Quote Products
SMART CUT® 6008 LOW SPEED SAW
SMART CUT® 7005 Tube & Rod Cutting Machine
SMART CUT® Diamond Lapping Film
SMART CUT® Diamond Notch
SMART CUT ® Single & Multi Layered Electroplated Diamond Notch Grinding Wheel is designed for high-precision notch grinding of semiconductor wafers, including materials such as Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs), and Sapphire. Engineered using advanced electroplating technology, this wheel ensures exceptional performance in wafer processing, offering a high level of precision and durability for demanding semiconductor applications.
SMART CUT® Diamond Polishing Cloth Belts
Experience unparalleled finishing quality with our SMART CUT® Diamond Polishing Cloth Belts—where precision engineering meets enduring strength. These superior belts are meticulously engineered with diamond particles encapsulated in ceramic beads, securely bonded via resin to a robust J-weight cloth backing. They present an exceptional alternative to traditional superfinishing systems, delivering unmatched performance even in the absence of such equipment.
SMART CUT® RP 4000YX / 5000YX
SMART CUT® Micro & Miniature Diamond Core Drills
SMART CUT® Diamond & CBN Micro Drills, Sintered (Metal Bond)
Sintered (Metal Bond) Diamond Carving Points
Band Saw Blades
DIAMOND BACKGRINDING WHEELS
SMART CUT® Diamond Backgrinding Wheels are designed for precision thinning and flattening of silicon wafers, glass, and ceramic substrates. These high-performance wheels are used on backgrinding machines, including models from Disco, Okamoto, Strasbaugh, and other leading manufacturers. Available in sizes ranging from 8” to 14” O.D., they are engineered to handle a wide range of materials and applications, from semiconductor wafers to microelectronic packages.
