SMART CUT® 4005
Low Speed Saw

SMART CUT® SMART CUT® 4005 Low-Speed Saw is a small, precision cut-off machine designed for sectioning a wide range of materials with high efficiency and accuracy. It is built to be incredibly easy to operate, with quick specimen fixation and size setting, allowing users to begin cutting in just minutes. The workpiece is securely fastened in a holder mounted on a movable arm, ensuring stable and precise cutting during the entire operation.

Equipped with a continuously variable cutting speed, the SMART CUT® 4005 maintains a constant speed under varying loads, ensuring reliable results regardless of material type. With a maximum specimen size of 30 mm in diameter, this machine provides versatility for a variety of cutting applications. The specimen size is set with exceptional accuracy of ±0.003 mm via an integrated LCD digital micrometer, making it ideal for high-precision tasks. Additionally, the cutting pressure is adjustable independently of the specimen weight, allowing users to fine-tune the cutting conditions to suit different materials and requirements.

One of the standout features of the SMART CUT® 4005 is its geonometer, which allows users to cut materials at various angles with high precision. This feature is particularly valuable for applications that require angular cuts, such as when working with brittle crystals, ceramics, or specialized samples. The geonometer provides easy adjustment of cutting angles, ensuring the machine can handle a wide range of specimen orientations, enhancing its versatility for specialized cutting needs.

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The machine also allows an option for sectioning/cutting with gang operation (several blades) cutting at the same time (up to 4 blades). Perfect for brittle crystals, ceramics, and TEM samples. The cutting process is liquid-cooled with the cooling liquid draining back continuously into the coolant tank.

When the cutting operation is finished the cut-off wheel stops and the specimen falls into a basket in the coolant tank thus protecting the specimen from drying and making retrieval easy. The coolant tank is very easy to remove and both the retrieval of the finished specimens and the cleaning of the coolant tank are therefore simple and straightforward.

SMART CUT® 4005 is Most Affordable Low Speed Sectioning Saw available on the market today. Providing equal Precision, Productivity and Versatility as well know Brand Name Low Speed Saws, at significantly lower price. Perfect for Production and R & D facilities on a Budget. Compare to any other Low Sectioning / Wafering Saw. START SAVING MONEY TODAY!

Features:

Working Arm

Balance Weight

Two-dimension Clamp

Principal Shaft

Digital display for speed

Knob for adjusting speed

Power switch

Diamond blade

Door of Lubricating Water Trough

Position-Limit Switch

Sliding Seat

Micrometer

Lubricating Water Trough

Goniometer

This low-speed saw is equipped with an advanced goniometer and goniometric specimen holder, providing precise control over specimen angles during cutting, grinding, and polishing operations.

The goniometer allows the operator to adjust and measure the specimen’s angle accurately, ensuring optimal positioning for high-precision tasks. The specimen holder securely maintains the material at the desired angle throughout the process, preventing any movement or misalignment that could affect the result.

These features are essential when working with delicate materials, such as ceramics, glass, or composites, that require specific orientation during cutting to prevent stress or damage. The ability to set and maintain precise angles leads to improved cut quality, cleaner finishes, and better overall sample preparation. This is especially important in industries like semiconductor manufacturing, optical testing, or metallography, where exact angles are critical for achieving optimal results.

Unlike many standard low-speed saws, which focus on basic cutting functions, our machine incorporates the goniometer and specimen holder to provide the flexibility and accuracy needed for high-precision applications.

Gang Operation (4 blades cut simultaneously)

Machine offers an efficient blade setup that supports dicing multiple slices in parallel, significantly improving productivity and throughput. The spacious design accommodates blades with a 10mm thickness and a 60mm diameter, providing ample room to work with thicker and larger materials. This increased blade space allows for the simultaneous cutting of multiple slices in parallel, enhancing the machine’s ability to handle high-volume, high-precision tasks.

This feature is particularly advantageous in applications where large numbers of slices need to be processed quickly and accurately, such as in semiconductor wafering, thin-sectioning for materials research, or high-precision industrial cutting. The ability to dice multiple slices at once reduces the time spent on each job and increases overall output, which is critical for meeting production deadlines or scaling operations.

By allowing for multiple slices to be cut at once, the machine maximizes efficiency while maintaining the precise, clean cuts required for high-quality results. This capability is not commonly found in all low-speed saws, which are typically designed for single-slice cutting. The larger blade space combined with the goniometer and specimen holder offers a unique advantage for industries that need to process many slices in a single pass without compromising on accuracy or finish.

