SINTERED (METAL BOND)

SMART CUT® Sintered (Metal Bond) Dicing Blades are used for high-precision cutting, dicing, slotting, and grooving of hard, brittle, and composite materials such as semiconductors, ceramics, optical glass, quartz, sapphire, silicon carbide (SiC), and superalloys. They are commonly used in electronics, semiconductor packaging, optical components, and advanced materials processing.

Unlike resin or electroplated blades, sintered metal bond blades have multiple layers of diamond particles embedded in a durable metal matrix, ensuring continuous diamond exposure and self-renewing sharpness. This results in longer blade life, better wear resistance, and enhanced precision, making them ideal for applications requiring consistent performance over extended cutting cycles.

SMART CUT® sintered dicing blades are available in a range of diameters:

⦁ Standard diameters: 2” (50mm) to 6 (154mm)

⦁ Custom diameters: Available upon request

⦁ Thickness range: 80 µm to 1500 µm

⦁ Ultra-thin options: Down to 45µm for high-precision applications

⦁ Standard thickness tolerances: ±0.002” (tighter tolerances available upon request)

SMART CUT® sintered dicing blades come in a wide range of diamond grit sizes to optimize cutting performance:

⦁ Grit size range: 2 µm to 70 µm

⦁ Common sizes: D126, D107, D91, D76, D54, D46, 45µm, 30µm, 15µm, 9µm, 6µm

⦁ Fine grit (2µm – 15µm): For ultra-precise cuts with minimal chipping

⦁ Medium grit (30µm – 54µm): For general-purpose cutting

⦁ Coarse grit (D76 – D126): For faster cutting speeds and high material removal rates

SMART CUT® dicing blades are available in different bond hardness formulations to match specific applications:

⦁ Hard Bonds (VVVHB, VVHB, VHBH, HBH, HBM): Ideal for hard materials requiring long blade life and high wear resistance

⦁ Medium Bonds (SBL, MHBL, MHBM): Balanced wear resistance for versatile cutting applications

⦁ Soft Bonds (VVVSB, VVSB, VSB): Designed for fast, free-cutting action with reduced heat buildup

Diamond concentration is carefully controlled based on material type and cutting requirements:

⦁ High Concentration: Used for abrasive and dense materials like fiberglass, tungsten carbide, tool steels, and superalloys

⦁ Low Concentration: Ideal for fragile, brittle materials such as ceramics, silicon, sapphire, lithium niobate, and photonics glass

⦁ Standard arbor hole sizes: 40mm

⦁ Custom inside diameters: Available upon request

⦁ Straight edge: Smooth cutting for minimal chipping applications

⦁ Serrated edge: Enhances coolant flow and debris removal for better cutting efficiency

⦁ Custom edge geometries: Available for specialized applications

⦁ Harder bonds (HBH, HBM) last longer but cut at a slightly slower rate due to increased wear resistance.

⦁ Softer bonds (VSB, VVSB) cut faster but wear more quickly, requiring more frequent blade replacements.

⦁ Medium bonds (MHBM, MHBL) offer a balance between cutting speed and longevity.

These blades are widely used in industries that require precision cutting, including:

⦁ Semiconductors & Electronics: BGA, CSP, MLCC, QFN, thin-film disk drive heads, aluminum titanium carbide

⦁ Ceramics & Advanced Materials: LTCC, zirconia (ZrO₂), aluminum nitride (AlN), boron carbide (B₄C), titanium diboride (TiB₂)

⦁ Optical & Photonics: Optical glass, sapphire, lithium niobate (LiNbO₃), lithium tantalate (LiTaO₃)

⦁ Superalloys & Hard Metals: Tungsten carbide, hardened steels, Inconel, Monel, Wasapalloy, tool steels

⦁ Other Specialty Materials: Fiberglass, quartz, silicon carbide, barium titanate, Bi12Si22, ZnSe

Selecting the correct SMART CUT® dicing blade depends on several factors, including:

⦁ Material type (hardness, density, brittleness)

⦁ Cutting speed and precision requirements

⦁ Surface finish expectations

⦁ Desired blade life and maintenance schedule

⦁ Blade thickness and diamond concentration

If you are unsure which blade is best for your application, our team can help you determine the optimal specification based on your cutting parameters.

