Quote Products

Nickel Bond Dicing Blades​

SMART CUT®  Nickel Bond Hubless Dicing Blades are designed to provide exceptional precision, longevity, and consistency for cutting a wide range of materials. Engineered with a high diamond concentration and advanced Nickel bond matrix, these blades deliver efficient cutting performance with minimal heat generation. Their ability to maintain excellent form retention and diamond exposure makes them ideal for applications requiring high accuracy, such as wafer dicing, thin substrate cutting, and microelectronics fabrication. The Nickel binder used in these blades is specifically developed to offer a hard bond for soft materials, ensuring longer blade life and reduced wear rates. This unique combination of bond structure and abrasive composition allows for faster cutting while minimizing chipping, making it an optimal choice for materials such as printed circuit boards (PCB), silicon, and ball grid array (BGA) components. By maintaining sharp diamond exposure throughout the cutting process, these blades enhance material removal efficiency while ensuring a stable and controlled cut.

Precision Arbors

Precision Arbors Precision Arbors is a high-performance mounting accessory designed for use with diamond, carbide, and abrasive cut-off blades. Engineered

SMART CUT VP – Vibratory Polisher

SMART CUT VP – Vibratory Polisher SMART CUT® VP Vibratory Polisher is an advanced precision tool designed to meet the

SMART CUT® Diamond Cylindrical Grinding Wheels

SMART CUT®  Diamond Cylindrical Grinding Wheels are engineered for the precise peripheral grinding of silicon ingots, making them an ideal choice for industries such as semiconductors, electronics, automotive, and photovoltaics. These high-performance grinding wheels are designed to process the outer surfaces of silicon ingots, ensuring accurate orientation flats are created, which are essential for subsequent processing steps. The addition of the orientation flat, a marked edge indicating the crystallographic plane of the wafer, is crucial for the wafer's alignment in future manufacturing processes. During the post-slicing phase, wafers undergo shaping and smoothing through peripheral grinding.

SMART CUT® Diamond Edge Grinding Wheels (Electroplated)

SMART CUT® Diamond Edge Grinding Wheels are engineered to deliver exceptional performance for precision grinding applications, providing superior results in both rough and fine grinding. These wheels are ideal for use in industries that require highly accurate EDM processing and consistent wafer-to-wafer results. Manufactured with synthetic diamond grit, SMART CUT® wheels offer improved surface roughness and extended tool life due to their tightly controlled diamond distribution and uniform bond structure.

SMART CUT® 1040 Precision Cutting Machine

SMART CUT® 1040 Precision Cutting Machine The Automatic Extra-Large Heavy-Duty Cutting Machine is specifically designed for precision sectioning of petrography

SMART CUT® 2010 Table Top Petrographic Precision Cutting Machine

SMART CUT® 2010 Table Top Petrographic Precision Cutting Machine SMART CUT® 2010 Table Top Petrographic Precision Cutting Machine is a

SMART CUT® 6008 LOW SPEED SAW

SMART CUT® 6008 LOW SPEED SAW SMART CUT®  6008 Low Speed Precision Saw is a state-of-the-art solution designed for precise

SMART CUT® 7005 Tube & Rod Cutting Machine

SMART CUT® 7005 Tube & Rod Cutting Machine SMART CUT® 7005 is Designed for high-performance and precision, our Tube &