SMART CUT® Series (SCM) Sintered (Metal Bond) Diamond CBN Dicing Blades are designed to provide some the best return on investment (ROI) in dicing application. They provide superior longevity, accuracy, and consistency across a wide range of applications. Engineered using advanced SMART CUT® technology, these blades are among the thinnest, most durable, and highest-performing dicing solutions available today. Their sintered metal bond structure ensures a self-renewing sharpness, delivering consistently clean and precise cuts over extended periods.
The Metal Bond Hubless Blade formulation features a specially developed sintered metal bond matrix that securely holds and retains diamond grains, enhancing blade durability and cutting efficiency. Unlike standard formulations, these blades have lower wear resistance, helping to reduce defects such as slanted-kerf and edge chipping, ensuring high-quality, straight cuts. Their high rigidity is equal to or surpasses that of electroformed blades, preventing wavy cutting and improving processing speed, stability, and cutting consistency. This makes them particularly well-suited for applications requiring long blade exposure and ultra-precise results.
Manufactured through high-pressure sintering, these blades are composed of multiple layers of high-quality diamond particles embedded within a metal matrix consisting of iron, cobalt, nickel, bronze, copper, tungsten, and other metal alloys.
This structure ensures excellent wear resistance and cutting efficiency, making them ideal for cutting hard, brittle, and high-precision materials such as BGA, soft alumina, TiC, LTCC, ferrite, silicon wafers, glass, piezoelectric ceramics, quartz, optical materials, and semiconductor components. The controlled sintering process optimizes the balance between cutting speed, blade longevity, and wear resistance, ensuring a consistent cutting performance throughout the blade’s lifecycle.
With their high rigidity and minimal blade wear, SMART CUT® SCM Sintered (Metal Bond) Dicing Blades ensure stable, highly precise cutting with minimal material deformation and contamination. They are designed to withstand high cutting loads while maintaining edge integrity, making them an excellent choice for applications where accuracy, durability, and efficiency are critical. The self-sharpening mechanism of these blades allows for continuous diamond exposure, preventing glazing and reducing the need for frequent blade replacements.
SMART CUT® SCM dicing blades offer a wide selection of blade thicknesses, ranging from 80 µm to 1500 µm, accommodating both ultra-thin and heavy-duty cutting requirements. Additionally, they provide customizable diamond grit sizes from 2 µm to 70 µm, ensuring the optimal balance between cutting speed, material removal rate, and surface finish quality. These blades are also available with serrated edges and various edge shapes, enhancing their ability to cut specific materials with greater efficiency and precision.
By integrating advanced rigidity, self-sharpening properties, and optimized bond formulations, SMART CUT® SCM Sintered (Metal Bond) Dicing Blades deliver exceptional performance across industries including electronics, semiconductor manufacturing, ceramics, and optics. Their prolonged lifespan, superior rigidity, and optimized diamond concentration make them the preferred choice for precision cutting applications where minimizing blade change frequency, improving cut quality, and enhancing overall process efficiency are essential.
SMART CUT® Sintered Metal Bond Dicing Blades are available in a broad range of diamond grit sizes, enabling users to balance cutting speed, surface finish, and blade longevity:
The diamond concentration is precisely controlled to optimize blade performance based on the material being cut. Higher concentrations extend blade life, while lower concentrations improve free-cutting action.
SMART CUT® sintered metal bond dicing blades come in multiple bond hardness formulations to match specific applications:
To enhance performance in specific cutting applications, SMART CUT® offers a variety of serrated and edge profile options:
SMART CUT® dicing blades are manufactured to extremely tight tolerances, ensuring high precision and repeatability:
SMART CUT® Sintered (Metal Bond) Dicing Blades are engineered for precision cutting of hard, brittle, and composite materials in industries such as electronics, semiconductor packaging, ceramics, optics, and advanced materials research.
These blades excel in cutting:
SMART CUT® Sintered (Metal Bond) Dicing Blades are used for high-precision cutting, dicing, slotting, and grooving of hard, brittle, and composite materials such as semiconductors, ceramics, optical glass, quartz, sapphire, silicon carbide (SiC), and superalloys. They are commonly used in electronics, semiconductor packaging, optical components, and advanced materials processing.
Unlike resin or electroplated blades, sintered metal bond blades have multiple layers of diamond particles embedded in a durable metal matrix, ensuring continuous diamond exposure and self-renewing sharpness. This results in longer blade life, better wear resistance, and enhanced precision, making them ideal for applications requiring consistent performance over extended cutting cycles.
