SMART CUT® DIAMOND DICING / SLICING SAW

The SMART CUT® DIAMOND DICING / SLICING SAW is designed for laboratory and R&D use. It can be used for slicing, dicing, or cutting various materials, including up to 4″ diameter wafers or rectangular materials measuring up to 8″ in length, 4″ in width, and 1″ in depth.

The machine is fully controlled by a computer, which can be any PC or desktop computer. It offers a high position accuracy of 0.01 mm or better.

The machine comes “Ready to Use” with a laptop pre-installed with graphical user-friendly software and a USB cable. It also includes a Lexon enclosure for use in a laboratory environment. Additionally, a sample stage with two-angle adjustment is included for cutting materials at desired angles with +/- 0.5-degree tolerance. The machine has variable speed, with speeds of up to 3,000 RPM.

The machine accepts various types of blades, including Precision Diamond Slicing, Dicing, and Wafering Blades ranging from 3″ to 6″ in diameter. These blades can be of different bond types, including sintered (metal bond), resin bond, and electroplated (nickel bond) hubless blades, such as 1A1R, 1A8, 1A1, and more.

.004” (100 microns)

The SMART CUT® DIAMOND DICING / SLICING SAW comes with a one-year limited warranty, along with lifetime support. Please note that the warranty does not cover damages caused by misuse, inadequate storage, or user-induced breakages.

Yes, the machine is CE certified, ensuring it meets safety and quality standards.

Yes, the machine offers an optional Digital Microscope Head that allows you to monitor the cutting process in real-time on a PC screen. It can also be connected to the stereo microscope for enhanced observation.

Additional accessories available for this machine include a 4″ rotary table, a Precision Cross Mount Vise for Slicing/Dicing Saw, a Heavy Duty Coolant Circulating Tank with Pump, a 4″ Vacuum Chuck, and Wafer Bonding Tape for Vacuum Chuck. A full enclosure made from Lexon is also provided to maintain an enclosed cutting environment.

Yes, the SMART CUT® DIAMOND DICING / SLICING SAW is versatile and can be used to cut a wide range of materials, including optical, optoelectronic, semiconductor, ceramic, and related materials that need to be sectioned into smaller squares or rectangles.

The machine offers a high level of precision with a moving resolution of 0.0025 mm and a position accuracy of 0.01 mm. This ensures accurate and consistent cutting results.

Yes, the machine comes with user-friendly Windows-based software pre-installed on the included laptop. It allows you to easily set parameters such as sample shape, cut width, number of slices, cut depth, and blade kerf. The graphical interface simplifies the operation.

Yes, the machine can be manually operated using rotary hand wheels if necessary, providing flexibility in how you control the cutting process.

Yes, the machine comes with assemblies for water jetting, draining, and splashing protection. This ensures effective cooling and protection during the cutting process.

Yes, the machine includes a Lexon enclosure, making it suitable for use in a laboratory setting where environmental control is important.

The machine can cut wafers up to 4″ in diameter, providing flexibility for various applications.

Yes, the machine comes with comprehensive technical documentation and user manuals to assist with installation, operation, and maintenance.

The machine accepts an unlimited number of blade specifications, ensuring it can be tailored to fit almost any application. Additionally, it can be adapted with additional accessories and components as needed.

The shipping weight of the machine is approximately 150 lbs, and its dimensions are 43″L x 30″W x 34″H (inches). The net weight of the machine is 28.5 kg, with dimensions of 580 L x 560 W x 660 H (mm).

The machine operates on a brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm. It consumes approximately 180W of power.

22. Is there an option for upgrading the microscope to digital for sample observation?

Yes, you have the option to upgrade the microscope to a digital microscope head, allowing you to observe sample cuts on a computer screen.

Yes, the machine includes a Precision Cross Mount Vise for Slicing/Dicing Saw, which is designed for cutting samples with a precision 90-degree angle (+/- 0.2 degrees) without the need for alignment.

The 4″ rotary table is used for precision rotating operations, while the vacuum chuck is used to securely hold wafers or substrates in place during the cutting process.

Yes, a 4-liter capacity heavy-duty coolant circulating tank with a pump is designed for use with the slicing/dicing saw to provide effective cooling during cutting operations.

Diamond blades are highly durable and can provide precise cuts, making them ideal for various materials. They can offer cleaner cuts and longer blade life compared to other blade types.

