Diamond Smart Cut

UKAM Industrial Superhard Tools

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SMART CUT® DIAMOND WAFERING BLADES SINTERED (METAL BOND)

SMART CUT® Precision Diamond & CBN Wafering Blades are designed and specially selected to provide the maximum possible blade life for your desired cut quality, and speed.

Compare to any other brand name Diamond Wafering Blades such as:

BUEHLER, STRUERS, LECO & Many Others

COMPARABLE QUALITY – SIGNIFICANTLY LOWER 

(Manufacturers Direct Prices)

Series 30HCU

for soft & gummy materials. Use with plastics, polymers, rubber & etc.

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CBN WAFERING BLADES SINTERED
Item No:23-4870ME (3053001)
Diameter:
5"(127mm)
Thickness:
.030"(0.76mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4239
Buehler no:
Leco No:
Price:
$184.00
CBN WAFERING BLADES SINTERED
Item No:23-4872ME (3083204)
Diameter:
8"(203mm)
Thickness:
.035"(0.9mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4242
Buehler no:
Leco No:
Price:
$214.00
CBN WAFERING BLADES SINTERED
Item No:23-4871ME (3073002)
Diameter:
7"(178mm)
Thickness:
.030"(0.76mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4241
Buehler no:
Leco No:
Price:
$214.00

Series 20HCU

for aggressive general sectioning of metals (ferrous and non ferrous materials including titanium alloys).

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CBN WAFERING BLADES SINTERED
Item No:23-4873ME (3052008)
Diameter:
5"(127mm)
Thickness:
.020"(0.5mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4215
Struers No:
331CA
357CA
456CA
Leco No:
Price:
$184.00
CBN WAFERING BLADES SINTERED
Item No:23-4874ME (3062014)
Diameter:
6"(152mm)
Thickness:
.020"(0.5mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
Struers No:
356CA
370CA
457CA
459CA
45UCA
Leco No:
Price:
$194.00
CBN WAFERING BLADES SINTERED
Item No:23-4875ME (3072510)
Diameter:
7"(178mm)
Thickness:
.025"(0.6mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4237
Struers No:
Leco No:
Price:
$214.00
CBN WAFERING BLADES SINTERED
Item No:23-4876ME (3083220)
Diameter:
8"(203mm)
Thickness:
.025"(0.6mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4238
Struers No:
655CA
657CA
659CA
Leco No:
Price:
$214.00

Series 15HCU

For general use with ferrous and non ferrous alloys, copper, aluminum, metal matrix, composites, PC boards, thermal spray coatings, and titanium alloys

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CBN WAFERING BLADES SINTERED
Item No:23-4877ME (3031204)
Diameter:
3"(76mm)
Thickness:
.015"(0.35mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
STRUERS NO:
100CA
LECO NO:
Price:
$159.00
CBN WAFERING BLADES SINTERED
Item No:23-4878ME (3041201)
Diameter:
4"(101.1mm )
Thickness:
.012" (0.3mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
11-4244
STRUERS NO:
230CA
40000043
M0D10
LECO NO:
Price:
$159.00
CBN WAFERING BLADES SINTERED
Item No:23-5159ME (3030605)
Diameter:
3"(76mm)
Thickness:
.006"(0.15mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
11-10066
11-4243
STRUERS NO:
121CA
40000041
M0D08
LECO NO:
Price:
$165.00
CBN WAFERING BLADES SINTERED
Item No:23-4879ME (3051502)
Diameter:
5"(127mm)
Thickness:
.015"(0.4mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
11-4245
STRUERS NO:
330CA
355CA
357CA
40000038
M0D13
LECO NO:
Price:
$184.00
CBN WAFERING BLADES SINTERED
Item No:23-4880ME (3062006)
Diameter:
6" (152mm)
Thickness:
.020" (0.5mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
11-4246
STRUERS NO:
4000054
430CA
459CA
M0D15
LECO NO:
Price:
$194.00
CBN WAFERING BLADES SINTERED
Item No:23-4881ME (3072501)
Diameter:
7" (178mm)
Thickness:
.025" (0.6mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
11-4247
STRUERS NO:
40000046
M4D18
LECO NO:
Price:
$214.00
CBN WAFERING BLADES SINTERED
Item No:23-4882ME (3083202)
Diameter:
8"(203mm)
Thickness:
.035"(0.9mm)
Arbor Size:
1/2"(12.7mm)
BUEHLER NO:
11-4248
STRUERS NO:
40000084
657CA
M020
LECO NO:
Price:
$214.00

