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SMART CUT® Diamond Notch
SMART CUT ® Single & Multi Layered Electroplated Diamond Notch Grinding Wheel is designed for high-precision notch grinding of semiconductor wafers, including materials such as Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs), and Sapphire. Engineered using advanced electroplating technology, this wheel ensures exceptional performance in wafer processing, offering a high level of precision and durability for demanding semiconductor applications.