Sectioning
SMART CUT® Series 100N Wafering Blade, Nickel Bond
NICKEL BOND, DIAMOND CONTINUOUS RIM
SMART CUT® Series 100N will provide finer cut quality than interrupted rim nickel bond wafering blades. Best suited for cutting soft and fragile crystals, silicon wafers & substrates, fiberglass, glass fibers. made with stainless steel core Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed) Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.
SMART CUT® Series 3000R Resin Bond, Diamond Cut Off Blade
Resin Bond Diamond Cut off blades (Fine Size Diamond) for use on manual tile saws
SMART CUT® Series 3000R are the highest quality & most commonly used Resin Bond Diamond Cut off Blades / Cut Off Wheels available today. Finer Diamond Grit Size, and Slightly Higher Diamond Content then the SMART CUT Series 2000R blades. They are used for cutting very thin wall tubing, more fragile material, that need best surface finish possible to achieve. Cutting speed would be slower then the 2000R series. These blades cut more slowly due to their finer grit size, which provides less aggressive material removal. They are better suited for precision tasks where cut quality is prioritized over speed. The finer grit results in a much smoother surface finish with minimal chipping, making them ideal when a high-quality, clean cut is needed, especially for delicate materials The resin bond diamond cut off blades / cut off wheels excel in delivering superior cut quality compared to other diamond cutting blade, making them ideal for applications where cut quality and surface finish is highly important. They are designed to operate at higher speeds to minimize heat generation and improve surface finishes.
SMART CUT® Series 400 Wafering Blade, Resin Bond
Resin Bond Diamond Wafering Blades for use on Precision & Laboratory type Cut off Saws
SMART CUT® Series 400 are Designed for Precision, Chip Free cutting of wide variety of materials These are very thin kerf blades and are very delicate. Must be used on high precision specialized laboratory cutting saws (not tile saws, trim saws, etc) The diamond section can be easily broken if the material moves while cutting, blade is dropped, material is feed to fast into the blade, material is not fed consistently straight into the blade (shifts position) etc. Diamond Size is Medium providing faster cutting speed, while still providing surface quality unmatched by 95% of other blades.
SMART CUT® Series 600 RCBN CBN, Resin Bond Cut Off Blades
SMART CUT® Series 600 RCBN CBN, Cut Off blades are designed for cutting of extremely hard ferrous metals (HV 500 - 1400) used on large variety of high speed & abrasive cut off saws.
Resin bond CBN Cut Off Blades offer superior cut quality than any type diamond wafering blade available. Recommended for applications where cut quality and surface finish is very important. Compared to their sintered (metal bond) wafering blade counterparts. Resin Bond CBN Cut Off Blades offer far superior cut quality than the finest size metal bond (sintered) bade. Recommended for cutting Tool Steels, Heat-sensitive Materials, Hard Alloys, Soft Ferrous Alloys, Titanium Alloys where low heat generation or improved surface finish is desired. Most commonly used at higher speeds.
SMART CUT® Ultra Thin Abrasive Cut off Blades
SMART CUT Series Ultra Thin Abrasive Blades are designed to provide high quality sectioning results with no burning and minimal surface deformation. This can reduce the amount of grinding & polishing required later in the preparation process. Our blades are Formulated for fast sectioning with minimum kerf loss. They Provide for cool cutting action & Minimize the structural damage to the sample/material.
The thin kerf is designed to save money by reducing kerf loss. This is especially important when cutting very expensive materials, or when kerf loss represents a significant portion of the original material cost.
Used On: All Low & High Speed Wafering Saws, Sectioning Saws, Such as Buehler, Struers, Leco, & many others.