SMART CUT® sintered dicing blades are available in a range of diameters:
⦁ Standard diameters: 2” (50mm) to 6 (154mm)
⦁ Custom diameters: Available upon request
⦁ Thickness range: 80 µm to 1500 µm
⦁ Ultra-thin options: Down to 45µm for high-precision applications
⦁ Standard thickness tolerances: ±0.002” (tighter tolerances available upon request)
SMART CUT® sintered dicing blades come in a wide range of diamond grit sizes to optimize cutting performance:
⦁ Grit size range: 2 µm to 70 µm
⦁ Common sizes: D126, D107, D91, D76, D54, D46, 45µm, 30µm, 15µm, 9µm, 6µm
⦁ Fine grit (2µm – 15µm): For ultra-precise cuts with minimal chipping
⦁ Medium grit (30µm – 54µm): For general-purpose cutting
⦁ Coarse grit (D76 – D126): For faster cutting speeds and high material removal rates
SMART CUT® dicing blades are available in different bond hardness formulations to match specific applications:
⦁ Hard Bonds (VVVHB, VVHB, VHBH, HBH, HBM): Ideal for hard materials requiring long blade life and high wear resistance
⦁ Medium Bonds (SBL, MHBL, MHBM): Balanced wear resistance for versatile cutting applications
⦁ Soft Bonds (VVVSB, VVSB, VSB): Designed for fast, free-cutting action with reduced heat buildup
Diamond concentration is carefully controlled based on material type and cutting requirements:
⦁ High Concentration: Used for abrasive and dense materials like fiberglass, tungsten carbide, tool steels, and superalloys
⦁ Low Concentration: Ideal for fragile, brittle materials such as ceramics, silicon, sapphire, lithium niobate, and photonics glass
⦁ Standard arbor hole sizes: 40mm
⦁ Custom inside diameters: Available upon request
⦁ Straight edge: Smooth cutting for minimal chipping applications
⦁ Serrated edge: Enhances coolant flow and debris removal for better cutting efficiency
⦁ Custom edge geometries: Available for specialized applications
⦁ Harder bonds (HBH, HBM) last longer but cut at a slightly slower rate due to increased wear resistance.
⦁ Softer bonds (VSB, VVSB) cut faster but wear more quickly, requiring more frequent blade replacements.
⦁ Medium bonds (MHBM, MHBL) offer a balance between cutting speed and longevity.
These blades are widely used in industries that require precision cutting, including:
⦁ Semiconductors & Electronics: BGA, CSP, MLCC, QFN, thin-film disk drive heads, aluminum titanium carbide
⦁ Ceramics & Advanced Materials: LTCC, zirconia (ZrO₂), aluminum nitride (AlN), boron carbide (B₄C), titanium diboride (TiB₂)
⦁ Optical & Photonics: Optical glass, sapphire, lithium niobate (LiNbO₃), lithium tantalate (LiTaO₃)
⦁ Superalloys & Hard Metals: Tungsten carbide, hardened steels, Inconel, Monel, Wasapalloy, tool steels
⦁ Other Specialty Materials: Fiberglass, quartz, silicon carbide, barium titanate, Bi12Si22, ZnSe
Selecting the correct SMART CUT® dicing blade depends on several factors, including:
⦁ Material type (hardness, density, brittleness)
⦁ Cutting speed and precision requirements
⦁ Surface finish expectations
⦁ Desired blade life and maintenance schedule
⦁ Blade thickness and diamond concentration
If you are unsure which blade is best for your application, our team can help you determine the optimal specification based on your cutting parameters.
Yes! We offer custom blade diameters, thicknesses, bond formulations, diamond concentrations, edge profiles, and arbor hole sizes to meet your specific cutting needs.
The lifespan depends on:
⦁ Material type and hardness
⦁ Diamond grit size and concentration
⦁ Cutting speed and feed rate
⦁ Coolant use and cutting conditions
Compared to resin bond and electroplated dicing blades, sintered metal bond blades offer significantly longer life due to their multiple layers of embedded diamond particles.
SMART CUT® Sintered (Metal Bond) Dicing Blades are compatible with most precision dicing saws used in semiconductor, optics, and ceramics industries. If you have specific mounting or machine compatibility concerns, we can provide customized blade configurations.
You can contact us directly with your material type, cutting requirements, and preferred blade specifications, and we will recommend the best option for your needs. We also offer custom blade configurations upon request.
Choosing the right blade thickness depends on material type, cutting precision, and blade stability:
⦁ Thin blades (80µm – 200µm): Ideal for precision applications with minimal kerf loss and ultra-fine cuts.
⦁ Medium blades (250µm – 750µm): Suitable for general-purpose cutting where both precision and durability are needed.
⦁ Thick blades (800µm – 1500µm): Used for deep cuts, tough materials, or increased blade exposure requirements.
⦁ Low concentration → Faster cutting speeds, less heat generation, better for brittle materials.
⦁ Medium concentration → Balanced performance for a wide range of materials.
⦁ High concentration → Longer blade life, best for hard, dense materials like tungsten carbide and superalloys.
Blade exposure refers to how much of the blade is extending beyond the mounting flanges:
⦁ Low exposure → More stability, better control, and reduced vibration.
⦁ High exposure → Deeper cutting capability but may require adjustments in feed rate and coolant application to prevent blade flexing.
⦁ Too high RPM → Increased heat, risk of material burning or cracking.
⦁ Too low RPM → Slower cuts, increased blade wear due to inefficient diamond exposure.
⦁ Optimized RPM → Clean, smooth cuts with minimal stress on the blade and material.
⦁ Ensure correct RPM and feed rate settings based on material hardness.
⦁ Use proper blade mounting techniques to prevent misalignment.
⦁ Avoid excessive blade exposure beyond the flanges.
⦁ Maintain adequate coolant flow to reduce thermal stress.
⦁ Deionized water → Common for semiconductor and optical applications, prevents contamination.
