Quote Products
SMART CUT® 6008 LOW SPEED SAW
SMART CUT® 7005 Tube & Rod Cutting Machine
SMART CUT® Diamond Lapping Film
SMART CUT® Diamond Notch
SMART CUT® Diamond Notch Grinding Wheels in Single & Multi Layered electroplated nickel bond & sintered (metal bond) are construction are developed for high precision notch formation on semiconductor wafers. These wheels support performance requirements for Silicon, Silicon Carbide, Gallium Arsenide, and Sapphire. The electroplated structure holds diamond particles firmly on the surface, producing accurate geometry, clean edges, and stable performance during continuous wafer processing. You receive predictable grinding behavior, long wheel life, and consistent notch dimensions under demanding production conditions.
SMART CUT® Diamond Polishing Cloth Belts
Experience unparalleled finishing quality with our SMART CUT® Diamond Polishing Cloth Belts—where precision engineering meets enduring strength. These superior belts are meticulously engineered with diamond particles encapsulated in ceramic beads, securely bonded via resin to a robust J-weight cloth backing. They present an exceptional alternative to traditional superfinishing systems, delivering unmatched performance even in the absence of such equipment.
SMART CUT® RP 4000YX / 5000YX
V-Groove Wheels, Sintered (Metal Bond)
V-Groove Wheels are specialized diamond tools designed with a sharp “V”-shaped profile that allows faceters to cut crisp, clean decorative grooves into gemstone surfaces. Manufactured with sintered (metal bond) construction and high-quality diamond concentrations, these wheels deliver the durability and precision required for both artistic gemstone cutting and professional production. They are widely used on fantasy faceting machines such as the Ultra Tec, where precise angles and repeatable patterns are essential to advanced gemstone design.
SMART CUT® Micro & Miniature Diamond Core Drills
Sintered (Metal Bond) Diamond Carving Points
Diamond Band Saw Blades
DIAMOND BACKGRINDING WHEELS
SMART CUT® Diamond Backgrinding Wheels are designed for precision thinning and flattening of silicon wafers, glass, and ceramic substrates. These high-performance wheels are used on backgrinding machines, including models from Disco, Okamoto, Strasbaugh, and other leading manufacturers. Available in sizes ranging from 8” to 14” O.D., they are engineered to handle a wide range of materials and applications, from semiconductor wafers to microelectronic packages.