Yes, the machine operates with G code behind the user-friendly interface GUI. This allows the operator to program and control the machine’s operation directly if needed, offering advanced control options.

The vacuum chuck is used to securely hold wafers or substrates in place during the cutting process. When the vacuum valve is opened, the vacuum chuck creates suction, firmly gripping the material and ensuring stability during cutting.

The heavy-duty coolant circulating tank with a pump is designed to provide a continuous flow of coolant during cutting operations. It helps dissipate heat and maintains a stable cutting environment.

Yes, the machine can be used with Wafer Bonding Tape for Vacuum Chuck to bond thin substrates (less than 2.0 mm thickness) to the vacuum chuck securely, allowing for precision cutting.

A wafer or substrate is placed on removable adhesive film, which is then placed on the vacuum chuck. When the vacuum valve is opened, the vacuum chuck creates suction, firmly adhering the material through the adhesive film for cutting.

The full enclosure helps maintain an enclosed cutting environment, providing a controlled and safe workspace. It prevents debris from escaping during the cutting process and ensures operator safety.

Yes, the machine includes a sample stage with two-angle adjustment, allowing customers to cut materials at desired angles with a tolerance of +/- 0.5 degrees.

Yes, technical support is available to assist with the installation and setup of the SMART CUT® DIAMOND DICING / SLICING SAW, ensuring you can start using it effectively.

The Heavy Duty Coolant Circulating Tank operates on 208V to 240V power supply. If you need a 110V power supply, you can order a 200W transformer separately.

Yes, the machine can be used with a stereo microscope that provides 50X magnification and has a built-in reticule (scale) in nanometers and inches, making it suitable for high-magnification applications.

The 4″ rotary table is designed for precision rotating operations. It allows for accurate positioning and rotation of workpieces during cutting or other operations. It’s especially useful when precision alignment is required.

The 4″ rotary table is designed to handle small workpieces and is suitable for use with the SMART CUT® DIAMOND DICING / SLICING SAW and similar equipment. It is not designed for heavy loads.

Yes, the machine is flexible and can accept an unlimited number of blade specifications, allowing you to adapt it to various cutting applications.

You can contact the manufacturer or supplier to inquire about spare parts or additional accessories for the SMART CUT® DIAMOND DICING / SLICING SAW. They will assist you in obtaining the necessary components for your specific needs.

While primarily designed for laboratory and R&D use, it can also be used for production applications where precision cutting is required.

Yes, the machine can cut materials as thin as 1 mm with precision, making it suitable for delicate samples.

The Lexon enclosure and water cooling system help provide a safer working environment by containing debris and dissipating heat during cutting. Operators should still follow safety guidelines and wear appropriate protective gear.

Yes, the machine’s sample stage with two-angle adjustment allows for cutting materials at different angles, providing versatility in cutting various shapes.

Routine maintenance may include cleaning, blade replacement, and checking for loose parts. Detailed maintenance instructions can be found in the user manual.

Yes, the machine is suitable for research involving semiconductor materials and can help in sectioning semiconductor wafers into smaller pieces for analysis.

The machine’s G code-based software allows for customization to meet specific research needs. Users with programming skills can tailor the software to their requirements.

The machine can cut materials up to 1 inch (25.4 mm) in depth, providing ample depth for most applications.

Yes, the machine’s data can be exported and analyzed using third-party software tools for further research and analysis.

Yes, the machine can be shipped internationally, accept for countries where export is limited by US goverment

The time required to become proficient with the SMART CUT® DIAMOND DICING / SLICING SAW can vary depending on the operator’s familiarity with similar equipment and the complexity of the cutting tasks. However, with the user-friendly software and comprehensive documentation, users can typically become proficient relatively quickly.

The number of slices that can be made in one operation depends on various factors, including the material being cut and the desired slice thickness. The software allows you to specify the number of slices, and the machine can handle multiple slices in a single operation.

Yes, the SMART CUT® DIAMOND DICING / SLICING SAW is suitable for research on advanced materials such as ceramics and composites, offering precise cutting capabilities for various materials.

Yes, you can use your own laptop or computer to control the machine as long as it meets the necessary system requirements and is compatible with the machine’s software.

The machine is calibrated during the manufacturing process to ensure its accuracy. Additionally, users can fine-tune and calibrate the machine as needed using the software.

Yes, the machine’s precise control and adjustable settings allow for cutting delicate and brittle materials without causing damage, provided the correct parameters and blades are selected.