⦁ Water-soluble coolants → Reduce friction and extend blade life.
⦁ Low-foaming coolants → Improve process stability, particularly in high-speed cutting.
⦁ Insufficient coolant application → Ensure proper coolant flow rate and distribution.
⦁ Improper feed rate → Adjust to prevent overheating.
⦁ Glazed blade → Dressing the blade may be required to restore cutting efficiency.
⦁ Use a fine-grit dressing stick to remove bond material buildup and expose fresh diamonds.
⦁ Dress blades periodically to maintain optimal cutting speed and prevent glazing.
⦁ Avoid over-dressing, as this can reduce blade life.
No. These blades require coolant for effective operation. Dry cutting will cause excessive heat buildup, rapid wear, and material damage.
⦁ Running the blade at incorrect RPM → Reduces performance and increases wear.
⦁ Improper blade mounting → Causes deflection and imprecise cuts.
⦁ Ignoring coolant flow → Leads to overheating and premature blade failure.
⦁ Not dressing the blade when needed → Results in glazing and reduced cutting efficiency.
Excessive machine vibration can cause:
⦁ Blade deflection → Reduces cutting accuracy.
⦁ Inconsistent kerf width → Leads to uneven cuts.
⦁ Premature wear → Blade life decreases due to erratic cutting forces.
To prevent this, ensure the dicing saw is properly calibrated and stabilized.
Yes. Custom edge geometries such as serrated edges, segmented rims, or special notches can be provided for improved coolant flow, heat dissipation, and material removal efficiency.
⦁ Vacuum chucks → Provide stable, high-precision cutting for thin materials.
⦁ Wax mounting → Used for delicate substrates, reduces vibration.
⦁ Mechanical clamping → Works for larger, rigid materials but may introduce stress.
A blade should be replaced when:
⦁ Cutting speed significantly decreases despite proper feed rates.
⦁ Chipping or microcracks appear on the material surface.
⦁ Dressing no longer restores performance.
⦁ Blade edge shows excessive wear or deformation.
Yes, SMART CUT® sintered dicing blades are compatible with robotic wafer dicing, CNC precision cutting, and automated dicing equipment used in semiconductor, optical, and ceramic industries.
⦁ Use consistent cutting parameters (RPM, feed rate, coolant).
⦁ Regularly inspect and replace worn blades.
⦁ Calibrate dicing equipment to maintain precision.
⦁ Optimize blade thickness and diamond grit size based on production needs.
⦁ Store in a dry, controlled environment to prevent oxidation.
⦁ Keep blades in original protective cases to avoid accidental chipping.
⦁ Avoid stacking or direct contact between blades to prevent damage.
SMART CUT® sintered dicing blades are used in:
⦁ Semiconductor Fabrication → Wafer dicing, MEMS, IC packaging (BGA, QFN, CSP).
⦁ Optical & Photonics → Sapphire, quartz, optical glass cutting.
⦁ Advanced Ceramics → LTCC, zirconia, alumina, boron carbide.
⦁ Electronics Manufacturing → PCB, MLCC, thin-film disk drive components.
⦁ Superalloy Processing → Tungsten carbide, Inconel, tool steels.
Yes. SMART CUT® provides custom blade configurations, including:
⦁ Specific bond hardness and diamond concentrations.
⦁ Custom diameters, thicknesses, and arbor sizes.
⦁ Serrated, notched, or segmented edge profiles.
Contact us with details about your material type, cutting requirements, and machine specifications, and our technical team will recommend the best blade for your needs.
Feed rate should be optimized based on:
⦁ Material hardness – Harder materials require slower feed rates.
⦁ Blade thickness – Thinner blades work better with moderate to slower feed rates.
⦁ Coolant efficiency – Poor coolant flow may require reducing the feed rate to prevent overheating.
⦁ Chipping sensitivity – Lower feed rates help reduce microcracking on fragile materials.
Yes, but deep cutting requires:
⦁ Increased blade thickness and rigidity to prevent deflection.
⦁ High diamond concentration to improve longevity.
⦁ Serrated or segmented blades to enhance debris removal and coolant flow.
⦁ Lower feed rates to reduce stress on the blade and material.
Excessive spindle vibration can:
⦁ Reduce cut accuracy and increase kerf width variation.
⦁ Cause premature blade wear and breakage.
⦁ Increase material chipping and microcracks.
⦁ Reduce coolant effectiveness by disrupting flow patterns.
To minimize vibration, ensure the spindle is balanced, clean, and properly maintained.
⦁ Standard precision flanges – Suitable for most cutting applications.
⦁ Large-diameter flanges – Recommended for ultra-thin and high-precision blades to improve blade stability.
⦁ Custom-balanced flanges – Can help minimize spindle vibration and improve performance in sensitive applications.
⦁ Thinner kerf blades (≤100µm): Reduce material loss, ideal for high-value materials.
⦁ Medium kerf blades (100µm – 300µm): Balance between material yield and blade stability.
⦁ Thicker kerf blades (>300µm): More durable but reduce material efficiency.
Selecting the right kerf width is essential for maximizing yield while maintaining cutting stability.
⦁ Straight-edge blades – Provide clean cuts with minimal chipping.
⦁ Serrated-edge blades – Improve coolant retention and heat dissipation, reducing cutting stress.
