SMART CUT™ SERIES

 NICKEL BOND (hubbed)  - DIAMOND / CBN DICING BLADES 

USED ON ANY DICING/SLICING SAW & LARGE VARIETY OF MATERIALS/APPLICATIONS. Typical operating conditions for wafer dicing: RPM: 25,000 -40,000 (Maximum blade operating speed: 45,000 RPM’s) Feed rate: 50-200mm/s [2-8 in./sec.] Materials: Silicon, GaAs, SiGe, etc. Depth of cut: 100μm to 1mm (0.004" to 0.040") Mounting: Tape. Machine: Disco, K&S, TSK, etc.   BLADE EXPOSURE AVAILABLE: Standard Exposure   Long Exposure Ultra Long Exposure

Excellent cut quality with low wear rate Stronger Blade Superior Cut Quality Less Chipping Improved Kerf Wdith Creates very thin kerfs, < 50 microns can handle high exposure to width ratios Improved Diamond Exposure, requires less blade dressing than other blades used to cut silicon and III-V (semiconductor) material

BENEFITS: Increase Blade Life Reduce Chipping Reduce Blade Wear Increase Process Consistency Maintain Consistent Cutting Speed Reduce Blade Change & Mounting Cost Reduce Cost ADVANTAGES: maximum cutting performance no glazing faster cutting action improved surface finish quality better coolant retention No Material Deformation No Contamination Join our mailing list to receive valuable information, tips on optimizing your dicing process, FREE products, & special offers       Name:       Email:

UKAM Industrial Superhard Tools proprietary blade manufacturing processes, which allow precise control of diamond grit size, diamond concentration, and nickel bond hardness, are used to optimize these variables and produce hub blades that offer unparalleled cut quality, blade life and throughput. SMART CUT™ series Nickel Bond Hubbed diamond dicing blades provide excellent performance on large variety of applications ranging from silicon dicing, very brittle III-V compound materials, PZT ceramics, tantalates, aluminas, to silica filled plastics for chip scale package singulation. Manufactured utilizing SMART CUT™ technology, each  diamond  works  like  a  small  horse. Diamonds  come  in  contact  with  the  material  in  the  right  place  and  at  the  right  time,  working  where  you  need  them  most. You  get  the  maximum  use  out  of  diamond  and  bond. Diamonds are oriented inside metal matrix, so that every diamond is better able to participate in cutting action. SMART CUT™ series Nickel Bond Hubbed diamond dicing blades consist of a precisely made hub, shaped for optimum cooling results. The hub carries an electrodeposited layer of proprietary nickel alloys and diamond grains. When the supporting aluminum is etched back, a free standing nickel diamond matrix remains. The length of this free standing (exposed) diamond rim determines how deep the blade can cut. Please see formula below for more information.

Blade Thickness

Maximum thickness of the plated Nickel bond diamond layer (measured across the diamond peaks). Blade thickness ranges from 15 to 65 microns for fine diamond mesh sizes. 30 to 130 microns from medium mesh sizes and 80 to 350 microns for coarser diamond particles. Blade thickness to be selected is the cutting street width of the substrate divided by 2.2 to 2.5. Blade thickness should be based on street width and required distance from the edge of the street toward the kerf, within which chipping, cracking or other defects are not acceptable.

Blade Exposure

Blade exposure is the minimum dimensions of the nickel rim to protrude over the aluminum hub. Selecting the proper blade exposure is function of total cut depth. Due to the self sharpening nature of the nickel bond diamond matrix, this dimension will be reduced during operation by wear. Blade exposure to be selected by cutting into substrate is 

E1 = CS + SG + BW

for cutting through a substrate into a sporting dicing tape, the amount of cutting into the tape must be added to the above formula:

E2 = CT + CS + SG + BW

Typical dimensions are

CS = Cutting Substrate depth = Cut depth or material thickness

SG = Safety Gap between alu-Hub and substrate

BW = Amount of Blade to be worn (used up) during 

For Example: Exposure for a 600 micron substrate cutting into tape is 30 + 600 + 130 + 200 = 960 microns. Recommended maximum blade exposure is about 25 x blade thickens for soft nickel alloy bond and 35 x blade thickness for hard nickel alloy bond.

Excessive exposure can cause number of problems such as blade wobble, wider kerf cuts, increased blade wear and unacceptable cut quality.

Variables to consider when selecting the right Nickel Bond Hubbed Dicing Blade for your application:

• Blade Exposure

• Blade Thickness

• Diamond Mesh Size

• Nickel Bond Hardness

• Diamond Concentration

Ultra Long Exposure

for cutting very thick materials such as multi layered ceramic capacitators (MLCC). Recommended diamond size for these applications 15 to 25 microns.

Minimum thickness: 150 microns

Minimum exposure: 4mm

Maximum Exposure:

58mm OD  -  4mm and 4.5mm

59mm OD  -  5mm, 5.5mm, and 6mm

Nickel Bond Hardness

Bond hardness determines how fast the nickel bond dicing blade will protrude/release its sharpest point of diamond particles in order to maintain consistent cut quality. Smoothness of diamond abrasive particles of the substrate, without considering diamond grit size is influenced by the stability of the bond binder. As the diamond particles become dull during usage, the speed and force required for their release from bond matrix. depends on strength they are bonded with. Hard nickel alloys firmly hold diamonds in place. They typically wear less and hence have little self sharpening. Softer nickel alloys on the other hand release dull diamond easily. And more frequently expose continuously sharp diamond particles. For this reason they are more self sharpening. SMART CUT™ series Nickel Bond Hubbed diamond dicing blades are available in soft or hard nickel alloys depending on customers dicing objective of clean cut quality vs. long blade life.

Diamond Mesh Size

Nickel hardness and size of diamond particles plays a major role in determining cut quality, feed rate, RPM's, blade life, and overall performance. Finer diamond particles produce very smooth cut quality, along with minimum kerf less, and most minimal amount of chipping. Smaller diamond particles are release from bond faster, exposing new sharp diamond particles and maintaining excellent cut quality. The trade off is lower blade life and much slower cutting speeds. Since smaller/finer diamond particles remove less material, they require higher spindle speeds and slower feed rates. Finer diamond particle nickel bond dicing blades, also tend to load up (clogging diamond particles cavities with material residue being cut). Coarser size (larger) diamond particles provides much higher feed rates. Coarser diamond nickel bond dicing blades provide longer life and exhibit very little tendency to load up. The trade off more chipping, greater kerf loss, and rougher cut quality. SMART CUT™ series Nickel Bond Hubbed diamond dicing blades are available in large variety of diamond particle sizes, please see table below for more information.

Long Exposure

Recommended for soft ceramic substrates, PCB's, BGA's, and some metals. For these applications coarser diamond particles are embedded into nickel.

Typical Diamond Mesh Sizes:

Maximum Exposure:

55.55mm OD  -  3mm

58mm OD - 4mm

Terms of Use