SMART CUT® Nickel Bond Hubbed Dicing Blades are the preferred choice for semiconductor component manufacturing, offering ultra-thin precision cutting with exceptional stability. Designed for dicing narrow wafers with impeccable accuracy, these blades utilize a nickel electroplated bond combined with larger diamond grit, ensuring an extended lifespan and consistently high-quality performance.
Engineered for maximum customization, SMART CUT® Nickel Bond Hubbed Dicing Blades are available in a wide range of stocked variations.
Each blade consists of a precisely manufactured hub, designed for optimum cooling efficiency, and carries an electrodeposited nickel alloy layer embedded with diamond grains. The etched aluminum support is removed during manufacturing, leaving a free-standing nickel-diamond matrix that determines cut depth based on the exposed diamond rim.
UKAM Industrial Superhard Tools’ proprietary manufacturing process ensures precise control over diamond grit size, concentration, and nickel bond hardness, optimizing these variables to produce hubbed dicing blades that offer unmatched cut quality, superior blade life, and high throughput efficiency. These blades are highly versatile and perform exceptionally well in a wide range of applications, including silicon wafer dicing, brittle III-V compound materials such as gallium arsenide and indium phosphide, PZT ceramics, tantalates, aluminas, and silica-filled plastics for chip-scale package singulation.
SMART CUT® Nickel Bond Hubbed Dicing Blades feature a robust structure that enhances durability and provides superior cut quality with minimal chipping. They create ultra-thin kerfs, often less than 50 microns, enabling precision cutting while maintaining tight kerf width control. Their improved diamond exposure reduces the need for frequent dressing, allowing for more efficient and consistent cutting performance. These blades are designed to handle high exposure-to-width ratios and support advanced dicing techniques such as bevel and step cutting. A wide range of grit sizes and bond types is available to accommodate different application requirements.
This results in excellent cut quality with a low wear rate, reducing waste and improving productivity. The combination of an ultra-thin diamond blade and a precision aluminum hub provides stable cutting results while improving overall operation efficiency. These blades are particularly well suited for dicing silicon and III-V semiconductor materials.
Tolerances:
Lead time is usually 4 to 5 weeks
SMART CUT™ series Nickel Bond Hubbed diamond dicing blades are pre-dressed at the time of manufacturing. Dressing is the final step of the SMART CUT™ series Nickel Bond Hubbed dicing blades manufacturing process. This process levels the abrasive/diamond particle surface by removing extended diamond and plating protrusions. Pre-dressing is done in a way to best fit your anticipating dicing requirements/application.
However, we still recommend dressing the blade prior to use on your own dicing equipment. Doing so will help you achieve optimum blade roundness and eliminate pulsating peaks of grinding pressure, and prepare the blade for the needed cutting depth. Many users gradually break in their nickel bond hubed dicing blades by first making few trial cuts in order to verify acceptable performance/cut quality and proper alignment of optics and coolant on their saw. Consequently, they start cutting material at slow speed and gradually increase the speed and feed rate step by step towards their required feed rate.
Tab Content
|
Exposure (microns) |
380 |
510 |
640 |
760 |
890 |
1020 |
1150 |
1270 |
||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Thickness (μm) |
Tolerance Range (μm) |
380-510 |
510-640 |
640-760 |
760-890 |
890-1020 |
1020-1150 |
1150-1270 |
1270-1400 |
Grit Size |
Concentration |
Bond Hardness |
|
20 |
16-20 |
20 x 380 |
20 x 510 |
5000 |
50 |
S |
||||||
|
25 |
21-25 |
25 x 380 |
25 x 510 |
25 x 640 |
4500 |
50 |
S |
|||||
|
30 |
26-30 |
30 x 380 |
30 x 510 |
30 x 640 |
30 x 760 |
30 x 890 |
4000 |
70 |
M |
|||
|
35 |
31-35 |
35 x 380 |
35 x 510 |
35 x 640 |
35 x 760 |
35 x 890 |
35 x 1020 |
3500 |
70 |
M |
||
|
40 |
36-40 |
40 x 380 |
40 x 510 |
40 x 640 |
40 x 760 |
40 x 890 |
40 x 1020 |
40 x 1150 |
3000 |
90 |
M |
|
|
50 |
41-50 |
50 x 380 |
50 x 510 |
50 x 640 |
50 x 760 |
50 x 890 |
50 x 1020 |
50 x 1150 |
50 x 1270 |
2500 |
90 |
M |
|
60 |
51-60 |
60 x 510 |
60 x 640 |
60 x 760 |
60 x 890 |
60 x 1020 |
60 x 1150 |
60 x 1270 |
2000 |
110 |
H |
|
|
70 |
61-70 |
70 x 510 |
70 x 640 |
70 x 760 |
70 x 890 |
70 x 1020 |
70 x 1150 |
70 x 1270 |
1800 |
110 |
