DIAMOND & CBN WAFERING BLADES (METAL BOND) - SMART CUT™
COMPARABLE QUALITY - SIGNIFICANTLY LOWER (Manufacturers Direct Prices)
DIAMOND WAFERING BLADE ITEM NUMBER CROSS REFERENCE
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Other Sizes and Specifications are also available from inventory - please inquire
LARGER DIAMETER DIAMOND CUT OFF /WAFERING BLADES
Diamond Wafering / Sectioning Blade by itself is perhaps the most important factor in your sectioning / precision diamond sawing operation.
The diamonds impregnated inside the bond matrix of the wafering blade, are what actually participate in cutting action. No matter how precision or well made your wafering saw. You will not be able to obtain the material surface finish, and precision tolerances you need, if the blade you are using is not right for your application. UKAM Industrial Superhard Tools proprietary blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after sectioning. All blades are manufactured and available from inventory to fit your specific material, application, and surface finish requirements. We will work with you to determine your needs, and develop the right bond formulation, concentration, and grit sizes. SMART CUT ™Precision Diamond Wafering Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed.
UKAM Industrial Superhard Tools is one of the Leading Diamond Wafering Blade Manufacturers, with one of the Largest Inventory of Precision Diamond Wafering Blades in the U.S. Over 20,000 diamond wafering blades in stock, available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.
You are sure to find the Right Diamond Wafering Blade for your application in stock and ready for same day delivery. If you are not using these blades, you are paying too much.
DIAMOND WAFERING BLADE SELECTION VARIABLES
Most diamond & CBN Wafering Blade Users already know which blade to use for their application. This information is typically based on the blade item number already used or recommendation provided by saw manufacturer or consumables supplier. Blade specification is identified by item number for fast and easy reordering. Some obtain this information through literature or recommendation given by their customer support representative. Although the blade you are using now may be working satisfactory. Do you really know if it is the best solution to your needs?
Many clients waste valuable time & money by using incorrect blade for their application. Some use blade with too fine size diamond particles, causing excessively long cutting times and material burning. Some use to thin of a blade for their material diameter/shape and prematurely bend, damage, or chip the diamond section. Most consumable vendors do not spend the time to educate the user on the wide variety of blade specifications and options available today. Nor provide the full blade specification per ANSI (American National Standards Institute) diamond & CBN blade labeling standards.
UKAM Industrial Superhard Tools specializes in manufacturing Diamond & CBN wafering & cut off blades for large variety of industries & applications (not just for laboratory / sample preparation) use. We have in stock over 20,000 diamond & CBN blades in wide variety of different specifications (not just specifications indicated above). We understand that your success depends on select the right tools & consumables, and optimizing them to best fit your needs. We believe that the best client is a well-informed client. The more you understand about what we can do for you, the better our partnership will be. On our web site you will find the Most Comprehensive Source of Information on Everything you wanted to know diamond & cbn wafering blades, cutting, grinding, & polishing. We are focused on your long term success and take great pride in helping you grow and prosper.
Diamond Concentration - typically
low concentration wafering blades should be for cutting ultra hard and
brittle materials such as ceramics and glass. In Low Concentration
Wafering Blades, diamond works by fracture process. Pressure on each
diamond crystal/particle is higher which provides enough stress to chip
off small flakes in the cut.
Diamond Concentration - High
concentration diamond wafering blades are recommended for cutting metals,
plastics and polymers. In this application, materials cut by a plowing
mechanism. In this applications diamond plough through the material, work
hardened strips of materials become brittle and break off. The greater
number of diamond by volume, the quicker the cutting action will be.
Increasing the number of diamond s also lowers the per unit force. For
metals where it is possible to induce deep deformation layers, a lower per
unit force is desirable to reduce the deformation during the cut.
For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.
diamond blades with optimum bond hardness for your application is
important to successful precision diamond sawing operation. Bond matrix
that is too soft for the material being cut will release diamond
particles faster than needed, resulting in faster wear and shorter
diamond blade life. On other hand bond matrix that is too hard will
result in much slower cutting speeds and require constant dressing to
expose the next diamond layer. As rule of thumb, harder materials such
as sapphire and alumina generally require a softer bond. Whereas softer
and more brittle materials require a harder bond.
