Quote Products
Nickel Bond Dicing Blades
SMART CUT® Nickel Bond Hubless Dicing Blades are designed to provide exceptional precision, longevity, and consistency for cutting a wide range of materials. Engineered with a high diamond concentration and advanced Nickel bond matrix, these blades deliver efficient cutting performance with minimal heat generation. Their ability to maintain excellent form retention and diamond exposure makes them ideal for applications requiring high accuracy, such as wafer dicing, thin substrate cutting, and microelectronics fabrication.
The Nickel binder used in these blades is specifically developed to offer a hard bond for soft materials, ensuring longer blade life and reduced wear rates. This unique combination of bond structure and abrasive composition allows for faster cutting while minimizing chipping, making it an optimal choice for materials such as printed circuit boards (PCB), silicon, and ball grid array (BGA) components. By maintaining sharp diamond exposure throughout the cutting process, these blades enhance material removal efficiency while ensuring a stable and controlled cut.
SMART CUT® Diamond Cylindrical Grinding Wheels
SMART CUT® Diamond Cylindrical Grinding Wheels are engineered for the precise peripheral grinding of silicon ingots, making them an ideal choice for industries such as semiconductors, electronics, automotive, and photovoltaics. These high-performance grinding wheels are designed to process the outer surfaces of silicon ingots, ensuring accurate orientation flats are created, which are essential for subsequent processing steps. The addition of the orientation flat, a marked edge indicating the crystallographic plane of the wafer, is crucial for the wafer's alignment in future manufacturing processes.
During the post-slicing phase, wafers undergo shaping and smoothing through peripheral grinding.
SMART CUT® 1040 Precision Cutting Machine
SMART CUT® 2010 Table Top Petrographic Precision Cutting Machine
SMART CUT® 6008 LOW SPEED SAW
SMART CUT® 7005 Tube & Rod Cutting Machine
SMART CUT® Diamond Lapping Film
SMART CUT® Diamond Notch
SMART CUT ® Single & Multi Layered Electroplated Diamond Notch Grinding Wheel is designed for high-precision notch grinding of semiconductor wafers, including materials such as Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs), and Sapphire. Engineered using advanced electroplating technology, this wheel ensures exceptional performance in wafer processing, offering a high level of precision and durability for demanding semiconductor applications.
SMART CUT® Diamond Polishing Cloth Belts
Experience unparalleled finishing quality with our SMART CUT® Diamond Polishing Cloth Belts—where precision engineering meets enduring strength. These superior belts are meticulously engineered with diamond particles encapsulated in ceramic beads, securely bonded via resin to a robust J-weight cloth backing. They present an exceptional alternative to traditional superfinishing systems, delivering unmatched performance even in the absence of such equipment.
