Sectioning
SMART CUT® Series 400 Wafering Blade, Resin Bond
Resin Bond Diamond Wafering Blades for use on Precision & Laboratory type Cut off Saws
SMART CUT® Series 400 are Designed for Precision, Chip Free cutting of wide variety of materials These are very thin kerf blades and are very delicate. Must be used on high precision specialized laboratory cutting saws (not tile saws, trim saws, etc) The diamond section can be easily broken if the material moves while cutting, blade is dropped, material is feed to fast into the blade, material is not fed consistently straight into the blade (shifts position) etc. Diamond Size is Medium providing faster cutting speed, while still providing surface quality unmatched by 95% of other blades.
SMART CUT® Series 600 RCBN CBN, Resin Bond Cut Off Blades
SMART CUT® Series 600 RCBN CBN, Cut Off blades are designed for cutting of extremely hard ferrous metals (HV 500 - 1400) used on large variety of high speed & abrasive cut off saws.
Resin bond CBN Cut Off Blades offer superior cut quality than any type diamond wafering blade available. Recommended for applications where cut quality and surface finish is very important. Compared to their sintered (metal bond) wafering blade counterparts. Resin Bond CBN Cut Off Blades offer far superior cut quality than the finest size metal bond (sintered) bade. Recommended for cutting Tool Steels, Heat-sensitive Materials, Hard Alloys, Soft Ferrous Alloys, Titanium Alloys where low heat generation or improved surface finish is desired. Most commonly used at higher speeds.
SMART CUT® Ultra Thin Abrasive Cut off Blades
SMART CUT Series Ultra Thin Abrasive Blades are designed to provide high quality sectioning results with no burning and minimal surface deformation. This can reduce the amount of grinding & polishing required later in the preparation process. Our blades are Formulated for fast sectioning with minimum kerf loss. They Provide for cool cutting action & Minimize the structural damage to the sample/material.
