| Company
|
SMART CUT™ SERIES
REDUCED
WEAR RESIN BOND - DIAMOND
/ CBN DICING BLADES
NEW
GENERATION & TECHNOLOGY
 USED
ON ANY DICING/SLICING SAW & LARGE VARIETY OF
MATERIALS/APPLICATIONS. |
|
| |
|
|
BENEFITS:
-
Increase
Blade Life
-
Reduce
Chipping
-
Reduce
Blade Wear
-
Increase
Process Consistency
-
Maintain
Consistent Cutting Speed
-
Reduce
Blade Change & Mounting Cost
-
Reduce
Cost
ADVANTAGES:
|
SMART
CUT™ Resin series New
Generation & Technology Dicing Blade is the
highest performance Resin Bond Dicing Blade available today! SMART
CUT™ Resin Dicing Blade lasts
longer than any resin bond diamond dicing blade and maintains
better form & shape consistently through its life. Resin
Bond dicing blade are typically more forgiving, self dressing, and
freer cutting. Excellent choice for Ultra Hard & Brittle
Materials. Recommended for applications where cut quality and
surface finish is very important.
 |
Manufactured
utilizing SMART CUT™
technology, each
diamond works
like a
small horse.
Diamonds come
in contact
with the
material in
the right
place and
at the
right time,
working where
you need
them most.
You get
the maximum
use out
of diamond
and bond. |
Diamonds
are oriented inside metal matrix, so that every diamond is better
able to participate in cutting action.
|
|
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SMART
CUT™ Resin series New
Generation & Technology Dicing Blade are produced using phenolic resin as the
binder, diamond abrasive as cutting media, ceramic & other advanced
components as filler. UKAM Industrial Resin Bond Blades are manufactured
with advanced molding process. available in a large variety of geometries,
diamond sizes, diamond concentrations, and bond harnesses. |
 |
Resin
bond dicing blades are made with high temperature phenolic resin,
diamond particles, ceramic filler and often additional additives.
Resin Bond is the softest of all the bonds, frequently used in
applications that require a smooth surface. This type of dicing
blade is used on majority of ultra hard & brittle materials.
Resin bond dicing blades allow the bond matrix to wear faster, and
allow for diamond particles/crystals to break out of their matrix
faster, so that new sharp diamond particles become exposed. This
self sharpening characteristic of resin bond dicing blades, based
on faster bond wear out is what make this blade choice in almost
half of all dicing application. Typical Resin Bond Diamond Blades
last less than Sintered (Metal Bond) diamond blades, but more than
electroplated (nickel bond) diamond blades. finish and minimum
amount of chipping.
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|
Some
disadvantages of resin bond dicing blades is resin bond must
remain very fragile in order to expose new diamonds. Resin bond is
the softest of the all the dicing bond matrixes. For this reason,
strong and high quality diamonds cannot be used in a resin bond.
High quality diamonds are harder than a resin bond matrix, and
would soon disintegrate the bond that keeps them in place. This
brings about the need for frequent blade dressing, causing the cut
to loose its roundness or form.
|
 |
Another
disadvantage of Resin bond is its high wear rate, lack of stiffness, and
thickness limitation. Resin bond can cut hard & brittle materials
fast, but will provide much shorter life. Thinnest blades that can be
produced in resin bond is .004". Many of the resin bond dicing blade
weaknesses and limitation have been resolved by utilizing different
phenolic resin types, mixtures, fillers, and molding techniques in our New
Generation Extended Wear Resin Bond and Hybrid bond dicing blades. Hence
increasing their field or use in greater amount of applications.
SMART
CUT™ SERIES (SC)
1A8
RESIN BOND DICING BLADE SPECIFICATIONS
Size designation: D
x TE x H, where: D-Outside Blade Diameter, TE
–Blade Thickness, H- Blade Inside Diameter.
