Diamond Tools, Dicing Blades, & Consumables for Semiconductor & Microelectronics Industry
Diamond & CBN
Dicing Blades SMART CUT ® technology
Dicing Blades from 0.5" (12.7mm) to 6" (154mm) in Diameter, starting from .001" (25 microns) Thick For all applications and all types of Dicing & Slicing machines
When it comes to dicing, there is only one company that stands out. UKAM Industrial Superhard Tools is a one of the leading precision U.S. diamond dicing blade & tool manufacturers. As the first company to develop SMART CUT™ technology, UKAM Industrial is a Partner in Your Success. We have the Experience, Tradition, and the People to improve & optimize your dicing operation. Contact us for Free Quote & application recommendation today!
Metal Bond (Sintered) Dicing Blades
Excellent form holding & corner characteristics, provide very long life, high level of consistency. Recommended for users requiring very straight cuts and larger blade exposures.
Hybrid Bond™ Dicing Blades
You will find all the advantages of cutting speed and fine finish that you have come to expect in a resin bond, and long life, consistency, aggressiveness, durability, and excellent performance on you look for in a metal bond.
Nickel Bond (Hubless) Dicing Blades
Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.
Resin Dicing Blades
More forgiving, self dressing, and freer cutting. Excellent choice for Ultra Hard & Brittle Materials. Recommended for applications where cut quality and surface finish is very important.
Nickel Bond (Hubbed) Dicing Blades
Typically used for dicing silicon and III-V materials. Creates very thin kerfs, 50 microns. Providing excellent cut quality with low wear rate
Carbide Dicing Blades
Slitting magnetic tape for computer backup applications, metal foils, P.E.T., polyester, sheet rubber, fine gauge steel, film, abrasive paper products, PC Board substrates, fiberglass, laminates, MLP/QFN
Diamond Tool Accessories
we offer large variety of accessories and consumables for our tools and equipment including: coolants, dressing sticks, flanges, wheel stiffeners...
Precision Abrasives
Larger variety of precision abrasives for sample & surface preparation. Abrasive Cut Off Blades, Discs, Rolls, Belts, Wheels, Film, Powders...
Diamond Tools For Concrete & Construction
High quality standard and custom tools for contractors. Our tools provide higher level of performance compared to what is typically...
Diamond Dressers
Dressing Tools for For truing and dressing of conventional abrasive grinding wheels. Single point, multi point, chisel shape, straight, angle...
Ultra Thin, High Precision & Micro Carbide Tools
Tungsten carbide micro drills, micro tools and ultra thin & high precision cutting blades from stock and custom manufactured to...
Diamond Rotary Dressers
Diamond rollers are used to form grinding wheels for many different kinds of mass production. Shorter dressing time and long...
Precision Machining Services
We offer large variety of of services including: Dicing, Slicing, Sectioning, Drilling, Coring, Micro Drilling, Grinding, Polishing, & Machining...
Process Development
Experienced Engineers and Application Laboratory, Equipped with some of the latest Slicing, Dicing, Wafering, Drilling, & Micro Drilling Equipment is...
Precision Cutting Saws
Precision Cutting Machines for Laboratory & Industry. Used in Research and Development, Quality Control, Failure Analysis, Materials Research, & Industrial...
For Semiconductor
Other Diamond Tools & Products
Table Top Slicing & Dicing Saw
Designed for Laboratory and R & D use. This machine can be used for slicing, dicing or cutting all kinds
Diamond Backgrinding Wheels
Diamond backgrinding wheels are used for thinning and polishing semiconductor wafers. These wheels are designed to remove excess material from
Diamond Micro Drills
Micro Diamond Drills are available from .001" to .0035" in diameter (25 microns and up).Provide most precision drilling performance on
Diamond, PCD, and CVD diamond Micro Tools
We offer large variety of standard stock & custom diamond micro tools 0.05mm diameter to 6mm and various heald lengths
Inside Diameter Cutting Blades
ID blades (inside diameter) diamond cutting plates are nickel bond product with diamond coating on the internal edge. Internal diameter
Diamond Wire
Diamond wire blades made to order from 0.12mm TO 0.42mm diameter available for any spool for just about any wire
Ultra Thin & High Precision Diamond Blades
Outside Diameter diamond & cbn cutting blades for Slicing, Wafering, Cut-off, Singulation, Grooving, Slotting, Cross Sectioning, Gang Sawing, Slabbing, Rough
Diamond Drills & Accessories
Diamond Drills are available from inventory in many different specifications, outside & inside diameters, drilling depths, bond types, diamond mesh
Custom Diamond Tool Manufacturing
Thousands of diamond tools are available from stock for immediate delivery. Just about any diamond tool can be designed and
Diamond Band Saw Blades
Diamond band Saw Blades made to order to your specifications, available in any length width from 250 (6.4mm).