Series 20LCU

for use with hard/tough materials structural ceramics, boron carbide, boron nitride, and silicon carbides

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CBN WAFERING BLADES SINTERED
Item No:23-4883ME (3041207)
Diameter:
4"(101.1mm)
Thickness:
.012"(0.3mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
Struers No:
452CA
Leco No:
Price:
$159.00
CBN WAFERING BLADES SINTERED
Item No:23-4884ME (3052010)
Diameter:
5" (127mm)
Thickness:
.020" (0.5mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4225
Struers No:
352CA
Leco No:
Price:
$184.00
CBN WAFERING BLADES SINTERED
Item No:23-4885ME (3072509)
Diameter:
7"(178mm)
Thickness:
.025"(0.6mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4227
Struers No:
Leco No:
Price:
$214.00
CBN WAFERING BLADES SINTERED
Item No:23-4886ME (3083218)
Diameter:
8"(203mm)
Thickness:
.035"(0.9mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4228
Struers No:
652CA
Leco No:
Price:
$214.00

Series 15LCU

for use with hard / brittle materials such as Glass, Al203, Zr203, Concrete, & many others

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CBN WAFERING BLADES SINTERED
Item No:23-4887ME (3031001)
Diameter:
3"(76mm)
Thickness:
.015"(0.35mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
Struers No:
100CA
Leco No:
Price:
$159.00
CBN WAFERING BLADES SINTERED
Item No:23-4888ME (3041202)
Diameter:
4"(101.1mm)
Thickness:
.012"(0.3mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4254
Struers No:
230CA
40000070
M1D10
Leco No:
801-137
Price:
$159.00
CBN WAFERING BLADES SINTERED
Item No:24-4887ME (3030606)
Diameter:
3"(76mm)
Thickness:
.006"(0.15mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-10067
Struers No:
40000069
M1D08
Leco No:
Price:
$165.00
CBN WAFERING BLADES SINTERED
Item No:23-4889ME (3051504)
Diameter:
5"(127mm)
Thickness:
.015"(0.4mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4255
Struers No:
330CA
40000071
M1D13
Leco No:
802-439
Price:
$184.00
CBN WAFERING BLADES SINTERED
Item No:23-4890ME (3062011)
Diameter:
6"(152mm)
Thickness:
.020"(0.5mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4276
Struers No:
40000068
430CA
M1D15
Leco No:
Price:
$194.00
CBN WAFERING BLADES SINTERED
Item No:23-4891ME (3072502)
Diameter:
7"(178mm)
Thickness:
.025"(0.6mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4277
Struers No:
Leco No:
Price:
$214.00
CBN WAFERING BLADES SINTERED
Item No:23-4892ME (3083219)
Diameter:
8" (203mm)
Thickness:
.035" (0.9mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4279
Struers No:
40000072
M1D20
Leco No:
Price:
$214.00

Series 10LCU

for use with medium to soft ceramics, electronic packages, unmounted in targeted circuits, GaAs, AIN and glass fiber reinforced composites

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CBN WAFERING BLADES SINTERED
Item No:23-4891ME (3031201)
Diameter:
3"(76mm)
Thickness:
.015"(0.35mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
Struers No:
Leco No:
Price:
$159.00
CBN WAFERING BLADES SINTERED
Item No:23-5160ME (3030604)
Diameter:
3"(76mm)
Thickness:
.006"(0.15mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-10068
11-4283
Struers No:
Leco No:
Price:
$165.00
CBN WAFERING BLADES SINTERED
Item No:23-4892ME (3051506)
Diameter:
5"(127mm)
Thickness:
.015"(0.4mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4285
Struers No:
Leco No:
Price:
$184.00
CBN WAFERING BLADES SINTERED
Item No:23-4893ME (3072503)
Diameter:
7"(178mm)
Thickness:
.025"(0.6mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4287
Struers No:
Leco No:
Price:
$214.00
CBN WAFERING BLADES SINTERED
Item No:23-4894ME (3083217)
Diameter:
8" (203mm)
Thickness:
.035" (0.9mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4288
Struers No:
Leco No:
Price:
$214.00

