Coolants
SMART CUT® HD Synthetic Low IFT Coolant/Lubricant For Diamond Wire Sawing Silicon
SMART CUT® is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots using ID, band, and wire saws. SMART CUT® HD-2B can also be used as a non-re-circulating edge grinding coolant or lubricant for silicon wafers and ingots.
SMART CUT® Mineral Oil
SMART CUT® Mineral Oil is recommended for cutting, drilling, grinding and machining larger variety of materials such as:
- Materials with High Metallic Content
- Advanced Ceramics
- Precious & Semi Precious Stone
- Many Other Ultra Hard Materials
SMART CUT® Water Soluble Coolant
(General Materials Formula)
Fully Synthetic Lubricant & Coolant specially formulated for Slicing, Dicing, Drilling, and Grinding of Ceramics, Optics, Quartz, Silicon, and Other Materials. SMART CUT® Synthetic water soluble coolant/lubricant general materials formula is operator and environmental friendly coolant that will improve your overall diamond slicing, dicing, drilling, sectioning, grinding, polishing and diamond machining operation by as much as 30%.
SMART CUT® Water Soluble Dicing Coolant
SMART CUT® XP Water Soluble Dicing Coolant added to deionized (DI) water reduces surface tension flowing from saws injection system and is carried directly of dicing blade.
This reduces material thermal stress, edge damage, and internal cracking, assuring long-term integrity of material being processed. Since SMART CUT® XP Dicing Coolant is a coolant and lubricant, and Surfactant both the dicing blade and substrate / wafer / package benefit.
SMART CUT® XP Dicing Coolant/Lubricant is a specially formulated low-foaming dicing and sawing coolant/lubricant designed for precision applications involving wafers with integrated circuits, MEMS devices, and IC packaging. This aqueous-based synthetic formulation enhances the dicing process by ensuring superior cleanliness of the die or package after dicing while preventing corrosion and oxidation on exposed metals. It eliminates electrostatic discharge, which can be generated during the rotation of the dicing blade, protecting delicate components from damage.