Note:
Our standard Tolerance on Outside Diameter for all blades is +/-.002”,
tolerance. Higher tolerances are available upon request
|
HOW TO ORDER |
*Diamond
or CBN concentration |
Material
/ Application Abbreviations |
| N/N |
D
(Outer diameter) |
TE¹
(Blade
thickness) |
H
(Inside
diameter)
|
T
(Blade
tolerance) |
| 1 |
4.60”
(116.84)
|
.002”
- .080”
(.051
… 2.0) |
3.50”
(88.9)
|
1,2,3,4,5,6,7,8 |
| 2 |
4.50”
(114.3)
|
.002”
- .080”
(.051
… 2.0) |
3.50”
(88.9)
|
1,2,3,4,5,6,7,8 |
| 3 |
3.00”
(76.2) |
.002”
- .080”
(.051
… 2.0) |
1.575”
(40) |
1,2,3,4,5,6,7,8 |
| 4 |
3.00”
(76.2) |
.002”
- .080”
(.051
… 2.0) |
1.250”
(31.75) |
1,2,3,4,5,6,7,8 |
| 5 |
2.05”÷2.2835”
(52÷58)
|
.002”
- .080”
(.051
… 2.0)
|
1.575”
(40)
|
1,2,3,4,5,6,7,8 |
|
25,
35,50,
75,100,
125,150,
200 |
PLEASE
SEE TABLE BELOW FOR MATERIAL ABBREVIATIONS
|
|
TE¹
|
Thickness
of the blades is available in .0001” increments
|
|
T1...T8
|
Tolerance of the blade
thickness. Available tolerances
|
|
|
T1-±.0001”(
±2.5µm); T2- ±.0002”(
±5µm); T3- ±.0003”( ±7.5µm);
T4- ±.0004”( ±10µm)
|
|
|
T5-±.0005”(
±12.5µm); T6- ±.0006”(
±15µm); T7- ±.0007”( ±17.5µm);
T8- ±.0008”( ±20µm);
|
|
All
sizes in parentheses are in millimeters (mm). An example (76.2) is
indication of 76.2 mm.
*
LOW CONCENTRATION AVAILABLE ON REQUEST.
All
sizes in parentheses are in millimeters (mm). An example (76.2) is
indication of 76.2 mm.
*
LOW CONCENTRATION AVAILABLE ON REQUEST.
|
RESIN BOND
DIAMOND DICING BLADE
SMART
CUT™ SERIES (SC)
Selection Guide
The
guide below will help you select the right blade for your
material/application, fast and easy. Just locate the material you are
working with. On right hand side of material and abbreviation you will
find recommended diamond particle size, bond hardness to use for your
application. Along with the SMART CUT bond series recommendation.
| Material |
Material
Abbreviation
|
Diamond
Particle Size |
SMART
CUT™
Blade Series |
Bond
Hardness |
| FIBERGLASS |
FGS |
D126, D107, D91, D76, D54, D46 |
SC1R |
VVVHB,
VVHB, VHBH, HBH, HBM |
| CARBON |
CN |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| CERAMICS |
FRP, CS |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| CARBIDE TGC |
CE |
D91, D76, D54. |
SC3R |
VVHB,
VHBH, HBH, HBM |
| QUARTZ |
QZ |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| OPTICAL GLASS |
OG |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| PHOTONICS GLASS |
PG |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| MULTI-LAYER CERAMIC
CAPACITORS |
BGA CSP
MLCC |
30µm,
15µm, 9µm, 6µm, 45µm |
SC6R |
SBL,
MHBL, MHBM |
| THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM
CARBIDE |
PZT; TFDDH |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| SAPPHIRE, AL2O3 +Fe +Ti |
SE |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| RUBY
AL2O3 + Cr |
RY |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| LITHIUM
NIOBITE LiNbO3 |
LN |
30µm,
15µm, 9µm, 6µm, 45µm |
SC6R |
SBL,
MHBL, MHBM |
| LITHIUM
TANTILATE LiTaO3 |
LT |
30µm,
15µm, 9µm, 6µm, 45µm |
SC6R |
SBL,
MHBL, MHBM |
| ALUMINA
(HYBRID SUBSTRATES AND CERAMICS PACKAGES |
AL |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| QFN,
