nickel bond

SMART CUT™  Series 105N more freer cutting & aggressive than continuous rim nickel bond wafering blades. Best Suited for cutting larger variety of micro-electronics packages, pcb boards, plastics, composites, soft and precious metals, fish and human bones, graphite, GRP, FR4. Core steel with memory. Always snaps back to its original shape no matter how much bent. Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed)

NICKEL BOND, DIAMOND CONTINUOUS RIM

SMART CUT® Series 100N will provide finer cut quality than interrupted rim nickel bond wafering blades. Best suited for cutting soft and fragile crystals, silicon wafers & substrates, fiberglass, glass fibers. made with stainless steel core Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed) Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.