Diamond wafering blades
Click to enlarge
Diamond wafering blades
Item #23-4870ME (3053001)- 5"(127mm) x .030"(0.76mm) x 1/2"(12.7mm) DIAMOND WAFERING BLADES, SINTERED (METAL BOND) - SERIES 30HCU $184.00
Back to products
Diamond wafering blades
Item #23-4873ME (3052008)- 5"(127mm) x .020"(0.5mm) x 1/2"(12.7mm) DIAMOND WAFERING BLADES, SINTERED (METAL BOND) - SERIES 20HCU $184.00
Go Back to Main Page: SMART CUT® DIAMOND WAFERING BLADES SINTERED (METAL BOND)>>>

Item #23-4872ME (3083204)- 8″(203mm) x .035″(0.9mm) x 1/2″(12.7mm) DIAMOND WAFERING BLADES, SINTERED (METAL BOND) – SERIES 30HCU

$214.00

-

Quantity Price
1 $214.00
2 $209.00
3+ $204.00
Add to wishlist
Compare
Additional information
Weight2.00 lbs
Dimensions8 × 8 × 2 in
Diameter8″(203mm)
Thickness.035″(0.9mm)
Arbor Size1/2″(12.7mm)
BUEHLER NO.11-4242
2 pcs and 3 pcs2 pcs – $209.00 ea, 3pcs -$204.00 ea