SMART CUT® 105N Diamond, Nickel Bond Wafering Blades INTERRUPTED RIM

SMART CUT™  Series 105N more freer cutting & aggressive than continuous rim nickel bond wafering blades. Best Suited for cutting larger variety of micro-electronics packages, pcb boards, plastics, composites, soft and precious metals, fish and human bones, graphite, GRP, FR4. Core steel with memory. Always snaps back to its original shape no matter how much bent.

Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed)

Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. 

 Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Unlike sintered (meal bond) cutting blades where diamond is impregnated inside metal binder matrix based on bronze, copper, nickel and other alloys. Nickle bond blades have diamond exposed right on surface of the blade. Hence they are able to provide more faster and freer cutting action than their sintered (metal bond) counterparts.

Nickel bond diamond wafering blades are particularly well suited for cutting thermosetting plastics, GRP, pre-sintered and pre-fired (green) materials, electro carbons, graphite, soft ferrites, farinaceous products, deep frozen fish, pones, pc boards, and etc.

  • Blade Type: Nickel Bond (Electroplated) Diamond Wafering Blade
  • Rim Design: Interrupted Rim for freer cutting and reduced heat buildup
  • Bond Type: Nickel bond with exposed diamond for aggressive cutting
  • Core Material: Steel with memory (snaps back to original shape)
Available Sizes & Dimensions:
  • Diameters Available:
    • 4” (100mm)
    • 6” (150mm)
    • 8” (200mm)
  • Standard Kerf Thickness Range:
    • Typically between 0.010” (0.25mm) to 0.035” (0.889mm)
    • Custom thicknesses available based on application
  • Standard Arbor Size:
    • ½” (12.7mm) (custom arbor modifications available same-day upon request)
Performance & Cutting Characteristics:
  • Recommended for Cutting:
    • Microelectronics packages, PCB boards, plastics, composites
    • Soft and precious metals (gold, silver, copper, aluminum)
    • Fish and human bones (forensics, medical sample preparation)
    • Graphite, electro-carbons, soft ferrites
    • Glass-reinforced plastics (GRP), FR4
    • Pre-sintered & pre-fired (green) materials
  • Recommended Coolants:
    • Water-soluble coolants for general applications
    • Oil-based lubricants for metals and soft ferrites
    • Deionized water for graphite and electro-carbons
  • Cutting Speed:
    • Faster than sintered metal bond blades
    • Ideal for soft and gummy materials that tend to load up on other blade types
  • Heat Generation:
    • Minimal heat buildup due to interrupted rim design
    • Best used with coolant to optimize lifespan and performance
  • Typical Maximum Cutting Depth per Pass:
    • 4” blade – 1.0” (25mm)
    • 6” blade – 1.5” (38mm)
    • 8” blade – 2.0” (50mm)
    • 10” blade – 2.5” (63mm)
    • 12” blade – 3.0” (76mm)
    • Multiple passes recommended for deeper cuts
Operational Considerations:
  • Dressing Requirements:
    • Occasional dressing with aluminum oxide dressing stick for optimal performance
Customization Options:
  • Arbor Modifications: Any size available upon request
  • Custom Blade Dimensions: Available based on specific applications
  • Diamond Grit Size: Fine to coarse options available
  • Thickness & Kerf Adjustments: Custom configurations for specific material needs

The SMART CUT® 105N features an interrupted rim design, which allows for freer and more aggressive cutting compared to continuous rim nickel bond wafering blades. The interruptions in the rim help reduce heat buildup and minimize loading, making these blades ideal for cutting softer, gummy, or fibrous materials.

This blade is designed for cutting a wide variety of materials, including:

  • Micro-electronics packages
  • PCB boards
  • Plastics & composites
  • Soft and precious metals
  • Fish and human bones
  • Graphite & electro carbons
  • Glass-reinforced plastics (GRP) and FR4
  • Pre-sintered & pre-fired (green) ceramics
  • Soft ferrites

Nickel bond (electroplated) blades have a single layer of diamonds held by a tough and durable nickel alloy. Unlike sintered (metal bond) blades, where diamonds are embedded inside the metal matrix, nickel bond blades have exposed diamond particles that protrude from the bond. This ensures:

  • Faster and freer cutting
  • Minimal heat generation
  • Reduced loading and glazing issues
  • More precise and clean cuts

SMART CUT® technology ensures that:

  • Only the active diamond layer is in contact with the material. As the bond wears down, new layers of diamond are immediately activated.
  • Each diamond particle is placed strategically to optimize cutting efficiency.
  • The cutting edge remains sharp longer, ensuring consistent performance throughout the blade’s lifespan.