Cross Mount Vice

Cross mount vice on this machine is essential for securely holding the specimen during cutting, grinding, or polishing operations. It ensures that the material is tightly clamped, preventing any movement during the process. This is particularly important when working with delicate or brittle materials that need to be firmly secured to avoid shifting or damage. The vice allows for precise adjustments in both horizontal and vertical directions, enabling accurate positioning of the specimen relative to the cutting tool.

By allowing fine adjustments along both axes, the vice ensures that the material is aligned correctly, which is crucial for achieving precise cuts and consistent results. This feature is especially useful when performing complex or angled cuts, as it works in conjunction with the goniometer to position the specimen at the exact angle required for the task.

Additionally, the vice improves overall efficiency by enabling quick material setup and repositioning, which helps streamline the workflow and reduces downtime. The vice is versatile enough to accommodate various specimen sizes and shapes, allowing the machine to handle different tasks without requiring additional setup.

Mini Vice

Mini Vise (1 1/4″ x 3/4″ jaw width; 1″ max. jaw opening) is a standard feature on this machine, designed to provide precise clamping for smaller or more delicate specimens. Its compact size and functionality make it an ideal choice for tasks requiring tight, secure holding of materials that are too small for larger vices or clamps. The 1 1/4″ x 3/4″ jaw width allows for a firm grip on the specimen without causing damage or distortion, even during high-precision cutting or grinding operations.

The 1″ max. jaw opening ensures that the vise can accommodate a variety of small materials, from thin wafers to fine components. This feature is particularly valuable when working with fragile materials or when precise positioning of the specimen is crucial. Its small size makes it versatile for use in applications where larger vices may be too cumbersome or unnecessary.

The mini vise serves to securely hold the specimen in place while the operator adjusts for accurate cuts.

Digital Micrometer Head 1" Travel 0.003 mm accuracy

  • Digital Micrometer Head
  • Reads to 0.001 mm (50 millionths of an inch)
  • 0.003 mm accuracy
  • Instant inch/millimeter conversion
  • Spherical face spindle
  • Automatic power-off
  • Water Proof, meet with IP54 standard
  • Each unit comes complete with a SR44 battery (offers 1 year of life under normal use), key spanner, and operation manual

Position Thickness & Accuracy:

The cutting thickness of the material is precisely controlled through the use of a high-precision digital micrometer head, which offers 1″ travel and 0.003mm accuracy. This micrometer ensures that each slice is cut to the exact thickness required, providing consistent, reliable results across various materials. The digital micrometer head can read to 0.001mm (50 millionths of an inch), giving users extremely fine resolution for detailed measurements.

The LCD micrometer features a waterproof design, meeting the IP54 standard, ensuring it remains functional even in wet or harsh environments. Its instant inch-to-millimeter conversion allows for quick unit changes, making it versatile for different measurement needs. Additionally, the micrometer includes a spherical face spindle, which ensures uniform contact with the material, reducing errors caused by uneven surfaces.

With automatic power-off functionality, the micrometer preserves battery life and minimizes the risk of power loss during operation. It comes complete with a SR44 battery, which offers a one-year life under normal use, a key spanner, and an operation manual for ease of use and maintenance.

The thinnest cutting thickness achievable with this micrometer is 0.35mm, enabling precise slicing of even the most delicate materials. This ensures minimal material loss and maximum efficiency when cutting thin wafers, precision samples, or ultra-thin sections, especially for industries requiring high-quality cuts, such as semiconductor and optics.

Cutting Width:

The cutting width of the slice can be adjusted from 1mm to 24mm, offering versatility in various applications. By simply adjusting the LCD digital micrometer, users can control the cutting width with accuracy. The micrometer’s easy-to-read digital display makes it simple to make these adjustments with confidence and precision. Whether you need to slice materials into uniform thin strips or require varying thicknesses for different applications, the digital micrometer ensures that each cut adheres to the desired specifications. This feature is perfect for industries that require precise control over cut dimensions, such as in precision dicing, wafering, or sample preparation.

Enclosure (Optional)

The enclosure for a low-speed sectioning saw helps protects the operator from debris, coolant splashes, and particles, while containing toxic materials to prevent exposure. The enclosure also improves cooling and lubrication by directing coolant precisely to the cutting zone. Transparent materials in the enclosure allow for easy monitoring of the cutting process while maintaining safety.

It helps reduce noise, creating a quieter work environment, and contains dust and debris, minimizing cleanup. The enclosure maintains environmental control by preventing contamination and stabilizing temperature, ensuring consistent cut quality. By shielding the blade from environmental factors, it prolongs its lifespan and improves cutting precision.