Yes! We offer custom blade diameters, thicknesses, bond formulations, diamond concentrations, edge profiles, and arbor hole sizes to meet your specific cutting needs.

The lifespan depends on:

⦁ Material type and hardness

⦁ Diamond grit size and concentration

⦁ Cutting speed and feed rate

⦁ Coolant use and cutting conditions

Compared to resin bond and electroplated dicing blades, sintered metal bond blades offer significantly longer life due to their multiple layers of embedded diamond particles.

SMART CUT® Sintered (Metal Bond) Dicing Blades are compatible with most precision dicing saws used in semiconductor, optics, and ceramics industries. If you have specific mounting or machine compatibility concerns, we can provide customized blade configurations.

You can contact us directly with your material type, cutting requirements, and preferred blade specifications, and we will recommend the best option for your needs. We also offer custom blade configurations upon request.

Choosing the right blade thickness depends on material type, cutting precision, and blade stability:

⦁ Thin blades (80µm – 200µm): Ideal for precision applications with minimal kerf loss and ultra-fine cuts.

⦁ Medium blades (250µm – 750µm): Suitable for general-purpose cutting where both precision and durability are needed.

⦁ Thick blades (800µm – 1500µm): Used for deep cuts, tough materials, or increased blade exposure requirements.

⦁ Low concentration → Faster cutting speeds, less heat generation, better for brittle materials.

⦁ Medium concentration → Balanced performance for a wide range of materials.

⦁ High concentration → Longer blade life, best for hard, dense materials like tungsten carbide and superalloys.

Blade exposure refers to how much of the blade is extending beyond the mounting flanges:

⦁ Low exposure → More stability, better control, and reduced vibration.

⦁ High exposure → Deeper cutting capability but may require adjustments in feed rate and coolant application to prevent blade flexing.

⦁ Too high RPM → Increased heat, risk of material burning or cracking.

⦁ Too low RPM → Slower cuts, increased blade wear due to inefficient diamond exposure.

⦁ Optimized RPM → Clean, smooth cuts with minimal stress on the blade and material.

⦁ Ensure correct RPM and feed rate settings based on material hardness.

⦁ Use proper blade mounting techniques to prevent misalignment.

⦁ Avoid excessive blade exposure beyond the flanges.

⦁ Maintain adequate coolant flow to reduce thermal stress.

⦁ Deionized water → Common for semiconductor and optical applications, prevents contamination.

⦁ Water-soluble coolants → Reduce friction and extend blade life.

⦁ Low-foaming coolants → Improve process stability, particularly in high-speed cutting.

⦁ Insufficient coolant application → Ensure proper coolant flow rate and distribution.

⦁ Improper feed rate → Adjust to prevent overheating.

⦁ Glazed blade → Dressing the blade may be required to restore cutting efficiency.

⦁ Use a fine-grit dressing stick to remove bond material buildup and expose fresh diamonds.

⦁ Dress blades periodically to maintain optimal cutting speed and prevent glazing.

⦁ Avoid over-dressing, as this can reduce blade life.

No. These blades require coolant for effective operation. Dry cutting will cause excessive heat buildup, rapid wear, and material damage.

⦁ Running the blade at incorrect RPM → Reduces performance and increases wear.

⦁ Improper blade mounting → Causes deflection and imprecise cuts.

⦁ Ignoring coolant flow → Leads to overheating and premature blade failure.

⦁ Not dressing the blade when needed → Results in glazing and reduced cutting efficiency.

Excessive machine vibration can cause:

⦁ Blade deflection → Reduces cutting accuracy.

⦁ Inconsistent kerf width → Leads to uneven cuts.

⦁ Premature wear → Blade life decreases due to erratic cutting forces.
To prevent this, ensure the dicing saw is properly calibrated and stabilized.

Yes. Custom edge geometries such as serrated edges, segmented rims, or special notches can be provided for improved coolant flow, heat dissipation, and material removal efficiency.

⦁ Vacuum chucks → Provide stable, high-precision cutting for thin materials.