Series 5LCU

for use with softfriable ceramics, electronic packages, unmounted integrated circuits, composites with fine reinforcing media, CaF2, MgF2, and carbon composites

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CBN WAFERING BLADES SINTERED
Item No:24-4895ME (3030608)
Diameter:
3"(76mm)
Thickness:
.006"(0.15mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4288
11-4298
Struers No:
Leco No:
Price:
$165.00
CBN WAFERING BLADES SINTERED
Item No:23-4896ME (3051507)
Diameter:
5"(127mm)
Thickness:
.015"(0.4mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4295
Struers No:
Leco No:
Price:
$184.00

23-4870ME(3053001), 23-4872ME(3083204), 23-4871ME(3073002), 23-4873ME(3052008), 23-4874ME(3062014), 23-4875ME(3072510), 23-4876ME(3083220), 23-4877ME(3031204), 23-4878ME(3041201), 23-5159ME(3030605), 23-4879ME(3051502), 23-4880ME(3062006), 23-4881ME(3072501), 23-4882ME(3083202), 23-4883ME(3041207), 23-4884ME(3052010), 23-4885ME(3072509), 23-4886ME(3083218), 23-4887ME(3031001), 23-4888ME(3041202), 24-4887ME(3030606), 23-4889ME(3051504), 23-4890ME(3062011), 23-4891ME(3072502), 23-4892ME(3083219), 23-4891ME(3031201), 23-5160ME(3030604), 23-4892ME(3051506), 23-4893ME(3072503), 23-4894ME(3083217), 23-4895ME(3031202), 24-4895ME(3030608), 23-4896ME(3051507)

CBN Waveframe Blur

For iron, carbon steels, high alloy steels, cobalt alloys, nickel super alloys, and lead alloys. CBN is recommended for cutting had metals, specially iron and steel. Since carbon in steel reacts with carbon in diamond, quickly dulling the diamond crystal and slowing the material removal. CBN blades provide significantly reduced cutting times for tough, gummy materials, such as lead and titanium. However, CBN are not recommended for ceramics and other non metallic materials. These blades will provide precise cutting capability on difficult to cut samples/materials. These CBN blades will significantly reduce your cutting time on ferrous materials compared to convention al diamond wafering blades. Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small addition al fee, if needed)

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CBN WAFERING BLADES SINTERED
Item No:23-4898ME (3041205)
Diameter:
4"(101.1mm)
Thickness:
.012"(0.3mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4264
11-5264
Struers No:
235CA
Leco No:
Price:
$174.00
CBN WAFERING BLADES SINTERED
Item No:23-016CBN (3030601)
Diameter:
3"(76mm)
Thickness:
.006"(0.15mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-10070
11-10071
11-4263
Struers No:
Leco No:
Price:
$180.00
CBN WAFERING BLADES SINTERED
Item No:23-4899ME (3051501)
Diameter:
5"(127mm)
Thickness:
.015"(0.4mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4265
11-5265
Struers No:
355CA
Leco No:
Price:
$199.00
CBN WAFERING BLADES SINTERED
Item No:23-4900ME (3062007)
Diameter:
6"(152mm)
Thickness:
.020"(0.5mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4266
11-5266
Struers No:
455CA
Leco No:
Price:
$209.00
CBN WAFERING BLADES SINTERED
Item No:23-4902ME (3083208)
Diameter:
8"(203mm)
Thickness:
.035"(0.9mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4268
11-5268
Struers No:
655CA
Leco No:
Price:
$240.00
CBN WAFERING BLADES SINTERED
Item No:23-4901ME (3072504)
Diameter:
7"(178mm)
Thickness:
.025"(0.6mm)
Arbor Size:
1/2"(12.7mm)
Buehler no:
11-4267
11-5267
Struers No:
Leco No:
Price:
$245.00

23-4898ME (3041205), 23-016CBN(3030601), 23-4899ME(3051501), 23-4900ME(3062007), 23-4902ME(3083208), 23-4901ME (3072504)

