SMART CUT® 6035 diamond wire saw
SMART CUT® 6035 diamond wire saw with advanced digital control offers the precise performance and durability essential for today’s leading laboratories and research institutions. Engineered with a three-dimensional digital control system, this saw is user-friendly and designed to deliver precision cutting at a highly competitive price point. Optimized for intricate cutting, dicing, and slicing of materials up to 50 mm in thickness, the SMART CUT® 6035 is ideal for handling fragile materials, such as delicate crystals, ceramic samples, and TEM or IC samples, ensuring exceptionally thin sections with minimal surface modification.
SMART CUT® 6035 is designed to support a wide range of cutting requirements, making it suitable for material research, TEM sample preparation, and IC failure analysis. The saw allows precise control over feed speeds, adjustable between 0.01 mm/min to 20 mm/min, enabling versatility for diverse material hardness and thickness. Both X and Y axes are digitally controlled via an intuitive touch panel, providing seamless, automated positioning and maximizing operational precision. Additionally, the saw includes a built-in water recirculating pump to cool the diamond wire during operation, ensuring smoother cuts and prolonging the wire’s lifespan.
Trusted by Tens of Thousands of Manufacturers, Laboratories,
Research Institutions Worldwide
Since 1990
The saw’s heavy-duty aluminum alloy frame ensures durability and stability, while transparent protective panels prevent coolant splashing, enhancing safety during operation. The cutting mechanism employs a single swinging wire with an adjustable length ranging from 5 to 15 meters, which allows for reuse of broken wire sections, contributing to cost-efficiency. The sample stage offers 360° horizontal rotation and ±10° tilting, enabling flexible sample orientation for precise cutting and complex sample geometries. With a positioning accuracy of ±0.01 mm, users can confidently achieve highly detailed cuts.
For enhanced performance on brittle crystals, an optional 0.22 mm diamond wire can be ordered, which requires a reduced feed rate due to its delicate nature. For improved cooling and extended wire life, SMART CUT® Coolant is recommended. Users may also opt for a Fiber Optic Y-shape Dual Light Microscope Illuminator for enhanced lighting where necessary.
Technical Data
|
General |
Designed for Bench top laboratory equipment |
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Stage travel |
Z axis: 50mm, automatically controlled by digital panel |
|
Sample stage |
Two dimension sample stage built in: 360°degree horizontal rotating and ±10° tilting |
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Traveling position accuracy |
±0.01mm |
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Controller & Touch Screen |
The saw wire moves along the Z-axis to implement cutting according to user defined program which specifying the cutting length, feed speed, back, speed, and spooler spinning speed. The feed speed is able to be set from 0.01mm/min to 20mm/min. |
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Diamond wire |
≤15 meters used for each installation |
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Wire traveling speed |
0-1.5m/s adjustable |
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Cutting Depth & Thickness |
Max: 50mm in diameter or square |
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Water Pump |
A small water recirculating pump is included for cooling diamond wire during cutting |
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Power |
110 – 240V AC 50/60Hz, for universal power. 200W Max. |
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Product dimensions |
Saw: 414mm(L) × 500mm(W) × 750mm(H) |
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Warranty |
One year limited with lifetime support, not including cutting wire |
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Certificate |
CE certified |
Advantages:
- High precision and accuracy
- Customizable digital control
- Versatile material compatibility
- Enhanced sample stage mobility
- Thin slicing with minimal structural modification
- Adjustable feed speed for controlled cutting
- Extended diamond wire life and reusability
- Integrated water recirculation and cooling system
- Robust and durable construction
- CE certified for safety compliance
- Compact bench-top design
- Universal power compatibility
- Universal power compatibility
- Optional upgrades for enhanced functionality
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Features
- Sample up to 50mm thickness
- Designed to provide a smooth and precise cutting for many kinds of materials. Ideal cutting tool for material research, TEM sample preparation, and IC failure analysis
- Feed speed possible to be set from 0.01mm/min to 20mm/min
- X and Y axes automatically controlled by touch panel
- Water recirculating pump is included for cooling diamond wire during cutting
- CE certified
Optional Orders
- For slicing or dicing very brittle crystal, you may order 0.22mm dia. Diamond Wire. Note that 0.22mm dia. Wire is very easy to broken, please reduce feeding rate to minimum.
- For longer wire life, please use SMART CUT® Coolant
- Where improved lighting is required, please consider a Fibre Optic Y-shape Dual Light Microscope Illuminator





LARGEST SELECTING OF DIAMOND WIRE
BLADES AVAILABLE
SMART CUT® Diamond Wire is available in loops and spools multiple configurations to meet different cutting requirements and fit almost any type of wire saw. Fine wires are used for semiconductor wafers, sapphire, and optics where precision and surface quality are critical. Medium wires are suited for solar wafers, glass, and ceramics, providing a balance of efficiency and finish. Larger wires are designed for stone, silicon ingots, and composites where durability and throughput are essential. Core materials include steel, stainless steel, tungsten, molybdenum, and specialty alloys such as NiTi, offering options for strength, flexibility, and corrosion resistance. Bond types include electroplated, resin bond, multi-layer, spiral, continuous, and segmented, allowing users to choose the best combination of cutting speed, tool life, and surface finish for their application.
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