SMART CUT® 6035 diamond wire saw

SMART CUT® 6035 diamond wire saw with advanced digital control offers the precise performance and durability essential for today’s leading laboratories and research institutions. Engineered with a three-dimensional digital control system, this saw is user-friendly and designed to deliver precision cutting at a highly competitive price point. Optimized for intricate cutting, dicing, and slicing of materials up to 50 mm in thickness, the SMART CUT® 6035 is ideal for handling fragile materials, such as delicate crystals, ceramic samples, and TEM or IC samples, ensuring exceptionally thin sections with minimal surface modification.

SMART CUT® 6035 is designed to support a wide range of cutting requirements, making it suitable for material research, TEM sample preparation, and IC failure analysis. The saw allows precise control over feed speeds, adjustable between 0.01 mm/min to 20 mm/min, enabling versatility for diverse material hardness and thickness. Both X and Y axes are digitally controlled via an intuitive touch panel, providing seamless, automated positioning and maximizing operational precision. Additionally, the saw includes a built-in water recirculating pump to cool the diamond wire during operation, ensuring smoother cuts and prolonging the wire’s lifespan.

Get A Quote

Features

Optional Orders

LARGEST SELECTING OF DIAMOND WIRE
BLADES AVAIALBLE

SMART CUT® Diamond Wire is available in loops and spools  multiple configurations to meet different cutting requirements and fit almost any type of wire saw. Fine wires are used for semiconductor wafers, sapphire, and optics where precision and surface quality are critical. Medium wires are suited for solar wafers, glass, and ceramics, providing a balance of efficiency and finish. Larger wires are designed for stone, silicon ingots, and composites where durability and throughput are essential. Core materials include steel, stainless steel, tungsten, molybdenum, and specialty alloys such as NiTi, offering options for strength, flexibility, and corrosion resistance. Bond types include electroplated, resin bond, multi-layer, spiral, continuous, and segmented, allowing users to choose the best combination of cutting speed, tool life, and surface finish for their application.

Related Products

Recently Viewed Products

ARE YOU USING METALLOGRAPHY SECTIONING SAWS

FOR YOUR APPLICATION?

LET US
HELP YOU

HAVING ISSUES WITH

YOUR METALLOGRAPHY SECTIONING SAWS?

Knowledge Center

What you should know

your next metallography sectioning saws?

Shopping cart
Sign in

No account yet?

Wishlist
0 items Cart
My account

Improve & Optimize your Diamond & CBN
Tools Return on investment up to 600%

Sign up to receive exclusive usage recommendations, Illustrated Trouble Shooting Guides & Sales

diamond tools manufacturer