The standard arbor size for the SMART CUT® 105N blade is ½” (12.7mm). However, we can modify the arbor size to any specification on the same day for a small additional fee.

The core steel used in these blades is engineered with memory properties, meaning that even if the blade bends during use, it snaps back to its original shape. This prevents deformation, ensuring consistent accuracy and precision over time.

Nickel bond blades differ from sintered metal bond blades in several ways:

Feature

Nickel Bond (Electroplated) Blades

Sintered (Metal Bond) Blades

Diamond Exposure

Diamonds are fully exposed on the surface for freer cutting.

Diamonds are embedded in a metal matrix, requiring wear to expose new diamonds.

Cutting Speed

Faster cutting with less friction and heat buildup.

Slower cutting as diamonds wear down gradually.

Material Suitability

Ideal for soft, gummy, or fibrous materials (plastics, composites, soft metals, FR4, etc.).

Better suited for hard, brittle materials (ceramics, glass, sapphire).

Durability

Single-layer diamond coating; wears out once the diamonds are used up.

Multi-layer diamond impregnation; longer lifespan.

Yes. The SMART CUT® 105N wafering blades are designed for high-precision cutting applications in microelectronics, medical, and research industries, where minimal chipping and clean edge finishes are required.

It is highly recommended to use these blades with wet cutting (coolant or lubricant) to reduce heat buildup and extend the blade’s life.

The lifespan of a nickel bond diamond blade depends on:

  • Material being cut (softer materials extend blade life, harder materials shorten it)
  • Cutting speed and feed rate
  • Coolant/lubrication usage
  • Proper dressing and maintenance

For applications involving softer materials like PCB boards, plastics, and composites, these blades typically last longer than sintered metal bond blades.

Yes. We can modify the arbor size of any blade to fit your specific cutting machine on the same day for a small additional fee.

SMART CUT® 105N wafering blades are compatible with most wafering, dicing, and precision cutting saws. If you are unsure about compatibility, please contact us with your machine specifications.

Nickel bond blades do not require frequent dressing like sintered bond blades. However, occasional dressing may help maintain cutting efficiency and extend blade life.

You can order directly through our website, by phone, or by contacting our sales team. If you need custom modifications (arbor size, diameter, thickness), we can accommodate most requests with same-day processing.

Yes. We offer bulk pricing discounts for larger orders. Additionally, we have a Guaranteed Trial Order program, where you can test our blades and provide feedback on their performance.

The SMART CUT® 105N is designed for freer cutting and aggressive performance compared to continuous rim nickel bond blades. The interrupted rim design reduces heat buildup, minimizes material loading, and improves coolant flow to ensure cleaner and more efficient cuts.

Interrupted rim blades have gaps or slots in the cutting edge instead of a continuous rim. This design:

  • Reduces friction and allows the blade to cut with less resistance.
  • Minimizes material loading and glazing, which is common in softer materials.
  • Improves chip clearance and coolant flow, preventing overheating.

This makes them ideal for soft, gummy, and fibrous materials that would typically clog sintered metal bond blades.

While continuous rim nickel bond blades provide smoother cuts, they can be slower and prone to loading. The interrupted rim version offers:
Faster cutting speeds
More aggressive cutting action
Less clogging and glazing
Better coolant penetration

However, if you require the smoothest possible surface finish, a continuous rim version may be preferable.

This blade excels in cutting a wide variety of soft and gummy materials, including:
Micro-electronics packages
Printed circuit boards (PCBs)
Plastics & composites
Soft and precious metals (gold, silver, copper, aluminum)
Fish & human bones (medical and forensic applications)
Graphite & electro-carbons
Glass-reinforced plastics (GRP) & FR4
Pre-sintered and pre-fired (green) ceramics
Soft ferrites
Farinaceous (starchy) materials

These are materials that would typically load up or cause excessive friction with sintered metal bond blades.

No, for hard, brittle materials such as sapphire, alumina, and tungsten carbide, a sintered (metal bond) diamond blade would be a better option. Nickel bond blades are optimized for softer, more ductile materials.

Yes! These blades are commonly used for cutting:

  • Human and animal bones (forensic research, medical sample preparation)
  • Frozen tissue samples
  • Biological specimens

The low heat generation and aggressive cutting action allow for clean, precise cuts without excessive burning or damage to delicate samples.

Yes! The SMART CUT® 105N is one of the best options for cutting FR4, as it:

  • Prevents resin buildup on the cutting edge.
  • Minimizes delamination of the PCB layers.
  • Provides fast, clean cuts with minimal chipping.