⦁ Notched blades – Help reduce friction and improve cutting speed.
⦁ Discoloration or burn marks on the material.
⦁ Increased blade glazing, requiring more force to cut.
⦁ Material warping or increased chipping.
⦁ Rapid blade wear.
To prevent overheating, optimize coolant flow, adjust feed rates, and ensure correct RPM settings.
The arbor hole must match the machine’s spindle precisely.
⦁ Too large: Causes misalignment and vibration, leading to uneven cuts.
⦁ Too small: Can cause excessive blade stress and improper mounting.
⦁ Properly fitted arbor holes ensure stable, accurate, and vibration-free operation.
Regular maintenance includes:
⦁ Checking and calibrating spindle alignment to ensure precision.
⦁ Cleaning and inspecting flanges for wear or debris buildup.
⦁ Replacing worn coolant nozzles to maintain proper fluid flow.
⦁ Ensuring proper machine vibration damping to avoid cut irregularities.
Yes, step-cutting (cutting in multiple passes) is possible and is recommended for hard or thick materials to reduce blade stress.
⦁ Use moderate feed rates to avoid excessive force.
⦁ Ensure coolant reaches the blade consistently to prevent overheating.
⦁ Choose appropriate blade exposure to balance cut depth with stability.
⦁ Low coolant pressure → Poor heat dissipation, increased blade wear.
⦁ High coolant pressure → Improved cooling but may cause material deflection in fragile materials.
⦁ Optimized coolant pressure ensures consistent chip removal, cooling, and cutting efficiency.
⦁ Choose balanced bond hardness to handle different material properties.
⦁ Use moderate diamond concentration for controlled cutting.
⦁ Adjust feed rate and coolant flow based on the most sensitive material being cut.
⦁ Sintered Blades → Longer lifespan, multiple diamond layers, self-sharpening mechanism, better for tough materials.
⦁ Electroplated Blades → Single-layer diamonds, faster initial cutting but shorter lifespan.
Sintered blades are preferred for high-precision, high-durability applications.
⦁ Check for glazing – Dress the blade if needed.
⦁ Ensure correct RPM and feed rate – Adjust to improve efficiency.
⦁ Increase coolant flow – Helps keep diamonds exposed and reduces heat.
Replace the blade if worn – Continuous use of a dull blade increases chipping and process instability.
The maximum depth depends on blade thickness and material hardness.
⦁ Thin blades (≤100µm): Up to 2mm depth per pass.
⦁ Medium blades (100µm – 500µm): Up to 5mm depth per pass.
Thicker blades (>500µm): Can cut deeper but may require step-cutting to maintain quality.
⦁ Sintered Metal Bond → Longer life, superior rigidity, better form retention, ideal for hard materials.
⦁ Resin Bond → Smoother cuts on softer materials, faster initial cutting, shorter lifespan.
Sintered blades outperform resin bond blades in demanding, high-precision applications.
For multi-layered ceramics, composites, or bonded structures:
⦁ Start with lower feed rates to prevent delamination.
⦁ Use progressive step-cutting to maintain structural integrity.
⦁ Ensure coolant penetrates between layers to avoid overheating and uneven cutting.
Yes. SMART CUT® sintered blades can complement laser-assisted dicing by handling final separation cuts, improving edge quality, and reducing stress fractures in sensitive materials.
⦁ Use clean gloves to avoid contamination.
⦁ Store in original packaging to prevent warping or edge damage.
⦁ Avoid excessive force when mounting, as ultra-thin blades are more fragile.
Yes, we offer OEM private labeling, batch tracking, and custom laser-etched branding for bulk orders.
⦁ Frequent dressing ensures the blade remains sharp and prevents glazing.
⦁ Over-dressing may reduce blade life by prematurely exposing too many diamonds.
⦁ Recommended Approach: Dress only when performance declines (e.g., slower cutting speed, increased chipping, or excessive heat buildup).
Yes, these blades are compatible with ultrasonic-assisted dicing systems, which enhance cutting efficiency for brittle, high-precision materials like sapphire and ceramics by reducing cutting forces and minimizing chipping.
⦁ Humidity & Temperature: Excess moisture can lead to bond degradation; temperature fluctuations may cause material expansion, affecting cut precision.
⦁ Airborne Contaminants: Dust and debris can clog blade surfaces, reducing efficiency.
⦁ Vibration & Airflow: Unstable environments can disrupt spindle balance, impacting cut quality.
⦁ Blade misalignment or wobble → Check spindle and flange alignment.
⦁ Inconsistent feed rate → Optimize feed rate for material and blade thickness.
⦁ Vibration in the dicing machine → Inspect for mechanical wear or misbalanced blades.
⦁ Low-viscosity coolants improve chip removal and cooling efficiency.
⦁ High-viscosity coolants may reduce splashing and improve lubrication but could trap debris.
⦁ Electrostatic-sensitive applications require specialized low-foaming coolants.
⦁ Outside diameter tolerance: ±0.002” (higher precision upon request).
⦁ Blade thickness tolerance: ±5µm to ±15µm depending on application.
⦁ Runout tolerance: ≤ 0.001” for high-precision applications.
⦁ Higher SFPM (Surface Feet Per Minute): Faster cuts but increased wear.
