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SMART CUT®  Diamond Backgrinding Wheels are designed for precision thinning and flattening of silicon wafers, glass, and ceramic substrates. These high-performance wheels are used on backgrinding machines, including models from Disco, Okamoto, Strasbaugh, and other leading manufacturers. Available in sizes ranging from 8” to 14” O.D., they are engineered to handle a wide range of materials and applications, from semiconductor wafers to microelectronic packages.