H |
|
|
80 |
71-80 |
80 x 760 |
80 x 890 |
80 x 1020 |
80 x 1150 |
80 x 1270 |
1700 |
130 |
H |
|||
|
90 |
81-90 |
90 x 1020 |
90 x 1150 |
90 x 1270 |
1500 |
130 |
H |
|
Material |
Application |
2/4 |
4/6 |
8/12 |
10/15 |
15/25 |
30/40 |
40/60 |
|---|---|---|---|---|---|---|---|---|
|
GaS |
Opto, LED |
X |
||||||
|
InP |
Opto |
X |
||||||
|
Si,Ge |
Discrete |
X |
X |
|||||
|
Si |
IC |
X |
||||||
|
PZT |
Sensor |
X |
X |
|||||
|
SiC |
Discrete |
X |
||||||
|
MLCC |
MLCC |
X |
||||||
|
CSP |
CSP |
X |
X |
|||||
|
μ-BGA |
μ-BGA |
X |
X |
X |
||||
|
FR4 |
PCB |
X |
||||||
|
LiNbO₃ |
SAW |
X |
||||||
|
Cu |
Metallic L/F |
X |
||||||
|
Epoxy |
Mold Compound |
X |
X |
X |
Electroplated (nickel bond) diamond products usually have a single layer of diamonds, held by a tough durable nickel alloy. Nickel is frequently used as a base for plating diamond. Because of its excellent strength, toughness and flexibility during the plating process. Electroplated diamond products are able to retain their original shape and dimensions thought their working life. Unlike sintered (meal bond) or resin bond diamond products, where diamond particles are buried in bond and held together by metal or resin binder deep inside.
Electroplating allows diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.
SMART CUT™ Series Nickel Bond Hubbed diamond dicing blades consist of a precisely made hub, shaped for optimum cooling results. The hub carries an electrodeposited layer of proprietary nickel alloys and diamond grains. When the supporting aluminum is etched back, a free standing nickel diamond matrix remains. The length of this free standing (exposed) diamond rim determines how deep the blade can cut. Please see formula below for more information.
UKAM Industrial Superhard Tools proprietary blade manufacturing processes, which allow precise control of diamond grit size, diamond concentration, and nickel bond hardness, are used to optimize these variables and produce hub blades that offer unparalleled cut quality, blade life and throughput.SMART CUT™ Series Nickel Bond Hubbed diamond dicing blades provide excellent performance on large variety of applications ranging from silicon dicing, very brittle III-V compound materials, PZT ceramics, tantalates, aluminas, to silica filled plastics for chip scale package singulation.
Manufactured utilizing SMART CUT™ technology, each diamond works like a small horse. Diamonds come in contact with the material in the right place and at the right time, working where you need them most. You get the maximum use out of diamond and bond.
Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is slower cutting speed. Low diamond concentration is recommended and widely used for cutting harder materials
Blade exposure is the minimum dimensions of the nickel rim to protrude over the aluminum hub. Selecting the proper blade exposure is function of total cut depth. Due to the self sharpening nature of the nickel bond diamond matrix, this dimension will be reduced during operation by wear. Blade exposure to be selected by cutting into substrate is
E1 = CS + SG + BW
for cutting through a substrate into a sporting dicing tape, the amount of cutting into the tape must be added to the above formula:
E2 = CT + CS + SG + BW
Typical dimensions are
CS = Cutting Substrate depth = Cut depth or material thickness
SG = Safety Gap between alu-Hub and substrate
BW = Amount of Blade to be worn (used up) during
For Example: Exposure for a 600 micron substrate cutting into tape is 30 + 600 + 130 + 200 = 960 microns. Recommended maximum blade exposure is about 25 x blade thickens for soft nickel alloy bond and 35 x blade thickness for hard nickel alloy bond.
Bond hardness determines how fast the nickel bond dicing blade will protrude/release its sharpest point of diamond particles in order to maintain consistent cut quality. Smoothness of diamond abrasive particles of the substrate, without considering diamond grit size is influenced by the stability of the bond binder. As the diamond particles become dull during usage, the speed and force required for their release from bond matrix. depends on strength they are bonded with. Hard nickel alloys firmly hold diamonds in place. They typically wear less and hence have little self sharpening. Softer nickel alloys on the other hand release dull diamond easily. And more frequently expose continuously sharp diamond particles. For this reason they are more self sharpening. SMART CUT™ series Nickel Bond Hubbed diamond dicing blades are available in soft or hard nickel alloys depending on customers dicing objective of clean cut quality vs. long blade life.