Examples of cutting times for Sectioning of Specific Materials 0.25" (6.4mm) diameter rod. Using various cutting speeds.
|Material||Blade Type||Diamond Concentration||Speed (RPM's)||Load (grams)||Estimated Cutting Time|
|Hot Pressed Silicon Nitride Si3N4||Series 20LCU||Low||4,000||800||0:30|
|Boron Carbide B4C||Series 20LCU||Low||3,500||700||0:15|
|Sapphire Al203||Series 15LCU||Low||1,500||300||0:40|
|Chromium Doped Sapphire Al203||Series 15LCU||Low||500||500||0:20|
|Partially stabilized Zirconia ZrO2||Series 15LCu||Low||2,500||500||0:38|
|Silicon Carbide, SiC||Series 15LCU||Low||2,500||500||0:16|
|Case Hardened Steel||Series 15HCU||High||2,500||500||0:16|
|Grey Cast Iron||Series 15HCU||High||2,500||500||0:25|
|Titanium Alloy||Series 15HCU||High||2,500||500||0:32|
|Zinc Alloy||Series 15HCU||High||2,500||800||0:15|
|Tungsten Carbide 6% cobalt binder, wC||Series 15HCU||High||4,500||900||0:15|
|Tungsten Carbide 25% cobalt binder, WC||Series 15HCU||High||1,500||300||1:55|
|High Purity fused silica SiO2||Series 15HCU||High||2,500||500||0:40|
|Extruded Alumina, Al203||Series 15HCU||High||3,000||600||0:40|
|Aluminum Nitride AIN||Series 15HCU||High||1,500||300||0:30|
|Nickel Zinc Ferrite||Series 15HCU||High||1,500||300||0:30|
|Manganese Zinc Ferrite||Series 15HCU||High||2,500||5,000||0:30|
|Yttrium aluminum garnet, YAG||Series 15HCU||High||3,000||600||1:15|
|8 micron graphite fiber reinforced zirconium diboride/molybenum disilicide composite||Series 15HCU||Low||2,500||300||0:20|
|White Cast Iron||Series Metacut CBN||High||2,500||700|
|Thermal Spray Coatings||Series 15HCU||High||3,000||700|
SECTIONING SAWS, GRINDERS/POLISHERS & CONSUMABLES
For R & D and Manufacturing Organizations on a Budget
UKAM Industrial produces complete range of Sectioning Saws and Accessories for sample preparation (sectioning) of advanced materials, ultra hard & brittle materials, optics, composites, metals and etc. Typical applications include materials such as: ceramics, glass, plastics, quartz, metals, and graphite.Most samples / materials can be sectioned in seconds or few minutes with no material deformation. Preserving true sample / material micro structure. Providing equal Precision, Productivity and Versatility as High Cost Fully Automatic Diamond Wafering Saws, at a small fraction of the price. Find out more >>>
Used for: R & D, Quality Control, Failure Analysis, Production
What you should know before you buy your next diamond blade?
Used for: R & D, Quality Control, Failure Analysis, High Production
Diamond Wafering Blades News Release
In 1998 UKAM Industrial Superhard Tools, Division of LEL Diamond Tools International, Inc. introduced SMART CUT technology, a new breakthrough in manufacturing precision diamond wafering blades. The company maintains this technology will redefine the standard in cutting.
This technology allows us to properly position and orient the diamond inside the metal matrix. Making sure every diamond is in the right place and at the right time, working where you need it most.
This technology has also allowed us to develop a NEW GENERATION HYBRID BOND diamond bond matrix. In a SMART CUT™ diamond bond you will find all the advantages of cutting speed and smoothness that you have come to expect in a resin bond, and unique characteristics of a metal bond in terms of life, aggressiveness, durability, and excellent performance on you look for in a metal bond.
maximum cutting performance – each diamond works like a small horse. Diamonds come in contact with the material in the right place and at the right time, working where you need them most. You get the maximum use out of diamond and bond.
no glazing – blade requires minimum dressing, the bond renews itself. Compare to conventional diamond wafering blades that frequently require repeated dressing.
faster cutting/sectioning action - Diamond wafering blades manufactured utilizing this technology are much more aggressive than your conventional blades. Section ultra hard materials, advanced materials, brittle materials, optical materials, metals, & semi conductor materials up to 3 times faster. While still preserving material true micro structure & leaving behind a smooth surface finish.
more universal - SMART CUT Diamond Wafering Blades are designed to work on practically any material you can find, You can cut very hard materials, than switch to cutting soft materials and the blade will still maintain the same consistent performance.
superior coolant system - these blades are designed to cut with or without oil. We feel it is more preferable to the user to use water as a coolant. Oil does not a proper coolant for this procedure, as most other manufacturers would suggest. Water is a true organic coolant, witch does not leave the specimen being cut oily or contaminated.
sturdy alloy core – SMART CUT Diamond
Wafering Blades are made
with very durable proprietary alloy steel or non-magnetic core.
Designed to withstand heavy use and exploitation in a wide variety of difficult
environments and materials. You can expect less blade wreckage and blade
walking, due to loss of wafering blade core tension.
Industrial Superhard Tools – TEAM
UKAM Industrial Superhard Tools Division of LEL Diamond Tools International, Inc.
28231 Avenue Crocker, Unit 80 Valencia, CA 91355 Phone: (661) 257-2288 Fax: (661) 257-3833
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