COPPER
+ EPOXY MOLDING |
QFN |
D126, D107, D91, D76, D54, D46 |
SC1R
|
|
| ALUMINUM
NITRIDE |
ALN |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| ZIRCONIA
(ZrO2) |
ZA |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| BORON
CARBIDE (B4C) |
BC |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| TITANIUM
DIBORIDE (TiB2) |
TD |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| GLASS
+ SiO2 |
GSi |
30µm,
15µm, 9µm, 6µm, 45µm |
SC6R |
SBL,
MHBL, MHBM |
| SILICON |
Si |
D54,
D46, 45µm, 30µm, 15µm |
SC5R |
SBL,
MHBL, MHBM |
| SILICON-CARBIDE
SiC |
SC |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| ZINK-SELENIDE
ZnSe |
ZS |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| BARIUM-TITINATE |
BTI |
|
|
|
| BISMUTH-SILICATE
Bi12Si22 |
BS |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| BISMUTH-TELLURIDE |
BTE |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| GGGNaGd
(W04)2 |
G2 |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| GARNET |
G |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| KOVAR
NiFeCo |
K |
30µm,
15µm, 9µm, 6µm, 45µm |
SC6R |
SBL,
MHBL, MHBM |
| SILICON
NITRIDE Si3N4 |
SN |
D91,
D76, D54, D46, 45µm, 30µm , 15µm |
SC4R |
VVVSB,
VVSB, VSB |
| STONE |
SE |
D107,
D91, D76. |
SC2R
|
VVHB,
VHBH, HBH, HBM |
| NON-FERROUS
ABRASION RESISTANT MATERIALS |
NFARS |
D107,
D91, D76. |
SC2R
|
VVHB,
VHBH, HBH, HBM |
| HIGH
SPEED TOOL STEELS |
HSTS |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| DIE
STEELS |
DS |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| HARDENED
CARBON STEEL |
HCS |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| INCONEL |
IL |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| MONEL |
ML |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| RENE |
RE |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| WASPALLOY |
WY |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| HARD
FERROUS SUPERALLOYS
|
HFS |
B126,
B107, B91, B76, B54, B46 |
SC7R
|
VVVHB,
VVHB, VHBH, HBH, HBM |
| MATERIAL
/ APPLICATION
ABBREVIATIONS |
| FGS |
FIBERGLASS |
AL |
ALUMINA
(HYBRID SUBSTRATES AND CERAMICS PACKAGES |
G2 |
GGGNaGd
(W04)2 |
| CN |
CARBON |
QFN |
COPPER
+ EPOXY MOLDING |
G |
GRANAT |
| FRP, CS |
CERAMICS |
ALN |
ALUMINUM
NITRID |
K |
KOVAR
NiFeCo |
| CE |
CARBIDE TGC |
ZA |
ZIRCONIA
(ZrO2) |
SN |
SILICON
NITRIDE Si3N4 |
| QZ |
QUARTZ |
BC |
BORON
CARBIDE (B4C) |
SE |
STONE |
| OG |
OPTICAL GLASS |
TD |
TITANIUM
DIBORIDE (TiB2) |
NFARS |
NON-FERROUS
ABRASION RESISTANT MATERIALS |
| PG |
PHOTONICS GLASS |
GSi |
GLASS
+ SiO2 |
HSTS |
HIGH
SPEED TOOL STEELS |
| BGA CSP
MLCC |
MULTI-LAYER CERAMIC
CAPACITORS |
Si |
SILICON |
DS |
DIE
STEELS |
| PZT; TFDDH |
THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM
CARBIDE
|
SC |
SILICON-CARBIDE
SiC |
HCS |
HARDENED
CARBON STEEL |
| SE |
SAPPHIRE, AL2O3 +Fe +Ti |
ZS |
ZINK-SELENIDE
ZnSe |
ML |
MONEL |
| RY |
RUBY
AL2O3 + Cr |
BTI |
BARIUM-TITINATE |
IL |
INCONEL |
| LN |
LITHIUM
NIOBITE LiNbO3 |
BS |
BISMUTH-SILICATE
Bi12Si22 |
RE |
RENE |
| LT |
LITHIUM
TANTILATE LiTaO3 |
BTE |
BISMUTH-TELLURIDE |
WY |
WASPALLOY |
|
|
|
|
HFS |
HARD
FERROUS SUPERALLOYS.