⦁ Lower SFPM: More controlled cuts, but slower cutting speed.
Optimal SFPM varies based on material type and blade specification.
Yes, but special considerations must be taken:
⦁ Ensure no excessive heat buildup due to limited cooling options.
⦁ Use dry-cut optimized variants if coolant cannot be used.
No. These blades rely on continuous diamond exposure as the bond wears down. If the blade is dull, it is time for replacement.
⦁ Synthetic diamonds offer uniform size and predictable performance.
⦁ Natural diamonds may provide better toughness but with inconsistent grit shape.
SMART CUT® exclusively uses precision-graded synthetic diamonds for maximum control over cutting efficiency.
⦁ Ensure blade mounting is secure and properly aligned.
⦁ Verify correct spindle RPM and feed rate settings.
⦁ Inspect for uneven wear or bond breakdown.
⦁ Check machine vibration levels—loose parts or worn-out bearings can cause skipping.
Yes, we offer ESD-safe dicing blades for applications where electrostatic discharge is a concern, such as semiconductor and photonics glass cutting.
Yes. Submerged dicing reduces heat buildup, improves debris removal, and minimizes chipping for ultra-precise applications.
⦁ Metal Bond → Long life, high wear resistance, best for hard, brittle materials.
⦁ Vitrified Bond → Faster cutting speeds, better for softer materials requiring minimal heat generation.
Materials like ceramics, quartz, and optical glass expand with temperature changes. To prevent thermal damage:
⦁ Use a finer grit size to reduce cutting stress.
⦁ Optimize coolant flow to control heat buildup.
⦁ Choose a bond hardness that balances wear resistance with cutting precision.
⦁ Blade thickness – Thinner blades are more prone to flexing.
⦁ Feed rate – Too aggressive a feed rate can cause bending.
⦁ Machine stability – Improper spindle calibration increases deflection.
⦁ Material hardness – Harder materials require higher blade rigidity.
Yes, these blades are ideal for grooving and partial-depth cuts, provided that:
⦁ The feed rate and blade exposure are properly adjusted.
⦁ The material is adequately supported to prevent breakage.
⦁ Coolant flow is directed to avoid chip accumulation.
Yes, SMART CUT® offers coatings that:
⦁ Reduce friction and extend blade life.
⦁ Minimize electrostatic charge in sensitive applications.
⦁ Enhance wear resistance for aggressive cutting applications.
⦁ Run the blade at a moderate feed rate for the first few cuts.
⦁ Ensure coolant flow is optimal to prevent overheating.
Gradually increase the cutting speed as the blade settles into the process.
Yes, but selecting the correct diamond grit size, bond hardness, and concentration is critical to avoid layer separation or delamination.
⦁ Use precision flanges to maintain alignment.
⦁ Avoid over-tightening to prevent warping.
⦁ Ensure machine vibration is minimal to maintain straight cuts.
⦁ Flat-edge blades – Uniform cutting, smooth finishes.
⦁ Serrated blades – Higher removal rates, better coolant flow.
Segmented blades – Reduced heat buildup, better for deep cuts.
A narrow kerf increases material efficiency but requires higher blade precision.
A wider kerf provides better coolant flow and chip evacuation but increases material loss.
Yes, provided that the blade bond and diamond concentration are selected to withstand extreme temperature variations.
|
Parameter |
SMART CUT® Blade |
Competitor Blade |
|---|---|---|
|
Blade Size |
56 D × 0.1 T × 40 H |
56 D × 0.1 T × 40 H |
|
Diamond Grit Size |
4-6 µm |
4-6 µm |
|
Diamond Concentration |
100 |
100 |
|
Bond Type |
Metal Bond |
Metal Bond |
|
Spindle Speed |
30,000 RPM |
30,000 RPM |
|
Feed Rate |
100 mm/s |
100 mm/s |
|
Dimensional Accuracy |
±18 µm | ±20 µm |
|
Blade Lifespan |
6,200 meters (24% longer) |
5,000 meters |
|
Cutting Depth |
0.6 mm |
0.6 mm |
|
Burr Size |
<14 µm (Superior finish) |
<20 µm (More post-processing required) |
|
Performance Metric |
SMART CUT® Blade |
Competitor Blade |
|---|---|---|
|
Chipping (µm) |
<48 µm (Superior edge quality) |
62-75 µm (Higher chipping) |
|
Blade Life (Lines Processed) |
2,100 lines (More than 2× longer lifespan) |
950 lines |
|
Current Value (A) |
2.4 – 2.5 A |
2.3 – 2.5 A |
|
Performance Metric |
SMART CUT® Blade |
Competitor Blade |
|---|---|---|
|
Chipping (µm) |
<22 µm (Superior edge quality) |
>28 µm (Higher chipping) |
|
Blade Life (Meters Cut) |
8,300 m (Longer-lasting performance) |
7,000 m |
|
Current Value (A) |
2.3 – 2.5 A |
2.4 – 2.7 A |
|
Performance Metric |
SMART CUT™ Blade |
Competitor Blade |
|---|---|---|
|
Blade Type |
Metal Bond Diamond Blade |
Metal Bond Diamond Blade |
|
Blade Size |
56D × 0.2T × 40H |
56D × 0.2T × 40H |
|
Diamond Grit Size |
6–10 µm (Optimized for Si₃N₄) |
8–12 µm |
|
Diamond Concentration |
100 (High-density diamond) |
75 (Lower concentration) |
|
Blade Lifespan |
5,000 meters (30% longer) |
3,800 meters |
|
Chipping Size |
≤12 µm (Superior edge quality) |
≤22 µm (Higher chipping) |
|
Cutting Speed Stability |
Highly stable, maintains precision |
Prone to performance loss over time |
SMART CUT® Sintered metal bond dicing / slicing blades with a steel core offer exceptional strength and rigidity, making them well-suited for high-precision applications. The combination of the sintered metal bond and the steel core provides added durability, ensuring that the blade maintains its form during demanding cutting operations. These blades are perfect for deep or aggressive cutting, grooving, and slicing of a variety of materials, both delicate and tough. The added rigidity minimizes blade deflection, which is critical for maintaining consistent performance and protecting the workpiece from damage.