While the machine offers safety features such as the Lexon enclosure and water cooling system, it’s important to follow all safety guidelines and recommendations for safe operation.

With proper maintenance and regular use, the SMART CUT® DIAMOND DICING / SLICING SAW can have a long operational lifespan. The robust design and quality components contribute to its durability.

While primarily designed for cutting and slicing applications, it may be adaptable for certain NDT applications that involve sectioning materials for inspection.

In addition to the provided safety features, operators should wear appropriate personal protective equipment (PPE) and follow all safety guidelines for the materials being cut.

The machine can cut materials up to 1 inch (25.4 mm) in depth, making it suitable for a wide range of materials.

Yes, the machine can be used for thinning semiconductor wafers to achieve the desired thickness.

Yes, remote support is available over phone and video chat

Yes, the machine is suitable for research on materials used in microelectronics and nanotechnology, providing precise cutting capabilities for these applications.

Yes, the machine can be used for cutting materials that require a clean and contamination-controlled environment, thanks to the included Lexon enclosure.

While the machine is primarily designed for non-biological materials, it may be suitable for some applications involving biomaterials or softer biological samples if the appropriate blades and conditions are selected.

Cleaning and maintenance procedures are typically outlined in the user manual. Regular cleaning, blade inspection, and lubrication of moving parts are essential for machine longevity.

Operators should follow local regulations and guidelines for disposing of waste materials generated during the cutting process, ensuring safe and responsible disposal practices.

While the machine is designed for primarily flat or rectangular materials, it can be adapted for cutting irregular shapes or contours by carefully aligning the material and making multiple cuts.

The turnaround time for cutting operations can vary depending on factors such as material type, thickness, and desired precision. It’s advisable to perform test cuts and optimize settings for specific requirements.

The machine’s software may have options for data logging and management, allowing users to track and analyze cutting parameters and results.

The machine is primarily designed for non-metallic materials. While it may be used for some metal applications, its capabilities are better suited for materials like semiconductors, ceramics, and optics.

Ongoing costs may include blade replacement and occasional maintenance. These costs can vary depending on usage and the specific application.

Yes, the machine can be used for cutting brittle materials like glass or quartz when equipped with the appropriate blades and cutting parameters.

While the machine can accept a variety of blade types, it’s advisable to consult with the manufacturer or supplier for recommendations regarding blade compatibility and quality.

In some cases, the machine may be integrated into automated manufacturing processes, especially when precise cutting is required as part of a larger production line.

Yes, the machine can be used to create custom shapes and patterns in materials by carefully controlling the cutting path and parameters.

The machine’s software may include features for setting cutting parameters based on material type and characteristics, allowing for more efficient and precise cutting.

Yes, guidelines and recommendations for blade selection based on material type are typically provided in the machine’s documentation or by the manufacturer to help users achieve optimal cutting results.

Yes, the machine is suitable for creating thin sections of materials for microscopy and analysis, providing precise control over section thickness.

It’s important to be aware of any regional or international regulations, restrictions, or import/export requirements when shipping or using the SMART CUT® DIAMOND DICING / SLICING SAW, especially for international shipments. Compliance with local laws and regulations is essential.

The machine’s Lexon enclosure and water cooling system help control debris and fumes during cutting. However, it’s crucial to follow safety guidelines and conduct risk assessments for materials that may produce hazardous byproducts during cutting.

Depending on the software and control options, some machines may offer remote monitoring and control capabilities, allowing users to oversee cutting processes from a distance.

Yes, the machine can be adapted with custom jigs or fixtures to accommodate specific cutting tasks and workpieces. Customization options are available for tailoring the machine to your needs.

Operators should follow safety precautions for handling and disposing of diamond blades, which may include wearing protective gear and disposing of used blades according to local regulations.

Extended warranty options may be available for purchase, depending on the manufacturer or supplier. It’s advisable to inquire about extended warranty coverage when purchasing the machine.

The machine’s water cooling system helps maintain a stable cutting environment, which can be beneficial for cutting materials sensitive to temperature changes. However, it’s essential to consider the specific requirements of the material being cut.

Many machines are equipped with an emergency stop or safety shutdown feature to ensure the safety of operators in case of unexpected issues during operation.

The machine can be used for cutting abrasive materials, but it’s essential to select appropriate blade types and be prepared for more frequent blade replacements due to wear.

Yes, the machine is suitable for precision cutting in microfluidics and microfabrication applications, where accuracy and control over cut dimensions are crucial.