Nickel bond blades feature a single layer of diamonds that are:

  • Electroplated onto the steel core using a durable nickel alloy.
  • Fully exposed on the surface, allowing for an aggressive cutting action.
  • Firmly held in place, preventing premature diamond pull-out.

This ensures fast cutting speeds and efficient material removal, particularly for soft, ductile materials that tend to load up on sintered blades.

SMART CUT® technology ensures that:
Each diamond is precisely placed for maximum cutting efficiency.
Only active diamond layers are in contact with the material.
Worn-out diamonds are automatically replaced by new ones as the bond wears down.

This results in:
Longer blade life
More consistent cutting performance
Less material waste

The blade’s core steel has memory, meaning that:

  • It can bend during use without deforming permanently.
  • It will always return to its original shape.
  • It provides extra durability and resistance to stress.

This feature is especially useful in precision cutting applications where maintaining blade shape is crucial.

The standard arbor size is ½” (12.7mm). However, we can modify the arbor size to fit your equipment on the same day for a small additional fee.

SMART CUT® 105N blades come in a variety of diameters, thicknesses, and kerf widths. Contact us for a custom recommendation based on your specific application.

It is highly recommended to use this blade with coolant or lubricant to:
Reduce heat buildup
Extend blade life
Improve cut quality

Dry cutting can lead to faster wear and overheating, especially when cutting plastics or composites.

Blade life depends on:

  • Material being cut (soft materials extend life; abrasive materials shorten it).
  • Cutting speed & feed rate.
  • Coolant usage.
  • Proper blade maintenance.

For softer materials, this blade can outlast sintered metal bond blades.

Nickel bond blades do not require frequent dressing, unlike sintered bond blades. However, occasional dressing may help maintain cutting efficiency.

The optimal RPM depends on the blade diameter and material. Contact us with your specifications, and we will provide the best RPM settings.

Yes! We offer:
Bulk discounts for larger orders.
Guaranteed Trial Order program, where you can test our blades and compare performance.

The SMART CUT® 105N Nickel Bond blade differs significantly from resin bond diamond wafering blades in several ways:

Feature

Nickel Bond (Electroplated) Blade

Resin Bond Diamond Blade

Diamond Exposure

Diamonds are fully exposed on the surface, leading to faster cutting speeds.

Diamonds are embedded within the resin bond, requiring wear to expose fresh cutting edges.

Cutting Speed

Faster and freer cutting, ideal for softer and gummy materials.

Slower initial cutting speed but provides a finer surface finish.

Material Suitability

Best for soft, fibrous, and composite materials (plastics, FR4, PCB boards, graphite, etc.).

More effective for brittle and fragile materials (ceramics, glass, quartz).

Loading & Glazing

Less prone to loading due to open diamond exposure.

Can glaze over quickly, requiring frequent dressing.

Lifespan

Shorter lifespan due to single-layer diamond coating.

Longer lifespan as new diamond layers are exposed over time.

Heat Generation

Lower heat buildup, making it ideal for heat-sensitive materials.

Higher heat buildup, but resin bond provides some cushioning.

Use the SMART CUT® 105N if you need high-speed cutting of soft and gummy materials without loading or glazing issues.
Use a resin bond blade for ultra-smooth finishes on hard, brittle materials where controlled wear is needed.

Yes, the SMART CUT® 105N is well-suited for cutting multi-layered materials, including PCB boards with embedded metals, composites, and laminates.

  • The interrupted rim design reduces heat buildup, preventing delamination of PCB layers.
  • Nickel bond diamond exposure ensures efficient cutting of both the resin and metallic layers within the board.
  • Recommended Cutting Method: Use wet cutting with an appropriate coolant to avoid excessive heating, which could degrade the epoxy resin in PCB boards.

The maximum cutting depth depends on the blade diameter and material being cut:

Blade Diameter

Approx. Max Cutting Depth

4″ (100mm)

~1.0″ (25mm)

6″ (150mm)

~1.5″ (38mm)

8″ (200mm)

~2.0″ (50mm)

10″ (250mm)

~2.5″ (63mm)

12″ (300mm)

~3.0″ (76mm)

Important Considerations:

  • For deep cuts, multiple passes with progressively deeper cuts are recommended to avoid excessive blade stress.
  • Coolant is required to prevent overheating and material damage.

Yes, but with several limitations:

  • Dry cutting is not recommended for prolonged use due to heat buildup, which can damage both the blade and the material.
  • For short, shallow cuts, dry machining may be possible, especially with softer materials like graphite or PCB boards.
  • If dry cutting is unavoidable, reduce feed rates and use intermittent pauses to allow the blade to cool between cuts.

