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SMART CUT® Fully Sintered (Metal Bond) Diamond & CBN, Wafering Blades
SMART CUT® Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
Smart Cut® Glass Blade
SMART CUT Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
SMART CUT® HD Synthetic Low IFT Coolant/Lubricant For Diamond Wire Sawing Silicon
SMART CUT® is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots using ID, band, and wire saws. SMART CUT® HD-2B can also be used as a non-re-circulating edge grinding coolant or lubricant for silicon wafers and ingots.
SMART CUT® HIGH PRECISION GRINDING / POLISHING HEAD
SMART CUT® LG Manual Metallurgical Grinder/Polisher with Single Wheel
SMART CUT® LP – Grinding/Polishing Machine
SMART CUT® LP – 12” (300MM)