⦁ Wax mounting → Used for delicate substrates, reduces vibration.

⦁ Mechanical clamping → Works for larger, rigid materials but may introduce stress.

A blade should be replaced when:

⦁ Cutting speed significantly decreases despite proper feed rates.

⦁ Chipping or microcracks appear on the material surface.

⦁ Dressing no longer restores performance.

⦁ Blade edge shows excessive wear or deformation.

Yes, SMART CUT® sintered dicing blades are compatible with robotic wafer dicing, CNC precision cutting, and automated dicing equipment used in semiconductor, optical, and ceramic industries.

⦁ Use consistent cutting parameters (RPM, feed rate, coolant).

⦁ Regularly inspect and replace worn blades.

⦁ Calibrate dicing equipment to maintain precision.

⦁ Optimize blade thickness and diamond grit size based on production needs.

⦁ Store in a dry, controlled environment to prevent oxidation.

⦁ Keep blades in original protective cases to avoid accidental chipping.

⦁ Avoid stacking or direct contact between blades to prevent damage.

SMART CUT® sintered dicing blades are used in:

⦁ Semiconductor Fabrication → Wafer dicing, MEMS, IC packaging (BGA, QFN, CSP).

⦁ Optical & Photonics → Sapphire, quartz, optical glass cutting.

⦁ Advanced Ceramics → LTCC, zirconia, alumina, boron carbide.

⦁ Electronics Manufacturing → PCB, MLCC, thin-film disk drive components.

⦁ Superalloy Processing → Tungsten carbide, Inconel, tool steels.

Yes. SMART CUT® provides custom blade configurations, including:

⦁ Specific bond hardness and diamond concentrations.

⦁ Custom diameters, thicknesses, and arbor sizes.

⦁ Serrated, notched, or segmented edge profiles.

Contact us with details about your material type, cutting requirements, and machine specifications, and our technical team will recommend the best blade for your needs.

Feed rate should be optimized based on:

⦁ Material hardness – Harder materials require slower feed rates.

⦁ Blade thickness – Thinner blades work better with moderate to slower feed rates.

⦁ Coolant efficiency – Poor coolant flow may require reducing the feed rate to prevent overheating.

⦁ Chipping sensitivity – Lower feed rates help reduce microcracking on fragile materials.

Yes, but deep cutting requires:

⦁ Increased blade thickness and rigidity to prevent deflection.

⦁ High diamond concentration to improve longevity.

⦁ Serrated or segmented blades to enhance debris removal and coolant flow.

⦁ Lower feed rates to reduce stress on the blade and material.

Excessive spindle vibration can:

⦁ Reduce cut accuracy and increase kerf width variation.

⦁ Cause premature blade wear and breakage.

⦁ Increase material chipping and microcracks.

⦁ Reduce coolant effectiveness by disrupting flow patterns.
To minimize vibration, ensure the spindle is balanced, clean, and properly maintained.

⦁ Standard precision flanges – Suitable for most cutting applications.

⦁ Large-diameter flanges – Recommended for ultra-thin and high-precision blades to improve blade stability.

⦁ Custom-balanced flanges – Can help minimize spindle vibration and improve performance in sensitive applications.

⦁ Thinner kerf blades (≤100µm): Reduce material loss, ideal for high-value materials.

⦁ Medium kerf blades (100µm – 300µm): Balance between material yield and blade stability.

⦁ Thicker kerf blades (>300µm): More durable but reduce material efficiency.

Selecting the right kerf width is essential for maximizing yield while maintaining cutting stability.

⦁ Straight-edge blades – Provide clean cuts with minimal chipping.

⦁ Serrated-edge blades – Improve coolant retention and heat dissipation, reducing cutting stress.

⦁ Notched blades – Help reduce friction and improve cutting speed.

⦁ Discoloration or burn marks on the material.

⦁ Increased blade glazing, requiring more force to cut.

⦁ Material warping or increased chipping.

⦁ Rapid blade wear.
To prevent overheating, optimize coolant flow, adjust feed rates, and ensure correct RPM settings.

The arbor hole must match the machine’s spindle precisely.