The reduced deflection helps lower operational costs by decreasing the likelihood of material defects and reducing the need for frequent blade replacements. These blades are available in diamond, CBN, and custom grit formulations, offering versatility to meet a wide range of cutting requirements.
The blade sizing and shape are highly customizable to suit specific applications, ensuring optimal performance across different materials and cutting conditions.
One of the key benefits of SMART CUT® sintered metal bond blades with a steel core is their extended lifespan. This design allows for longer periods of use, improving productivity and reducing downtime. Additionally, the blades can be equipped with or without water slots, depending on the cooling and lubrication requirements of the application. The edge design/radius can abrasive edge be customized enabling precise control over the depth, width, and shape of the cut.
Manufactured utilizing SMART CUT® technology, each diamond works like a small horse. Diamonds come in contact with the material in the right place and at the right time, working where you need them most. You get the maximum use out of diamond and bond.
Diamonds are oriented inside metal matrix, so that every diamond is better able to participate in cutting action.
The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT® Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.
Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.
This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.
Sintered (Metal bonded) diamond blades diamonds sintered and multiple layers of diamonds impregnated inside the metal matrix. Diamonds are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. Metal Bonded Dicing Blades are “impregnated” with diamonds. The compacted materials are then hot pressed or sintered to full density. Heating rate, applied pressure, sintering temperature and holding time, are all controlled according to the matrix composition. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any large variety of material. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting.
Sintered (metal bonded) dicing blades are recommended for cutting wide variety of materials from 45 to 75 on Rockwell Scale (5 to 9.5 on mohs scale of hardness). It is more wear resistant and holds diamond well in place, usually producing the highest yield/cutting ratio.
As a general rule of thumb, Metal Bond (sintered) diamond dicing blades longer than other diamond bond blades such as resin bond and electroplated (nickel bond) blades.
They wear evenly, and are known for their long life & consistency. Metal bond matrix does not protrude diamonds very high and hence usually requires lower cutting speeds than electroplated (nickel bond) and resin bond blades. In many dicing applications sintered (metal bond) dicing blades are used in applications which are not super hard or super brittle and with minimum tendency to produce chips or cracks.
We will work with you to determine your needs, and recommend the right parameters for your specific material/application. If you are not using SMART CUT® Sintered (Metal Bond) SCM series, you are loosing money & missing out on incredible performance.
|
Material / Application |
Material Abbreviation |
SMART CUT™ Blade Series |
Diamond Particle Size |
Bond Hardness |
Diamond Concentration |
|---|---|---|---|---|---|
|
FIBERGLASS |
FGS |
SC1M |
D126, D107, D91, D76, D54, D46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
CARBON |
CN |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
CERAMICS |
FRP, CS |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
CARBIDE TGC |
CE |
SC1M |
D91, D76, D54. |
VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
QUARTZ |
QZ |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
OPTICAL GLASS |
OG |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
PHOTONICS GLASS |
PG |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
MULTI-LAYER CERAMIC CAPACITORS |
BGA CSP MLCC |
SC1M |
30µm, 15µm, 9µm, 6µm, 45µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM CARBIDE |
PZT; TFDDH |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
SAPPHIRE, AL2O3 +Fe +Ti |
SE |
SC6M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
RUBY AL2O3 + Cr |
RY |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
LITHIUM NIOBITE LiNbO3 |
LN |
SC1M |
30µm, 15µm, 9µm, 6µm, 45µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
LITHIUM TANTILATE LiTaO3 |
LT |
SC1M |
30µm, 15µm, 9µm, 6µm, 45µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
ALUMINA (HYBRID SUBSTRATES AND CERAMICS PACKAGES |
AL |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
QFN, COPPER + EPOXY MOLDING |
QFN |
SC1M |
D126, D107, D91, D76, D54, D46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
ALUMINUM NITRIDE |
ALN |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