Nickel hardness and size of diamond particles plays a major role in determining cut quality, feed rate, RPM's, blade life, and overall performance. Finer diamond particles produce very smooth cut quality, along with minimum kerf less, and most minimal amount of chipping. Smaller diamond particles are release from bond faster, exposing new sharp diamond particles and maintaining excellent cut quality. The trade off is lower blade life and much slower cutting speeds. Since smaller/finer diamond particles remove less material, they require higher spindle speeds and slower feed rates. Finer diamond particle nickel bond dicing blades, also tend to load up (clogging diamond particles cavities with material residue being cut). Coarser size (larger) diamond particles provides much higher feed rates. Coarser diamond nickel bond dicing blades provide longer life and exhibit very little tendency to load up. The trade off more chipping, greater kerf loss, and rougher cut quality. SMART CUT™ series Nickel Bond Hubbed diamond dicing blades are available in large variety of diamond particle sizes, please see table below for more information.
Long Exposure
SMART CUT® technology enhances nickel bond hubbed dicing blades, delivering faster cutting speeds without sacrificing cut quality. The advanced bond ensures minimal wear, leaving a smooth finish and reducing material deformation.
Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.
SMART CUT® Nickel Bond Hubbed Diamond Dicing Blades deliver superior performance and value when compared to similar products. While the initial cost may be comparable or slightly higher than other nickel bond blades, their longer lifespan and greater cutting efficiency result in a lower cost per cut, offering significant savings in both time and money over the long term.
SMART CUT® Nickel Bond Hubbed Diamond Dicing Blades deliver superior longevity over standard nickel bond hubbed blades. The advanced bond structure increases resistance to wear, allowing the blade to maintain cutting performance over a longer period, reducing downtime, and improving overall efficiency.
SMART CUT® Nickel Bond Hubbed Diamond Dicing Blades are engineered for uniform wear, ensuring a stable cutting edge & diamond exposure for the duration of the blade’s life. This consistency provides reliable cutting speed and performance across a range of challenging materials, reducing the need for frequent dressing and improving overall productivity.
XP-1 is a general-purpose dicing fluid within the SMART CUT® range, designed to reduce debris, improve tool life, and prevent corrosion, while ensuring smooth cutting and protecting sensitive materials from ESD.
XP-2 enhances lubrication for demanding applications, offering superior cutting speeds, tool longevity, and advanced cleaning capabilities for tough materials like SiC and sapphire.
XP-3 is ideal for high-pressure systems, offering consistent cooling performance without foam buildup.
XP-4 specifically protects electrostatic-sensitive components by eliminating ESD, reducing defects, and extending tool life during the dicing process.
We understand that your success depends on select the right dicing blade, and optimizing your dicing parameters to best fit your applications/needs. The more you understand about what we can do for you, the better our partnership will be. On our website you will find the Most Comprehensive Source of Information on Everything you wanted to know about diamond dicing blades & industrial diamond tools.
Largest Inventory of Precision & Ultra Thin Diamond Dicing Blades in the U.S. Available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.
"ONE OF THE MOST EXPERIENCED COMPANIES IN THE INDUSTRY"
Over the years we have enjoyed working with all types if clients, regardless of size. Proprietary dicing blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after cutting.
We Are a Partner In Your Success
Developing close ties with our customers is the foundation of our business. At the core of
our company is a team of world class engineers, knowledgeable customer service personnel here to serve you. Whether is designing or manufacturing a special solution. We will go out of our way to optimizing your process to ultimate level of efficiency.
American Manufacturer As one of the few remaining independent U.S.Diamond Tool & machine builders. We have the experience & tradition to help you remain at frontier of technology Our experience has been further enhanced by acquiring assets and processes from some of the oldest American tool manufacturers, along with their decades of experience and R& D. This has positioned us as one of the most experienced companies in the industry.
Our unique bond formulations, tool designs, stringent requirements, and utilization of exceptionally high-quality diamonds and raw materials ensure top-notch products that adhere to strict ISO 9000 standards.
Our proprietary technology allow us to control and regulate the dozens of variable that affect toolife, quality, & consistency
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UKAM Industrial Superhard Tools is a U.S. High Technology, Specialty Diamond Tool & Equipment manufacturer. We specialize in producing ultra thin & high precision cutting blades and precision cutting machines diamond drills, diamond micro tools, standard & custom advanced industrial diamond tools and consumables.
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