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SMART CUT® Diamond Notch
SMART CUT® Diamond Notch Grinding Wheels in Single & Multi Layered electroplated nickel bond & sintered (metal bond) are construction are developed for high precision notch formation on semiconductor wafers. These wheels support performance requirements for Silicon, Silicon Carbide, Gallium Arsenide, and Sapphire. The electroplated structure holds diamond particles firmly on the surface, producing accurate geometry, clean edges, and stable performance during continuous wafer processing. You receive predictable grinding behavior, long wheel life, and consistent notch dimensions under demanding production conditions.

