Bond Type
SMART CUT® 2010
Diamond, Nickel Bond Cut Off Blades for Laboratory & Abrasive Cut Off Saws
Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Unlike sintered (meal bond) cutting blades where diamond is impregnated inside metal binder matrix based on bronze, copper, nickel and other alloys.
SMART CUT® 205M
SMART CUT Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
SMART CUT® 320MS
Narrow Slot Segment Design - Diamond Depth (Height): 5mm - 16" to 36" Diameter
SMART CUT® Series slabbing sintered (metal bond) diamond cut off blades, are Segmented Design with (narrow spacing between the segments). Designed for smooth cutting of ultra hard materials. Such as soft rocks & minerals, advanced ceramics, glass, composites, and some metals. Perfect for users who wish to minimizes loss of valuable material. This is a popular slabbing blade used among geological laboratories. Most widely used blade for cutting precious & semi precious stones / rocks. SMART CUT® Series slabbing sintered (metal bond) diamond cut off blades, are Segmented Design with (narrow spacing between the segments). Designed for smooth cutting of ultra hard materials. Such as soft rocks & minerals, advanced ceramics, glass, composites, and some metals. Perfect for users who wish to minimizes loss of valuable material. This is a popular slabbing blade used among geological laboratories. Most widely used blade for cutting precious & semi precious stones / rocks.
SMART CUT® 330MS segmented lapidary blade
SMART CUTTM Series - 330MS Wide Slot Segment Design - Diamond Depth (Height): 8mm SMART CUT Series 330MS Wide spacing between segments. Designed for fast and more aggressive cutting, where chipping and very smooth cut loss is not essential. And loss of material is not critical. Perfect for medium to hard lapidary materials, and less experienced blade users.
SMART CUT® Braised Bond Diamond Band Saw Blades
SMART CUT® CBN WAFERING BLADES SINTERED (METAL BOND)
SMART CUT® DIAMOND WAFERING BLADES SINTERED (METAL BOND)
SMART CUT® Fully Sintered (Metal Bond) Diamond & CBN, Wafering Blades
Smart Cut® Glass Blade
SMART CUT Fully Sintered (Metal Bond) diamond wafering blades are fully sintered from OD to ID of the blade. Meaning they have diamonds completely impregnated through the blade. Unlike standard diamond & cbn wafering blades with steel core and diamond section. Instead of having a steel core and small diamond bond edge (usually 1/8"/3.2mm). The diamond edge is all the way through the blade, from its Outside Diameter to Inside Diameter of the blade. You can use until the entire Outside Diameter of the blade is consumed.
SMART CUT® Series – 405M
SMART CUT® Series 100N Wafering Blade, Nickel Bond
NICKEL BOND, DIAMOND CONTINUOUS RIM
SMART CUT® Series 100N will provide finer cut quality than interrupted rim nickel bond wafering blades. Best suited for cutting soft and fragile crystals, silicon wafers & substrates, fiberglass, glass fibers. made with stainless steel core Standard arbor size inside diameter is ½” (12.7mm) (* we can modify arbor size of any blade to anything you want same day for a small additional fee, if needed) Nickel Bond Diamond Cut off blades Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.