⦁ Too large: Causes misalignment and vibration, leading to uneven cuts.

⦁ Too small: Can cause excessive blade stress and improper mounting.

⦁ Properly fitted arbor holes ensure stable, accurate, and vibration-free operation.

Regular maintenance includes:

⦁ Checking and calibrating spindle alignment to ensure precision.

⦁ Cleaning and inspecting flanges for wear or debris buildup.

⦁ Replacing worn coolant nozzles to maintain proper fluid flow.

⦁ Ensuring proper machine vibration damping to avoid cut irregularities.

Yes, step-cutting (cutting in multiple passes) is possible and is recommended for hard or thick materials to reduce blade stress.

⦁ Use moderate feed rates to avoid excessive force.

⦁ Ensure coolant reaches the blade consistently to prevent overheating.

⦁ Choose appropriate blade exposure to balance cut depth with stability.

⦁ Low coolant pressure → Poor heat dissipation, increased blade wear.

⦁ High coolant pressure → Improved cooling but may cause material deflection in fragile materials.

⦁ Optimized coolant pressure ensures consistent chip removal, cooling, and cutting efficiency.

⦁ Choose balanced bond hardness to handle different material properties.

⦁ Use moderate diamond concentration for controlled cutting.

⦁ Adjust feed rate and coolant flow based on the most sensitive material being cut.

⦁ Sintered Blades → Longer lifespan, multiple diamond layers, self-sharpening mechanism, better for tough materials.

⦁ Electroplated Blades → Single-layer diamonds, faster initial cutting but shorter lifespan.

Sintered blades are preferred for high-precision, high-durability applications.

⦁ Check for glazing – Dress the blade if needed.

⦁ Ensure correct RPM and feed rate – Adjust to improve efficiency.

⦁ Increase coolant flow – Helps keep diamonds exposed and reduces heat.

Replace the blade if worn – Continuous use of a dull blade increases chipping and process instability.

The maximum depth depends on blade thickness and material hardness.

⦁ Thin blades (≤100µm): Up to 2mm depth per pass.

⦁ Medium blades (100µm – 500µm): Up to 5mm depth per pass.

Thicker blades (>500µm): Can cut deeper but may require step-cutting to maintain quality.

⦁ Sintered Metal Bond → Longer life, superior rigidity, better form retention, ideal for hard materials.

⦁ Resin Bond → Smoother cuts on softer materials, faster initial cutting, shorter lifespan.

Sintered blades outperform resin bond blades in demanding, high-precision applications.

For multi-layered ceramics, composites, or bonded structures:

⦁ Start with lower feed rates to prevent delamination.

⦁ Use progressive step-cutting to maintain structural integrity.

⦁ Ensure coolant penetrates between layers to avoid overheating and uneven cutting.

Yes. SMART CUT® sintered blades can complement laser-assisted dicing by handling final separation cuts, improving edge quality, and reducing stress fractures in sensitive materials.

⦁ Use clean gloves to avoid contamination.

⦁ Store in original packaging to prevent warping or edge damage.

⦁ Avoid excessive force when mounting, as ultra-thin blades are more fragile.

Yes, we offer OEM private labeling, batch tracking, and custom laser-etched branding for bulk orders.

⦁ Frequent dressing ensures the blade remains sharp and prevents glazing.

⦁ Over-dressing may reduce blade life by prematurely exposing too many diamonds.

⦁ Recommended Approach: Dress only when performance declines (e.g., slower cutting speed, increased chipping, or excessive heat buildup).

Yes, these blades are compatible with ultrasonic-assisted dicing systems, which enhance cutting efficiency for brittle, high-precision materials like sapphire and ceramics by reducing cutting forces and minimizing chipping.

⦁ Humidity & Temperature: Excess moisture can lead to bond degradation; temperature fluctuations may cause material expansion, affecting cut precision.

⦁ Airborne Contaminants: Dust and debris can clog blade surfaces, reducing efficiency.

⦁ Vibration & Airflow: Unstable environments can disrupt spindle balance, impacting cut quality.

⦁ Blade misalignment or wobble → Check spindle and flange alignment.

