Nickel Bond (plated)
Band Saw Blades
Diamond Wire
SMART CUT Diamond wire produces minimum kerf loss, less sub-surface damage, and contamination free coolant. Used for precision cutting of various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials. Diamond Wire cutting is an environmentally friendly cutting process as it eliminates slurry recycling and disposal issues.
Diamond, Nickel Bond Cut Off Blades for Laboratory & Other Saws
Nickel Bond Hubbed Dicing Blades
SMART CUT 105N Diamond, Nickel Bond Wafering Blades INTERRUPTED RIM
SMART CUT™ Series 105N more freer cutting & aggressive than continuous rim nickel bond wafering blades. Best Suited for cutting larger variety of micro-electronics packages, pcb boards, plastics, composites, soft and precious metals, fish and human bones, graphite, GRP, FR4. Core steel with memory. Always snaps back to its original shape no matter how much bent.
Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed)
Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.
SMART CUT® 2010
Diamond, Nickel Bond Cut Off Blades for Laboratory & Abrasive Cut Off Saws
Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Unlike sintered (meal bond) cutting blades where diamond is impregnated inside metal binder matrix based on bronze, copper, nickel and other alloys.
