Brian Farberov, Author at UKAM Industrial Superhard Tools

About Brian Farberov

Brian is an experienced professional in the field of precision cutting tools, with over 27 years of experience in technical support. Over the years, he has helped engineers, manufacturers, researchers, and contractors find the right solutions for working with advanced and hard-to-cut materials. He’s passionate about bridging technical knowledge with real-world applications to improve efficiency and accuracy. As an author, Brian Farberov writes extensively on diamond tool design, application engineering, return on investment strategies, and process optimization, combining technical depth with a strong understanding of customer needs and market dynamics.

View all posts by Brian Farberov

23 Jul

Diamond / CBN Blade Dressing: When, Why & How to Restore Maximum Cutting Efficiency

Diamond crystal concentration is one of the most important and one of the most misunderstood specifications in diamond blade selection. Many users assume that a blade with a higher diamond concentration will always cut faster, last longer, and produce superior results. In reality, concentration is only one component of an engineered cutting system, and increasing it without considering bond hardness, grit size, material properties, spindle speed, feed rate, coolant performance, and machine rigidity can reduce cutting efficiency rather than improve it.

23 Jul

Understanding Cutting Force Distribution During Metallographic Sectioning Using Diamond & CBN Wafering Blades and Cut-Off Wheels

Selecting the correct diamond or CBN blade involves far more than matching the blade to a material’s hardness. While hardness is often the first property engineers consider, it is rarely sufficient for determining how a material will behave during precision cutting. Two materials may exhibit similar hardness values yet respond very differently under identical cutting conditions. One may produce clean, repeatable cuts with minimal edge damage, while the other may experience extensive edge chipping, subsurface cracking, rapid blade wear, or complete specimen failure.

22 Jul

How Material Fracture Toughness Influences Diamond & CBN Blade Selection

15 Jul

Understanding Diamond Crystal Concentration: Balancing Cutting Speed, Tool Life & Cost

15 Jul

Bond Hardness in Diamond & CBN Blades: How It Affects Cutting Performance, Wear, Blade Life & Surface Quality

Selecting the appropriate cutting technology is one of the most important decisions in precision material processing. While diamond blades and diamond wire saws both use industrial diamond abrasives to machine difficult materials, they are designed for fundamentally different applications and process requirements. Choosing the wrong cutting method can lead to excessive kerf loss, edge chipping, subsurface damage, poor surface finish, higher consumable costs, and unnecessary production delays. Conversely, selecting the right cutting technology can significantly improve material yield, extend tool life, reduce polishing requirements, and increase overall process stability.

11 Jul

How to Reduce Subsurface Damage During Precision Wafer Sectioning

In precision wafer sectioning, what happens beneath the cut surface is often more important than what is visible to the naked eye. A component may appear to have a smooth edge and acceptable dimensional accuracy, yet contain microscopic cracks, residual stresses, or fractured grains extending below the machined surface. These hidden defects, collectively referred to as subsurface damage, can compromise the mechanical integrity, electrical performance, and long-term reliability of the finished component.

02 Jul

Diamond Blade vs. Diamond Wire Saw: Selecting the Best Cutting Method for Advanced Materials

25 Jun

How Coolant Flow Affects Diamond Blade Life, Cut Quality & Process Stability During Precision Cutting

Coolant is one of the most important and often most overlooked variables in precision cutting operations. Many manufacturers focus heavily on blade selection, spindle speed, feed rate, and machine rigidity while assuming coolant simply serves as a cooling medium. In reality, coolant directly influences: Blade life Cut quality Surface finish Edge integrity Process repeatability Thermal stability Material removal efficiency Operating costs

24 Jun

Why Silicon Wafers Chip During Cutting – And How to Reduce Edge Damage

Edge chipping remains one of the most significant challenges in silicon wafer sectioning and sample preparation. Whether cutting semiconductor wafers, MEMS devices, power electronics substrates, silicon sensors, electronic packages, or failure-analysis samples, even minor edge defects can adversely affect inspection quality, downstream processing, polishing requirements, and overall yield.