Advantages

  • Reduce & Eliminate additional steps often required after sectioning
  • Preserve True Material Microstructure (no deformation)
  • Excellent Performance, even on Materials with a High Metallic Content
  • Works on larger variety of materials (More Universal)
  • No Smearing / No Material Deformation
  • Section Hard to machine materials 3 times faster
  • Longer Life (Last 2.2 times longer)
  • Priced 3 times less expensive than the leading / conventional Brand Name Wafering Blades
  • Non Magnetic Alloy Core
  • No Contamination
  • Can be used with plain water, synthetic coolant, or oil
  • Easy to Use / Minimal Dressing

About Sintered (Metal Bond)

Sintered (Metal Bond) diamond tools have multiple layers of diamonds impregnated inside the metal matrix. Diamonds are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. Metal bonded diamond tools are “impregnated” with diamonds. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any materials such as sapphire, advanced ceramics, optics, glass, granite, tile and etc. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting. Sintered (metal bonded) diamond tools are recommended for machining hard materials from 45 to 75 on rockwell scale (5 to 9.5 on mohe’s scale of hardness). 

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

No Glazing

Diamond & CBN Wafering Blades with SMART CUT® technology require minimum dressing, the bond renews itself.

More Consistent Performance

Diamond & CBN Wafering Blades are produced using only the highest quality raw materials are used in manufacturing process. Utilizing world class quality control, inspection, and measurement equipment. Highly Experienced Engineers constantly monitor and control all material input & output at all stages of manufacturing process. Insuring product consistency for use in demanding & sensitive applications SMART CUT® DIAMOND & CBN wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing.

Faster Cutting Action

Diamond & CBN Wafering Blades made utilizing SMART CUT® technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

Longer Life

In most cases Wafering Blades manufactured utilizing SMART CUT® technology, will outlast other conventional material (sintered), resin, and nickel bonded diamond & CBN Wafering Blades. SMART CUT® diamond & CBN Wafering Blades are more sturdy than Wafering Blades manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

Best Performance & Value on the Market​

SMART CUT® Diamond & CBN Wafering Blades are the best investment you can make! Although we may not always be the lowest cost solution provider. Our Diamond & CBN Wafering Blades can provide the best ROI. Designed for users that understand and appreciate quality. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Why Choose Us?

Optimize your application to ultimate level of efficiency

Diamond Wafering Blade
Selection Variables

Diamond Concentration

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Blade Thickness

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning

For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. .

Diamond Particle/Grit size

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain. Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.

Bond Type

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Blade Outside Diameter

typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Feed Rates

load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Bond Hardness

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Blade Speeds/RPM’s

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

Buehler,Struers & Leco

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Comprehensive Source of Information on Diamond & CBN Blades

We understand that your success depends on select the right diamond & CBN blade, and optimizing your parameters to best fit your applications/needs.

The more you understand about what we can do for you, the better our partnership will be.

On our website you will find the Most Comprehensive Source of Information on Everything you wanted to know about diamond & CBN blades & industrial diamond tools.

Large Inventory & Custom Manufacturing

Largest Inventory of Diamond Drills & Tools in the U.S Available in different diameters, wall thicknesses, angles, radiuses, drill depths, mounting types, bond types, diamond mesh sizes, concentrations, bond hardness, tolerances. Custom Manufacturing to fit your particular requirements is available with short lead times and no minimum order quantities.

Experience makes all the Difference

"ONE OF THE MOST EXPERIENCED COMPANIES IN THE INDUSTRY"

Over the years we have enjoyed working with all types if clients, regardless of size. Proprietary drill chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect drill life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after drilling.

Umatched Technical Support

We Are a Partner In Your Success
Developing close ties with our customers is the foundation of our business. At the core of our company is a team of world class engineers, knowledgeable customer service personnel here to serve you. Whether is designing or manufacturing a special solution. We will go out of our way to optimizing your process to ultimate level of efficiency.

Advanced Technology

American Manufacturer
As one of the few remaining independent U.S.Diamond Tool & machine builders. We have the experience & tradition to help you remain at frontier of technology Our experience has been further enhanced by acquiring assets and processes from some of the oldest American tool manufacturers, along with their decades of experience and R& D. This has positioned us as one of the most experienced companies in the industry.

Superior Quality &
Consistency

Our unique bond formulations, tool designs, stringent requirements, and utilization of exceptionally high-quality diamonds and raw materials ensure top-notch products that adhere to strict ISO 9000 standards.

Our proprietary technology allow us to control and regulate the dozens of variable that affect toolife, quality, & consistency

Expect More From Your Tools

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