Diamond Grinding Wheels
Diamond Wheels are available in stock, available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond
Diamond Consumables
Diamond Suspensions - Polycrystalline, Monocrystalline, & Natural Read More
Dicing
Accessories & Consumables
SMART CUT® Dicing Coolant (Water Soluble)
SMART CUT Synthetic Water Soluble coolant (fully contamination free) will reduce heat & friction between dicing blade and material. And improve
Dicing Service & Process Development
On all types of Metallic Materials, Ceramics, Optics, Substrates & Wafers. Typical Dimensions of material we work with: Maximum Size of
Dressing Sticks
We offer large range of dressing stick specifications in wide range of sizes and shapes for most dicing blade applications.
Nickel Bond Hubless
Dicing Blade Applications
- Green Ceramic
- Optical Glass
- PCB
- Silicon
- Optical Fiber Ferrule
- AlTic
- Metal Oxide
Dicing Blade Characteristics
Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.
Dicing Blade Bonds
- EZC I
- EZC II
- EZC III
Abrasive (Diamond/CBN) Sizes
- 3 to 70 micron
Abrasive (Diamond/CBN) Types
Natural & Synthetic Diamond
Abrasive Concentration
- 100 to 250 con
Minimum Dicing Blade Thickness
- .0003" (0.0076mm)
How To Select The Right Diamond Dicing Blade
For Your Application
Dicing Blade Bond Types
Resin
Sintered
(Metal Bond)
Hybrid
BondTM
Nickel Bond (Hubless)
Nickel Bond (Hubbed)
Bond Illustration
Sem Image
Description:
Organic bond matrix that is formed by high pressure and high temperature
Metallurgical Bond with multiple ayers of diamonds impregnated inside the metal matrix.
Organic bond matrix that is formed by high pressure and high temperature
Halvanic process, where diamond is deposited on steel body in chemical solution by time.
Galvanic process, where diamond is deposited on steel body in chemical solution by time.
Dicing Blade Applications
-
Alumina
-
Barium Titanate
-
Garenet
-
Glass & Quartz
-
Ferrite
-
LiNb03
-
Silicon
-
Fused Silica
-
Electronic Ceramics
-
Sapphire
-
FR4/BT Resin
-
Alumina
-
Glass
-
Copper & PCB
-
AITIC
-
Green Ceramic
-
Plastic Laminates
-
Zirconia
-
Rare Earth Magnets
-
Fired Multi Layered Ceramics
-
BGA Packages
-
QFN
-
Aluminum oxide (A1203)
-
Silicon nitride (Si3N4)
-
Silicon carbide (SiC)
-
Sapphire Boron Carbide (B4C)
-
Alsmag
-
LiTaO3 & LiNbo
-
FR4 and Resin
-
Green Ceramic
-
Silicon
-
AlTic
-
Optical Glass
-
Optical Fiber Ferrule
-
Metal Oxide
-
PCB
-
Silicon
-
GaAs
-
Sapphire
-
SIC
Dicing Blade Characteristics
Resin Bond dicing blade are typically more forgiving. self dressing, and freer cutting. Excellent choice for Ultra Hard & Brittle Materials. Recommended for applications where cut quality and surface finish is very important.
Sintered (metal bond) Dicing blades have excellent form holding & corner characteristics, provide very long life, high level of consistency. Recommended for users requiring very straight cuts and larger blade
exposures.
You will find all the advantages of cutting speed and fine finish that you have come to expect in a resin bond, and long life, consistency, aggressiveness, durability, and excellent performance on you look for in a metal bond.
Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.