Standard Package

What is included with each machine

Part #Standard items included on packageQty.Picture
UKAMLS01Low Speed Diamond Sawset
UKAMLS02Adjustable Balance Weight with Shaft at Back Side1
UKAMLS03Balance Weight at Front Side1
UKAMLS25 vGoniometric Specimen Holder 10011
UKAMLS05One Pair of Blade Flanges, 35 mm dia. (1.4″)1
UKAMLS021Mini Vise (1 1/4″ X 3/4″ Jaw Width; 1″ Max. Jaw Opening)1
UKAMLS06One Pair of Blade Flanges, 46 mm dia. (1.8″)1
UKAMLS07One Pair of Blade Flanges, 62 mm dia. (2.45″)1
UKAMLS08Graphite Plate2
UKAMLS09Aluminum Plate2
UKAMLS010Wax Rod for Mounting Sampleset
UKAMLS011One Fuse, Two M4 Screws1 set
UKAMLS013AC Power Cord1
UKAMLS014Screw Driverset
UKAMLS015O-ring of Driving Motorset
UKAMLS0161 quart of SMART CUT water soluable coolant (advanced materials) formula or Mineral Oil (your choice) mix ration 1:20 (1 part coolant, 20 parts water) will make 5.7 gallons of coolant1
UKAMLS017Lubricant Tub1
UKAMLS018Collection Net1
Select Right Wafering Blade for your application4″ x .012″ x 1/2″ Diamond or CBN Wafering Blade. Sintered (metal bond) any specification. How to select the Right Diamond Wafering Blade for your application >>>1
4BC14′ X .013″ X 1/2″ 1A8 diamond wafering blade. all diamond from OD to ID blade will work until there is nothing left from the blade entire OD is consumed (will typically last as much as 3 to 4) blades together1
4SicB4″ X .015″ (0.4mm) X 1/2″ Silicon Carbide cut off blade1
4al2034″ x .015″ (0.4mm) x 1/2″ Alumina Oxide cut off blade1
 Dressing Stick (1/2″ x 1/2″ x 6″) alumina oxide white color 120, 220, or 320 grit (depending on your blade selection)1

ACCESSORIES (Optional Not Included in the Price)

ACCESSORIES - Optional items (not included in the standard package)

Quantity

Picture

90 Degree Cross Vise

Optional

Blade Spacer for Dicing Multiple Slices of Samples in parallel. 10 mm in Thickness; 60 mm in Diameter

Optional

SMART CUT® Coolants

Your choice of one (1) quart of SMART CUT® Water Soluble Coolant or Mineral Oil is included with machine. SMART CUT® Water Soluble Coolant Reduces material thermal stress, edge damage, and internal cracking, increases blade life, provides better cut quality, preserves material micro structure

Hence, assuring long-term integrity of material being sectioned. Since SMART CUT coolant is both a coolant and lubricant, both the wafering blade and material benefit. Mix ratio is 1:20 (1 part coolant, 20 parts water) on very hard and dense materials and 1:40 (1 part coolant, 40 parts water) on softer materials. Depending on mix ratio 1 quart will produce 5.7 to 9 gallons of coolant when mixed with water. As a coolant, SMART CUT KOOL reduces heat caused by friction. As a lubricant, SMART CUT KOOL lowers friction and surface tension, which increases swarf dispersion

LARGEST SELECTING OF DIAMOND & CBN WAFERING BLADES AVAIALBLE

one (1) diamond wafering blade any specification is included FREE OF CHARGE with purchase of any machine (any specification). we have almost unlimited number of diamond & CBN wafering blade specifications in stock available for immediate delivery. Available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness’s. With several thousand unique blade specification in stock not listed on our standard stock program. This insures you will receive the best blade specification possible for your specific application.

THE RIGHT DRESSING STICK FOR YOUR APPLICATION

One (1) dressing stick is included with the purchase of any machine free of charge. The dressing stick we supply is similar to the diamond size of the wafering blade you have chosen (or we recommended) for your application. Wafering Blades must be diamonds particles/crystals exposed properly through frequent dressing. Otherwise, the diamond tool will glaze over. They will begin to tear rather than grind which is very destructive. Tearing caused from unexposed diamonds creates friction. This causes uneven wear and/or heat cracks in the wafering blade and/or material being cut. Resulting in premature blade wear, blade tensioning problems, and will eventually destroy the blade. The more frequently the blade is dressed the freer and cooler it will cut with lot more consistency.

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