ZIRCONIA (ZrO2) |
ZA |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
BORON CARBIDE (B4C) |
BC |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
TITANIUM DIBORIDE (TiB2) |
TD |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
GLASS + SiO2 |
GSi |
SC6H |
30µm, 15µm, 9µm, 6µm, 45µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
SILICON |
Si |
SC1M |
D54, D46, 45µm, 30µm, 15µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
SILICON-CARBIDE SiC |
SC |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
ZINK-SELENIDE ZnSe |
ZS |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
BARIUM-TITINATE |
BTI |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
BISMUTH-SILICATE Bi12Si22 |
BS |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
BISMUTH-TELLURIDE |
BTE |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
GGGNaGd (W04)2 |
G2 |
SC1M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
GARNET |
G |
SC4H |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
KOVAR NiFeCo |
K |
SC4M |
30µm, 15µm, 9µm, 6µm, 45µm |
SBL, MHBL, MHBM |
LOW CONCENTRATION |
|
SILICON NITRIDE Si3N4 |
SN |
SC4M |
D91, D76, D54, D46, 45µm, 30µm , 15µm |
VVVSB, VVSB, VSB |
LOW CONCENTRATION |
|
STONE |
SE |
SC5M |
D107, D91, D76. |
VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
NON-FERROUS ABRASION RESISTANT MATERIALS |
NFARS |
SC6M |
D107, D91, D76. |
VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
HIGH SPEED TOOL STEELS |
HSTS |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
DIE STEELS |
DS |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
HARDENED CARBON STEEL |
HCS |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
INCONEL |
IL |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
MONEL |
ML |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
RENE |
RE |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
WASPALLOY |
WY |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
|
HARD FERROUS SUPERALLOYS |
HFS |
SC3M |
B126, B107, B91, B76, B54, B46 |
VVVHB, VVHB, VHBH, HBH, HBM |
HIGH CONCENTRATION |
** Letter Abbreviations: D-FOR DIAMOND, B -FOR CBN.
**** If Material or Application is not listed in the chart above, please inquire. We can provide proper blade specification for just about any type of material/application.
Material / Application
Material Abbreviation
SMART CUT™ Blade Series
Diamond Particle Size
Bond Hardness
Diamond Concentration
FIBERGLASS
FGS
SC1M
D126, D107, D91, D76, D54, D46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
CARBON
CN
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
CERAMICS
FRP, CS
SC1M
D54, D46, 45µm, 30µm, 15µm
SBL, MHBL, MHBM
LOW CONCENTRATION
CARBIDE TGC
CE
SC1M
D91, D76, D54.
VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
QUARTZ
QZ
SC1M
D54, D46, 45µm, 30µm, 15µm
SBL, MHBL, MHBM
LOW CONCENTRATION
OPTICAL GLASS
OG
SC1M
LOW CONCENTRATION
PHOTONICS GLASS
PG
SC1M
LOW CONCENTRATION
MULTI-LAYER CERAMIC CAPACITORS
BGA CSP MLCC
SC1M
30µm, 15µm, 9µm, 6µm, 45µm
LOW CONCENTRATION
THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM CARBIDE
PZT; TFDDH
SC1M
D54, D46, 45µm, 30µm, 15µm
LOW CONCENTRATION
SAPPHIRE, AL2O3 +Fe +Ti
SE
SC6M
D54, D46, 45µm, 30µm, 15µm
LOW CONCENTRATION
RUBY AL2O3 + Cr
RY
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
LITHIUM NIOBITE LiNbO3
LN
SC1M
30µm, 15µm, 9µm, 6µm, 45µm
SBL, MHBL, MHBM
LOW CONCENTRATION
LITHIUM TANTILATE LiTaO3
LT
SC1M
30µm, 15µm, 9µm, 6µm, 45µm
SBL, MHBL, MHBM
LOW CONCENTRATION
ALUMINA (HYBRID SUBSTRATES AND CERAMICS PACKAGES
AL
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
QFN, COPPER + EPOXY MOLDING
QFN
SC1M
D126, D107, D91, D76, D54, D46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
ALUMINUM NITRIDE
ALN
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
ZIRCONIA (ZrO2)
ZA
SC1M
D54, D46, 45µm, 30µm, 15µm
SBL, MHBL, MHBM
LOW CONCENTRATION
BORON CARBIDE (B4C)
BC
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
TITANIUM DIBORIDE (TiB2)
TD
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
GLASS + SiO2
GSi
SC6H
30µm, 15µm, 9µm, 6µm, 45µm
SBL, MHBL, MHBM
LOW CONCENTRATION
SILICON
Si
SC1M
D54, D46, 45µm, 30µm, 15µm
SBL, MHBL, MHBM
LOW CONCENTRATION
SILICON-CARBIDE SiC
SC
SC1M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
ZINK-SELENIDE ZnSe
ZS
SC1M
VVVSB, VVSB, VSB
LOW CONCENTRATION
BARIUM-TITINATE
BTI
SC1M
VVVSB, VVSB, VSB
LOW CONCENTRATION
BISMUTH-SILICATE Bi12Si22
BS
SC1M
VVVSB, VVSB, VSB
LOW CONCENTRATION
BISMUTH-TELLURIDE
BTE
SC1M
VVVSB, VVSB, VSB
LOW CONCENTRATION
GGGNaGd (W04)2
G2
SC1M
VVVSB, VVSB, VSB
LOW CONCENTRATION
GARNET
G
SC4H
VVVSB, VVSB, VSB
LOW CONCENTRATION
KOVAR NiFeCo
K
SC4M
30µm, 15µm, 9µm, 6µm, 45µm
SBL, MHBL, MHBM
LOW CONCENTRATION
SILICON NITRIDE Si3N4
SN
SC4M
D91, D76, D54, D46, 45µm, 30µm , 15µm
VVVSB, VVSB, VSB
LOW CONCENTRATION
STONE
SE
SC5M
D107, D91, D76.
VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
NON-FERROUS ABRASION RESISTANT MATERIALS
NFARS
SC6M
D107, D91, D76.
VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
HIGH SPEED TOOL STEELS
HSTS
SC3M
B126, B107, B91, B76, B54, B46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
DIE STEELS
DS
SC3M
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
HARDENED CARBON STEEL
HCS
SC3M
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
INCONEL
IL
SC3M
B126, B107, B91, B76, B54, B46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
MONEL
ML
SC3M
B126, B107, B91, B76, B54, B46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
RENE
RE
SC3M
B126, B107, B91, B76, B54, B46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
WASPALLOY
WY
SC3M
B126, B107, B91, B76, B54, B46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
HARD FERROUS SUPERALLOYS
HFS
SC3M
B126, B107, B91, B76, B54, B46
VVVHB, VVHB, VHBH, HBH, HBM
HIGH CONCENTRATION
** Letter Abbreviations: D-FOR DIAMOND, B -FOR CBN.
**** If Material or Application is not listed in the chart above, please inquire. We can provide proper blade specification for just about any type of material/application.
|
# |
Specification |
Description |
|---|---|---|
|
1 |
SC1M |
SMART CUT® (sintered, metal bond), High Concentration |
|
2 |
1A8 S16 A60 - 1A8 |
Blade shape: S8 (slot quality: 8 slots). Blades can be produced from 4 to 24 slots. A60: 60-degree cutting edge. Other angles are available by request. For blades without slots and angles, shape designation is 1A8. |
|
3 |
2.25" - Outer Diameter (D) |
Dicing blade outer diameter: 2.25 inches. Tolerance for all outer diameters: +/- .002" (custom tolerance available upon request). |
|
4 |
TE - Thickness of Blade |
Blade thickness: 0.004". Available in increments of .0001". |
|
5 |
T1 - T8 (Tolerance of Blade Thickness) |
Tolerances: T1: +.0001" (+2.5µm), T2: +.0002" (+5µm), T3: +.0003" (+7.5µm), T4: +.0004" (+10µm), T5: +.0005" (+12.5µm), T6: +.0006" (+15µm), T7: +.0007" (+17.5µm), T8: +.0008" (+20µm). |
|
6 |
H - Inside Diameter of the Blade |
Inside diameter: 1.575 inches. |
|
7 |
D46 (Abrasive Particle Size) |
Diamond size for SMART CUT® (SC) series dicing blades: 325/400 = D46 = 45/38µm. |
|
8 |
HBM |
Hard Bond Medium |
|
9 |
CE |
material to be cut: CARBIDE TGC |
XP-1 is a general-purpose dicing fluid within the SMART CUT® range, designed to reduce debris, improve tool life, and prevent corrosion, while ensuring smooth cutting and protecting sensitive materials from ESD.
XP-2 enhances lubrication for demanding applications, offering superior cutting speeds, tool longevity, and advanced cleaning capabilities for tough materials like SiC and sapphire.
XP-3 is ideal for high-pressure systems, offering consistent cooling performance without foam buildup.
XP-4 specifically protects electrostatic-sensitive components by eliminating ESD, reducing defects, and extending tool life during the dicing process.
We understand that your success depends on select the right dicing blade, and optimizing your dicing parameters to best fit your applications/needs. The more you understand about what we can do for you, the better our partnership will be. On our website you will find the Most Comprehensive Source of Information on Everything you wanted to know about diamond dicing blades & industrial diamond tools.
Largest Inventory of Precision & Ultra Thin Diamond Dicing Blades in the U.S. Available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.
"ONE OF THE MOST EXPERIENCED COMPANIES IN THE INDUSTRY"
Over the years we have enjoyed working with all types if clients, regardless of size. Proprietary dicing blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after cutting.
We Are a Partner In Your Success
Developing close ties with our customers is the foundation of our business. At the core of
our company is a team of world class engineers, knowledgeable customer service personnel here to serve you. Whether is designing or manufacturing a special solution. We will go out of our way to optimizing your process to ultimate level of efficiency.
American Manufacturer As one of the few remaining independent U.S.Diamond Tool & machine builders. We have the experience & tradition to help you remain at frontier of technology Our experience has been further enhanced by acquiring assets and processes from some of the oldest American tool manufacturers, along with their decades of experience and R& D. This has positioned us as one of the most experienced companies in the industry.
Our unique bond formulations, tool designs, stringent requirements, and utilization of exceptionally high-quality diamonds and raw materials ensure top-notch products that adhere to strict ISO 9000 standards.
Our proprietary technology allow us to control and regulate the dozens of variable that affect toolife, quality, & consistency
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UKAM Industrial Superhard Tools is a U.S. High Technology, Specialty Diamond Tool & Equipment manufacturer. We specialize in producing ultra thin & high precision cutting blades and precision cutting machines diamond drills, diamond micro tools, standard & custom advanced industrial diamond tools and consumables.
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