Nickel Bond Hubbed dicing blades are typically used for dicing silicon and III-V materials. Creates very thin kerfs, <50 microns. Providing excellent cut quality with low wear rate
Adventages
-
Self Dressing
-
Freer Cutting
-
Cuts almost any material
-
Clan cuts on hard and brittle material
-
Any blade thickness is available .003" and up
-
Minimum dressing required
-
Wide variety of bond matrixes and specifications available
-
Lower Cost
-
Longer Life
-
Minimized blade wear
-
high cutting ability
-
Improved blade rigidity
-
Highly accurate blade dimensions
-
Minimal Chipping of Critical Edges
-
Large Variety of Bond Matrixes for all Applications
-
Maximum Cutting Performance
-
No Glazing
-
Faster Cutting Action
-
Improved Surface Finish Better Coolant Retention
-
No Material Deromration
-
No Contamination
-
Very low blade wear
-
Maintains good edge geometry
-
Excellent on applications requiring high accuracy
-
Ultra thin blade thickness are available such .0006" (0.018mm)
-
Very low blade wear
-
Maintains good edge geometry
-
Excellent on applications requiring high accuracy
-
Ultra thin blade thickness are available such .0006" (0.018mm)
Dicing Blade Bonds
-
SC1R
-
SC2R
-
SC3R
-
SC4R
-
SC5R
-
SC6R
-
SC7R
-
SC1M
-
SC2M
-
SC3M
-
SC4M
-
SC5M
-
SC6M
-
SC7M
-
SC1H
-
SC2H
-
SC3H
-
SC4H
-
SC5H
-
SC6H
-
SC7H
-
EZC I
-
EZC II
-
EZC III
-
SNBI
-
SNBII
-
SNBIII
Abrasive (Diamond/CBN) Sizes
3 to 151 micron
3 to 126 micron
3 to 151 micron
3 to 70 micron
2 to 50 micron
Abrasive (Diamond/CBN) Types
Coated & Uncoated Synthetic Diamond or CBN
Natural Diamond, Coated &
Uncoated Synthetic Diamond or CBN
Coated & Uncoated Synthetic Diamond or CBN
Natural & Synthetic Diamond
Natural & Synthetic Diamond
Type of Diamond/CBN Used:
High friability, excellent microfracturing
Cubo-octahedral crystals, semi crystaline crystals
High friability, excellent microfracturing
Medium tough
Medium tough
Example of diamond Crystal Used:
Abrasive Concentration
25 to 200 con
25 to 200 con
25 to 200 con
100 to 250 con
100 to 250 con
Minimum Dicing Blade Thickness
.003" (.076mm)
.004" (0.101mm)
.004" (0.101mm)
0003" (0.0076mm)
.0003" (0.0076mm)
SMART CUT® Precision Diamond Dicing Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed
- Dicing blade OD : 0.5 in. to 8.0 in. (12 mm to 200 mm))
- Dicing blade thickness : As thin as 0.003 in. (0.076 mm)
- Diamond & CBN Abrasive Sizes : 3 to 151 micron
- Diamond/CBN Abrasive Concentration : 25 to 200 con
- Abrasive (Diamond/CBN) Types : Natural Diamond, Coated & Uncoated Synthetic Diamond or CBN
- Blade Types : 1A1, 1A8, 1A8S, 1E8, 1A1R & others
- Slots: we can grand any slot number depth and spacing
- Bond Hardness: Super Soft to Super Hard
- Accessories: coolants, dressing plates, and flanges
UKAM Industrial Superhard Tools has over 50 years of experience in Manufacturing, Research & Development of Ultra Thin & High Precision Diamond Dicing Blades for many Industries/Applications. We are a “Partner in Your Success”.
Equipment Used On:
- K & S (Micro-Swiss)
- Disco
- ADT
- Veeco
- MECO
- MTI
- ITI
- Meyer & Burger
- Surface Grinders
- Many Others
We Can Help You:
- Eliminate / Minimize Chipping
- Improve Surface Finish Quality
- Preserve True Material Microstructure
- Reduce & eliminate Material Deformation
- Increase Blade Life
- Improve dicing Process Consistency
- Improve Productivity
- Maintain Consistent Cutting Speed
- Reduce Blade Change & Mounting Cost
- Reduce Cost
- Reduce Chipping
- Reduce Blade Wear
- Increase Process Consistency
- Increase Production Rate
- Improve Part Geometry & Tolerances
ITS WHAT YOU CANT SEE THAT MAKES ALL THE DIFFERENCE
SMART CUT® technology
How SMART CUT ® Bond Works?
Sharpest And Finest Quality Diamonds
The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ® Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.
Diamonds or CBN Crystals
Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.
Advanced Formulated Open Diamond Bond Design
This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.
ARE YOU USING RIGHT TOOLS
FOR YOUR APPLICATION?
LET US
HELP YOU
HAVING ISSUES WITH
YOUR CURRENT TOOLS?
What you should know
your next diamond tool?
How to Selecting Right Diamond Tools for your application
How to properly use Diamond Tools
Why use diamond
Diamond vs CBN (cubic boron nitride) Tools
What is Diamond Mesh Size and how to select best one for your application
What is Diamond Concentration and which to use for your application
Diamond Tool Coolants Why, How, When & Where to Use
