Bond Type
SMART CUT® Series 400 Wafering Blade, Resin Bond
Resin Bond Diamond Wafering Blades for use on Precision & Laboratory type Cut off Saws
SMART CUT® Series 400 are Designed for Precision, Chip Free cutting of wide variety of materials These are very thin kerf blades and are very delicate. Must be used on high precision specialized laboratory cutting saws (not tile saws, trim saws, etc) The diamond section can be easily broken if the material moves while cutting, blade is dropped, material is feed to fast into the blade, material is not fed consistently straight into the blade (shifts position) etc. Diamond Size is Medium providing faster cutting speed, while still providing surface quality unmatched by 95% of other blades.
SMART CUT™ Series 2000
SMART CUT™ Series 2000 is the most commonly used Resin Bond Diamond Cut off Blades. Perfect for cutting soda lime and borosilicate glass tubing, ceramic tubing (al203, silicon carbide, sapphire, tungsten carbide, metals, alloys, etc. May be used dry on some applications (although this is not recommended). Always use coolant for best results.
