NEW GENERATION AND TECHNOLOGY

SINTERED (METAL BOND)

SMART CUT® Series (SCH)
Diamond & CBN Dicing Blades

SMART CUT® (METAL BOND) series New Generation & Technology Dicing Blade are some of the thinnest, universal, and long lasting blades available today. You can't gent more life out of any other blade. Manufactured utilizing SMART CUT® technology, Sintered (Metal Bonded) dicing blades will give you consistent results you can count on everyday.

Sintered (metal bond) Dicing blades have excellent form holding & corner characteristics, provide very long life, high level of consistency. Recommended for users requiring very straight cuts and larger blade exposures. Typical cutting rates of 0.025" on ceramic of .04" per second up to 0.1" per second at 20k RPM, 30 micron grit size, .006" thick

Sintered (Metal bonded) diamond blades diamonds sintered and multiple layers of diamonds impregnated inside the metal matrix. Diamonds are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. Metal Bonded Dicing Blades are “impregnated” with diamonds. The compacted materials are then hot pressed or sintered to full density. Heating rate, applied pressure, sintering temperature and holding time, are all controlled according to the matrix composition. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any large variety of material. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting.

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Features

Large Variety of Bond Matrixes for all Applications
Less wear/higher blade life
Highly accurate blade dimensions
Minimal Chipping of Critical Edges
Large Variety of Bond Matrixes for all Applications
Less wear/higher blade life

Benefits

Increase Blade Life
Reduce Chipping
Reduce Blade Wear
Increase Process Consistency
Maintain Consistent Cutting Speed
Reduce Blade Change & Mounting Cost
Reduce Cost

Advantages

Maximum Cutting Performance
No Glazing
Faster Cutting Action
Improved surface finish quality
Better coolant retention
No Material Deformation
No Contamination

Different Technology

SMART CUT® technology

Manufactured utilizing SMART CUT® technology, each diamond works like a small horse. Diamonds come in contact with the material in the right place and at the right time, working where you need them most. You get the maximum use out of diamond and bond.

Diamonds are oriented inside metal matrix, so that every diamond is better able to participate in cutting action.

How SMART CUT ® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ® Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

About Sintered (Metal Bond)

Sintered (Metal bonded) diamond blades diamonds sintered and multiple layers of diamonds impregnated inside the metal matrix. Diamonds are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. Metal Bonded Dicing Blades are “impregnated” with diamonds. The compacted materials are then hot pressed or sintered to full density. Heating rate, applied pressure, sintering temperature and holding time, are all controlled according to the matrix composition. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any large variety of material. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting.

Sintered (metal bonded) dicing blades are recommended for cutting wide variety of materials from 45 to 75 on Rockwell Scale (5 to 9.5 on mohs scale of hardness). It is more wear resistant and holds diamond well in place, usually producing the highest yield/cutting ratio.

As a general rule of thumb, Metal Bond (sintered) diamond dicing blades longer than other diamond bond blades such as resin bond and electroplated (nickel bond) blades.

They wear evenly, and are known for their long life & consistency. Metal bond matrix does not protrude diamonds very high and hence usually requires lower cutting speeds than electroplated (nickel bond) and resin bond blades. In many dicing applications sintered (metal bond) dicing blades are used in applications which are not super hard or super brittle and with minimum tendency to produce chips or cracks.

Compare to any other Sintered (Metal Bond) Dicing Blade.

START SAVING TIME & MONEY TODAY!

Contact us for Free Quote & application recommendation.

We will work with you to determine your needs, and recommend the right parameters for your specific material/application. If you are not using SMART CUT® Sintered (Metal Bond) SCM series, you are loosing money & missing out on incredible performance.

SMART CUT® Series SCH

SINTERED (METAL BOND) Specifications

Size designation: D x TE x H, where: D-Outside Blade Diameter, TE –Blade Thickness, H- Blade Inside Diameter.

Note: Our standard Tolerance on Outside Diameter for all blades is +/-.002”, tolerance. Higher tolerances are available upon request

Material / Application

Material Abbreviation

SMART CUT™ Blade Series

Diamond Particle Size

Bond Hardness

Diamond Concentration

FIBERGLASS

FGS

SC1M

D126, D107, D91, D76, D54, D46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

CARBON

CN

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

CERAMICS

FRP, CS

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

CARBIDE TGC

CE

SC1M

D91, D76, D54.

VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

QUARTZ

QZ

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

OPTICAL GLASS

OG

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

PHOTONICS GLASS

PG

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

MULTI-LAYER CERAMIC CAPACITORS

BGA CSP MLCC

SC1M

30µm, 15µm, 9µm, 6µm, 45µm

SBL, MHBL, MHBM

LOW CONCENTRATION

THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM CARBIDE

PZT; TFDDH

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

SAPPHIRE, AL2O3 +Fe +Ti

SE

SC6M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

RUBY AL2O3 + Cr

RY

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

LITHIUM NIOBITE LiNbO3

LN

SC1M

30µm, 15µm, 9µm, 6µm, 45µm

SBL, MHBL, MHBM

LOW CONCENTRATION

LITHIUM TANTILATE LiTaO3

LT

SC1M

30µm, 15µm, 9µm, 6µm, 45µm

SBL, MHBL, MHBM

LOW CONCENTRATION

ALUMINA (HYBRID SUBSTRATES AND CERAMICS PACKAGES

AL

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

QFN, COPPER + EPOXY MOLDING

QFN

SC1M

D126, D107, D91, D76, D54, D46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

ALUMINUM NITRIDE

ALN

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

ZIRCONIA (ZrO2)

ZA

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

BORON CARBIDE (B4C)

BC

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

TITANIUM DIBORIDE (TiB2)

TD

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

GLASS + SiO2

GSi

SC6H

30µm, 15µm, 9µm, 6µm, 45µm

SBL, MHBL, MHBM

LOW CONCENTRATION

SILICON

Si

SC1M

D54, D46, 45µm, 30µm, 15µm

SBL, MHBL, MHBM

LOW CONCENTRATION

SILICON-CARBIDE SiC

SC

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

ZINK-SELENIDE ZnSe

ZS

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

BARIUM-TITINATE

BTI

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

BISMUTH-SILICATE Bi12Si22

BS

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

BISMUTH-TELLURIDE

BTE

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

GGGNaGd (W04)2

G2

SC1M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

GARNET

G

SC4H

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

KOVAR NiFeCo

K

SC4M

30µm, 15µm, 9µm, 6µm, 45µm

SBL, MHBL, MHBM

LOW CONCENTRATION

SILICON NITRIDE Si3N4

SN

SC4M

D91, D76, D54, D46, 45µm, 30µm , 15µm

VVVSB, VVSB, VSB

LOW CONCENTRATION

STONE

SE

SC5M

D107, D91, D76.

VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

NON-FERROUS ABRASION RESISTANT MATERIALS

NFARS

SC6M

D107, D91, D76.

VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

HIGH SPEED TOOL STEELS

HSTS

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

DIE STEELS

DS

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

HARDENED CARBON STEEL

HCS

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

INCONEL

IL

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

MONEL

ML

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

RENE

RE

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

WASPALLOY

WY

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

HARD FERROUS SUPERALLOYS

HFS

SC3M

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM

HIGH CONCENTRATION

** Letter Abbreviations: D-FOR DIAMOND, B -FOR CBN.

**** If Material or Application is not listed in the chart above, please inquire. We can provide proper blade specification for just about any type of material/application.

Why Work With Us?

Comprehensive Source Of Information On Dicing Blades

We understand that your success depends on select the right dicing blade, and optimizing your dicing parameters to best fit your applications/needs. The more you understand about what we can do for you, the better our partnership will be. On our website you will find the Most Comprehensive Source of Information on Everything you wanted to know about diamond dicing blades & industrial diamond tools.

Large Inventory & Custom Manufacturing

Largest Inventory of Precision & Ultra Thin Diamond Dicing Blades in the U.S. Available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.

Experience Makes All The Difference

"ONE OF THE MOST EXPERIENCED COMPANIES IN THE INDUSTRY"
Over the years we have enjoyed working with all types if clients, regardless of size. Proprietary dicing blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after cutting.

Umatched Technical Support

We Are a Partner In Your Success
Developing close ties with our customers is the foundation of our business. At the core of our company is a team of world class engineers, knowledgeable customer service personnel here to serve you. Whether is designing or manufacturing a special solution. We will go out of our way to optimizing your process to ultimate level of efficiency.