⦁ Inconsistent feed rate → Optimize feed rate for material and blade thickness.

⦁ Vibration in the dicing machine → Inspect for mechanical wear or misbalanced blades.

• Improper coolant application → Ensure even coolant distribution.

⦁ Low-viscosity coolants improve chip removal and cooling efficiency.

⦁ High-viscosity coolants may reduce splashing and improve lubrication but could trap debris.

⦁ Electrostatic-sensitive applications require specialized low-foaming coolants.

⦁ Outside diameter tolerance: ±0.002” (higher precision upon request).

⦁ Blade thickness tolerance: ±5µm to ±15µm depending on application.

⦁ Runout tolerance: ≤ 0.001” for high-precision applications.

⦁ Higher SFPM (Surface Feet Per Minute): Faster cuts but increased wear.

⦁ Lower SFPM: More controlled cuts, but slower cutting speed.

Optimal SFPM varies based on material type and blade specification.

Yes, but special considerations must be taken:

⦁ Ensure no excessive heat buildup due to limited cooling options.

⦁ Use dry-cut optimized variants if coolant cannot be used.

No. These blades rely on continuous diamond exposure as the bond wears down. If the blade is dull, it is time for replacement.

⦁ Synthetic diamonds offer uniform size and predictable performance.

⦁ Natural diamonds may provide better toughness but with inconsistent grit shape.

SMART CUT® exclusively uses precision-graded synthetic diamonds for maximum control over cutting efficiency.

⦁ Ensure blade mounting is secure and properly aligned.

⦁ Verify correct spindle RPM and feed rate settings.

⦁ Inspect for uneven wear or bond breakdown.

⦁ Check machine vibration levels—loose parts or worn-out bearings can cause skipping.

Yes, we offer ESD-safe dicing blades for applications where electrostatic discharge is a concern, such as semiconductor and photonics glass cutting.

Yes. Submerged dicing reduces heat buildup, improves debris removal, and minimizes chipping for ultra-precise applications.

⦁ Metal Bond → Long life, high wear resistance, best for hard, brittle materials.

⦁ Vitrified Bond → Faster cutting speeds, better for softer materials requiring minimal heat generation.

Materials like ceramics, quartz, and optical glass expand with temperature changes. To prevent thermal damage:

⦁ Use a finer grit size to reduce cutting stress.

⦁ Optimize coolant flow to control heat buildup.

⦁ Choose a bond hardness that balances wear resistance with cutting precision.

⦁ Blade thickness – Thinner blades are more prone to flexing.

⦁ Feed rate – Too aggressive a feed rate can cause bending.

⦁ Machine stability – Improper spindle calibration increases deflection.

⦁ Material hardness – Harder materials require higher blade rigidity.

Yes, these blades are ideal for grooving and partial-depth cuts, provided that:

⦁ The feed rate and blade exposure are properly adjusted.

⦁ The material is adequately supported to prevent breakage.

⦁ Coolant flow is directed to avoid chip accumulation.

Yes, SMART CUT® offers coatings that:

⦁ Reduce friction and extend blade life.

⦁ Minimize electrostatic charge in sensitive applications.

⦁ Enhance wear resistance for aggressive cutting applications.

⦁ Run the blade at a moderate feed rate for the first few cuts.

⦁ Ensure coolant flow is optimal to prevent overheating.

Gradually increase the cutting speed as the blade settles into the process.

Yes, but selecting the correct diamond grit size, bond hardness, and concentration is critical to avoid layer separation or delamination.

⦁ Use precision flanges to maintain alignment.

⦁ Avoid over-tightening to prevent warping.

⦁ Ensure machine vibration is minimal to maintain straight cuts.

⦁ Flat-edge blades – Uniform cutting, smooth finishes.

⦁ Serrated blades – Higher removal rates, better coolant flow.

Segmented blades – Reduced heat buildup, better for deep cuts.

A narrow kerf increases material efficiency but requires higher blade precision.
A wider kerf provides better coolant flow and chip evacuation but increases material loss.

Yes, provided that the blade bond and diamond concentration are selected to withstand extreme temperature variations.