Shop

SMART CUT®  Nickel Bond Hubless Dicing Blades are designed to provide exceptional precision, longevity, and consistency for cutting a wide range of materials. Engineered with a high diamond concentration and advanced Nickel bond matrix, these blades deliver efficient cutting performance with minimal heat generation. Their ability to maintain excellent form retention and diamond exposure makes them ideal for applications requiring high accuracy, such as wafer dicing, thin substrate cutting, and microelectronics fabrication. The Nickel binder used in these blades is specifically developed to offer a hard bond for soft materials, ensuring longer blade life and reduced wear rates. This unique combination of bond structure and abrasive composition allows for faster cutting while minimizing chipping, making it an optimal choice for materials such as printed circuit boards (PCB), silicon, and ball grid array (BGA) components. By maintaining sharp diamond exposure throughout the cutting process, these blades enhance material removal efficiency while ensuring a stable and controlled cut.

SMART CUT®  Diamond Cylindrical Grinding Wheels are engineered for the precise peripheral grinding of silicon ingots, making them an ideal choice for industries such as semiconductors, electronics, automotive, and photovoltaics. These high-performance grinding wheels are designed to process the outer surfaces of silicon ingots, ensuring accurate orientation flats are created, which are essential for subsequent processing steps. The addition of the orientation flat, a marked edge indicating the crystallographic plane of the wafer, is crucial for the wafer's alignment in future manufacturing processes. During the post-slicing phase, wafers undergo shaping and smoothing through peripheral grinding.