resin bond

SMART CUT® Series 400 Wafering Blade, Resin Bond

Resin Bond Diamond Wafering Blades for use on Precision & Laboratory type Cut off Saws
SMART CUT®  Series 400 are Designed for Precision, Chip Free cutting of wide variety of materials These are very thin kerf blades and are very delicate. Must be used on high precision specialized laboratory cutting saws (not tile saws, trim saws, etc) The diamond section can be easily broken if the material moves while cutting, blade is dropped, material is feed to fast into the blade, material is not fed consistently straight into the blade (shifts position) etc. Diamond Size is Medium providing faster cutting speed, while still providing surface quality unmatched by 95% of other blades.