Best for: Short, non-continuous cutting applications where coolant use is not feasible.
Not recommended for: Continuous cutting of heat-sensitive or thermosetting materials.

  • Low-Density Graphite: The blade cuts extremely fast with minimal resistance. Recommended lower RPMs to prevent over-aggressive cutting.
  • High-Density Graphite: More challenging due to increased hardness. Wet cutting with coolant is required to prevent excessive wear.
  • Electro-Graphite: Can be abrasive on the blade, so reducing feed rate and applying proper cooling is recommended.

In all cases, an interrupted rim design helps reduce material loading and improves chip clearance.

Yes. Proper clamping ensures minimal vibration, better precision, and reduced chipping when cutting FR4 (PCB material) or GRP (glass-reinforced plastic).

  • Use vacuum or mechanical clamps to hold thin sheets securely.
  • Avoid excessive force, as it may deform or crack the material.

For small or fragile pieces, consider mounting them onto a sacrificial substrate to reduce stress.

The best coolant depends on the material:

  • Water-soluble coolants – Best for general cutting (e.g., PCB boards, plastics, FR4).
  • Oil-based lubricants – Recommended for metals and soft ferrites to prevent oxidation.
  • Deionized water – For graphite and electro-carbons, avoiding contamination.
  • Water-based coolants are the best choice for most applications.
  • Oil-based lubricants are recommended for cutting soft metals and ferrites, as they provide better lubrication and heat dissipation.

Avoid using pure water without additives, as it may lead to corrosion of the blade core.

  • Coolant significantly extends blade life by reducing friction, heat, and material buildup.
  • It prevents diamond pull-out by keeping the blade’s nickel bond intact longer.
  • Using improper coolants (e.g., pure water without additives) can cause rusting, shortening blade lifespan.

A steady and consistent coolant flow is recommended.

Blade Diameter

Recommended Coolant Flow Rate

4″ – 6″

0.3 – 0.5 liters per minute

8″ – 10″

0.8 – 1.2 liters per minute

12″ – 14″

1.5 – 2.0 liters per minute

Signs of blade wear include:

  • Increased cutting resistance
  • Reduced cutting speed
  • More chipping or burrs
  • Visible diamond loss on the blade edge

Dressing helps remove debris and refresh the diamond surface, improving cutting efficiency and extending blade life.

For nickel bond blades, a medium to fine-grit aluminum oxide dressing stick is recommended.

  • Resin buildup reduces cutting performance by clogging diamond edges.
  • Can be prevented with proper coolant and occasional blade dressing.

Nickel bond blades offer:
Lower initial cost than sintered blades
Higher cutting speed, reducing per-cut costs
More aggressive cutting than resin bond, reducing cycle time

  • When a smoother surface finish is required (e.g., optical applications).
  • For cutting fragile materials where aggressive interrupted rim blades may cause chipping.


INDUSTRIES USED IN:

  • Advanced Ceramics
  • Composites
  • Glass
  • Geology
  • Quartz
  • Materials Research
  • Medical Devices
  • Metallography
  • Photonics / Optics
  • Semiconductor
 


FERROUS & NON-FERROUS METALS:

  • Plain Carbon Steels
  • Electronic Packages
  • stainless Steels Plastics
  • Tool Steels Fasteners
  • Aluminum Refractories
  • Copper Base Alloys Integrated Circuits
  • Magnesium Thermal Spray Coatings
  • Titanium Metal Matrix Composites
  • Biomedical Wafers
  • Petrographic
     
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Recommended for use in Diamond Tools 150 Grit Size (mesh…
$15.39
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Recommended for coarser grits found in segment wheels, core drills…
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SMART CUT® General Materials Formula Synthetic Water Soluble Coolant
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Diamond & CBN Wafering Blade Articles

Examples of cutting times for Sectioning of Specific Materials 0.25" (6.4mm) diameter rod. Using various cutting speeds.

Material

Blade Type

Diamond Concentration

Speed (RPM’s)

Load (grams)