|
|
ABRASIVE
(Diamond/CBN) PARTICLES CONCENTRATION AVAILABLE |
|
SC1R
|
HIGH
CONCENTRATION
|
SC5R
|
LOW
CONCENTRATION
|
|
SC2R
|
HIGH
CONCENTRATION
|
SC6R
|
LOW
CONCENTRATION
|
|
SC3R
|
HIGH
CONCENTRATION
|
SC7R
|
HIGH
CONCENTRATION
|
|
SC4R
|
LOW
CONCENTRATION
|
|
|
|
DICING
BLADE SMART CUT (SC)
|
**** MATERIAL / APPLICATION |
***PARTICLE
SIZE |
BOND
SYSTEM/HARDNESS |
|
SC1R |
QFN,
FRP
|
D126, D107, D91, D76, D54, D46
|
VVVHB,
VVHB, VHBH, HBH, HBM
|
|
SC2R
|
STONE,
NFARS
|
D107,
D91, D76.
|
VVHB, VHBH, HBH, HBM
|
|
SC3R |
CE, BGA, FGS
|
D91, D76, D54.
|
VVHB,
VHBH, HBH, HBM
|
|
SC4R |
AL,
B4C, SC, SN, TD, CN,BTE,G2, BS
|
D91,
D76, D54, D46, 45µm, 30µm , 15µm
|
VVVSB,
VVSB, VSB
|
|
SC5R
|
ZA,
CS, QZ, OG, PG, SE, PZT, Si
|
D54,
D46, 45µm, 30µm, 15µm
|
SBL,
MHBL, MHBM
|
|
SC6R |
FDDH, K, ZS, GSi, LN, LT, MLCC
|
30µm,
15µm, 9µm, 6µm, 45µm
|
SBL,
MHBL, MHBM
|
|
SC7R |
HSTS,
DS, HCS, ML, IL, RE, WY, HFS
|
B126,
B107, B91, B76, B54, B46
|
VVVHB,
VVHB, VHBH, HBH, HBM
|
***
Letter Abbreviations: D-FOR DIAMOND,
B -FOR CBN.
**** If Material or Application is not listed in the chart above, please
inquire. We can provide proper blade specification for just about any type
of material/application.
|
ABRASIVE
PARTICLES CONCENTRATION FOR SMART CUT (SC) SERIES DICING BLADES
|
| HIGH CONCENTRATION:
|
75=18.75%
|
100=25%
|
125=31.25%
|
150=37.5%
|
200=50%
|
| LOW
CONCENTRATION
|
50=12.5%
|
35=8.75%
|
25=6.25%
|
|
|
|
|
ABRASIVE
(DIAMOND / CBN) PARTICLES SIZES AVAILABLE
|
|
Diamond/CBN
Mesh
Size
USA
|
80
100
|
100
120
|
120
140
|
140
170
|
170
200
|
200
230
|
230
270
|
270
325
|
325
400
|
400
500
|
500
|
600
|
800
|
1000
|
1200
|
1800
|
3000
|
6000
|
8000
|
|
Diamond/CBN
Size
¹FEPA
(D), (B)
|
181
|
151
|
126
|
107
|
91
|
76
|
64
|
54
|
46
|
40²
|
35²
|
30²
|
25²
|
20²
|
15²
|
9²
|
6²
|
4²
|
3²
|
|
Diamond/CBN
Size
Range
In
µm
|
180
150
|
150
125
|
125
106
|
106
90
|
90
75
|
75
63
|
65
53
|
53
45
|
45
38
|
50
30
|
40
30
|
36
22
|
30
20
|
25
15
|
20
10
|
12
6
|
8
4
|
6
2
|
4
2
|
|
³Minimum
Blade
thickness
(Inches)
|
.016
|
.014
|
.012
|
.010
|
.009
|
.008
|
.007
|
.006
|
.005
|
.004
|
.004
|
.003
|
.003
|
.003
|
.002
|
.0015
|
.0015
|
.0015
|
.0015
|
¹ Letters designation D-For diamond, B-For CBN.
² These diamond sizes
do not represent FEPA sizes,
they are for reference only.
³ Minimum blade thickness for each diamond size is available
on request.
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DICING
BLADES |
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DICING
SOLUTIONS
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| DICING
BLADE GUIDE |
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