to anything you want same day
Min: 1
Step: 1
Resin Bond Diamond Cut off blades/wheels
8” (203mm)
.050" (1.27mm)
5/8" (15.875mm)
we can change the arbor to anything you want same day
Min: 1
Step: 1
Resin Bond Diamond Cut off blades/wheels
10" (254mm)
.050" (1.27mm)
5/8" (15.875mm)
we can change the arbor to anything you want same day
Min: 1
Step: 1
Resin Bond Diamond Cut off blades/wheels
12" (304.8mm)
.065" (1.65mm)
5/8" (15.87mm)
we can change the arbor to anything you want same day
Min: 1
Step: 1
Resin Bond Diamond Cut off blades/wheels
14" (355.6mm)
.065" (1.65mm)
3/4" (19.05mm)
we can change the arbor to anything you want same day
Min: 1
Step: 1
Resin Bond Diamond Cut off blades/wheels
16" (406.4mm)
.095" (2.41mm)
1" (25.4mm)
we can change the arbor to anything you want same day
Min: 1
Step: 1

Why Use Resin Bond Diamond Cutting blades?

Resin bond diamond wafering blades offer superior cut quality than any type diamond wafering blade available. Recommended for applications where cut quality and surface finish is very important.

Compared to their sintered (metal bond) wafering blade counterparts. Resin Bond Diamond & CBN Wafering blades offer far superior cut quality than the finest size metal bond (sintered) bade. Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finish is desired. Must be used at higher speeds.

Produced using phenolic resin as the binder, diamond abrasive as cutting media, ceramic & other advanced components as fillerUKAM Industrial Resin Bond CBN Wafering Blades are manufactured with advanced molding process. Available in a large variety of geometries, diamond sizes, diamond concentrations, and bond harnesses.

SMART CUT® Precision Diamond & CBN Wafering Blades

Are designed and specially selected to provide the maximum possible blade life for your desired cut quality, and speed.



Characteristics of Resin Bond Diamond Wafering blades

Resin Bond is the softest of all the bonds, frequently used in applications that require a smooth surface. that is formed by high pressure and high temperature. This type of wafering blades is used on majority of ultra hard and tough metals. Resin bond wafering blades allow the bond matrix to wear faster, and allow for diamond particles/crystals to break out of their matrix faster, so that new sharp diamond particles become exposed. This self sharpening characteristic of resin bond wafering blades, based on faster bond wear out is what make this blade an excellent choice for large variety of ferrous metals.

How We Are Different?

UKAM Industrial SMART CUT™ Resin series New Generation & Technology Diamond & CBN cutting blades are manufactured with advanced molding process. Using phenolic resin as the binder, diamond abrasive as cutting media, ceramic & other advanced components as filler. Available in a large variety of geometries, diamond sizes, diamond concentrations, and bond harnesses.

No Glazing

Diamond & CBN tools with SMART CUT  technology require minimum dressing, the bond renews itself.

Faster Drilling Action

Diamond & CBN tools made utilizing SMART CUT  technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Best Performance & Value on the Market

SMART CUT  Resin Bond, CBN Blades are the best investment you can make! While the initial investment in CBN Blades may be higher than traditional abrasive wheels, their long lifespan and efficiency often result in a lower cost per cut. This can provide to significant saving in time and money.

Longer Life

In most cases tools manufactured utilizing SMART CUT  technology, will outlast other conventional  Sintered (Metal Bond) diamond & CBN drills. SMART CUT diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

More Consistent Performance

SMART CUT  Resin Bond, CBN Blades have hundreds of diamond layers impregnated inside the Resin Bond matrix. Unlike Many Other drill Types, they wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing even on the hardest to cut materials

Its what you cant see that makes all the Difference

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT® Resin Bond Works?

The sharpest and finest quality diamonds or CBN crystals that go into a SMART CUT® Diamond Resin Bond, immediately penetrate into the material, grinding and polishing as they cut.

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Diamond Resin Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

The newly exposed diamonds don't effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT® Resin Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

Diamond Wafering Blade
Selection Variables

Diamond Concentration : 

Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.
Low Diamond Concentration - Typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.
High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond Particle/Grit size -  

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain.  Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended. 

Blade Thickness :

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness  typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning. For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.

Blade Outside Diameter :

Typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades.

Bond Hardness :

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness. Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Bond Type :

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Feed Rates :

Load/Feed Rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Blade Speeds/RPM’s :

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

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