Estimated Cutting Time

Hot Pressed Silicon Nitride Si3N4

Series 20LCU

Low

4,000

800

0:30

Boron Carbide B4C

Series 20LCU

Low

3,500

700

0:15

Sapphire Al203

Series 15LCU

Low

1,500

300

0:40

Chromium Doped Sapphire Al203

Series 15LCU

Low

500

500

0:20

Partially stabilized Zirconia ZrO2

Series 15LCu

Low

2,500

500

0:38

Silicon Carbide, SiC

Series 15LCU

Low

2,500

500

0:16

Case Hardened Steel

Series 15HCU

High

2,500

500

0:16

Grey Cast Iron

Series 15HCU

High

2,500

500

0:25

Titanium Alloy

Series 15HCU

High

2,500

500

0:32

Zinc Alloy

Series 15HCU

High

2,500

800

0:15

Tungsten Carbide 6% cobalt binder, wC

Series 15HCU

High

4,500

900

0:15

Tungsten Carbide 25% cobalt binder, WC

Series 15HCU

High

1,500

300

1:55

High Purity fused silica SiO2

Series 15HCU

High

2,500

500

0:40

Extruded Alumina, Al203

Series 15HCU

High

3,000

600

0:40

Aluminum Nitride AIN

Series 15HCU

High

1,500

300

0:30

Nickel Zinc Ferrite

Series 15HCU

High

1,500

300

0:30

Manganese Zinc Ferrite

Series 15HCU

High

Content

5,000

0:30

Yttrium aluminum garnet, YAG

Series 15HCU

High

3,000

Content

1:15

8 micron graphite fiber

reinforced zirconium

diboride/molybenum

disilicide composite

Series 15HCU

Low

2,500

300

0:20

White Cast Iron

Series Metacut CBN

High

2,500

700 

Thermal Spray Coatings

Series 15HCU

High

3,000

700

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Nickel Bond Wafering Blades INTERRUPTED RIM
4" (101.1mm)
.010" (0.25mm)
½” (12.7mm)
Fine / High
$105.00
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Nickel Bond Wafering Blades INTERRUPTED RIM
4" (101.1mm)
.020" (0.5mm)
½” (12.7mm)
Fine / Medium
$105.00
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Min: 1
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Nickel Bond Wafering Blades INTERRUPTED RIM
6" (152mm)
.010" (0.25mm)
½” (12.7mm)
Fine / High
$125.00
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Nickel Bond Wafering Blades INTERRUPTED RIM
6" (152mm)
.020" (0.5mm)
½” (12.7mm)
Fine / Medium
$125.00
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Step: 1
Nickel Bond Wafering Blades INTERRUPTED RIM
6" (152mm)
.027" (0.5mm)
1/2"(12.7mm)
Medium / High
$125.00
Max:
Min: 1
Step: 1

Advantages

Materials Used On

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT® Bond Works?

Step 1
COUNTER SINKS Step 1

Sharpest And Finest Quality Diamonds

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT®  Bond Diamond Bond makes sure every diamond is in the right place. and at the right time, working where you need it most.

Step 2
COUNTER SINKS Step 2

Diamonds or CBN Crystals

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT®  remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 3
COUNTER SINKS Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast
cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

About Nickel Bond (Electroplated) Tools

Electroplated (nickel bond) diamond products usually have a single layer of diamonds, held by a tough durable nickel alloy. Nickel is frequently used as a base for plating diamond. Because of its excellent strength, toughness and flexibility during the plating process. Electroplated diamond products are able to retain their original shape and dimensions thought their working life. Unlike sintered (meal bond) or resin bond diamond products, where diamond particles are buried in bond and held together by metal or resin binder deep inside. Electroplating allows diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.

Faster & Cutting Action

Diamond & CBN tools made utilizing SMART CUT®  technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

Longer Life

In most cases tools manufactured utilizing SMART CUT®  technology, will outlast other conventional  Sintered (Metal Bond) diamond & CBN drills. SMART CUT® diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

More Consistent Performance

SMART CUT® Resin Bond, CBN Blades have hundreds of diamond layers impregnated inside the Resin Bond matrix. Unlike Many Other drill Types, they wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing even on the hardest to cut materials.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Best Performance & Value on the Market

SMART CUT® Resin Bond, CBN Blades are the best investment you can make! While the initial investment in CBN Blades may be higher than traditional abrasive wheels, their long lifespan and efficiency often result in a lower cost per cut. This can provide to significant saving in time and money.

Diamond Wafering Blade
Selection Variables

Concentration for Diamond & CBN blades

Diamond Concentration

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond & CBN Kerf Thickness

Blade Thickness

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning

For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. .

Grit Sizes for Diamond & CBN Blades

Diamond Particle/Grit size

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain. Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.

Bond Type

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Blade Outside Diameter

Blade Outside Diameter

typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Feed Rates

load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Diamond & CBN Blade Bond Hardness

Bond Hardness

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Diamond & CBN Blade RPM’s

Blade Speeds/RPM’s

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

DIAMOND WAFERING BLADES SINTERED (METAL BOND)
Buehler,Struers & Leco
DIAMOND WAFERING BLADES SINTERED (METAL BOND)

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