Table of Contents
ToggleStep by step guide on how to properly use and care for your diamond drills. Selecting the right diamond drill/diamond drill bit parameters, often involves a trial and error process. Many which can be avoided through experience and understanding of how to use these parameter for your specific application.
Diamond & CBN Wafering Blade Case Studies
This study evaluates the cutting performance of SMART CUT® Diamond & CBN Wafering Blades compared to Conventional Wafering Blades under identical test conditions. The objective was to measure differences in cutting speed, surface finish, dimensional accuracy, and blade durability when processing a range of materials commonly used in metallography, materials research, and precision sectioning.
All tests were conducted using controlled parameters, including a fixed load, consistent dressing before each cut, uniform coolant ratio, and maximum wheel speed settings. Each cut was timed, recorded, and averaged for accuracy. Results were analyzed to determine cutting efficiency and overall performance across multiple materials such as quartz, aluminum, brass, and high-chromium steel.
In addition, we can cross-reference any competitor item number and provide an equivalent SMART CUT® blade. In most cases, not only can we match performance, but we can also improve it compared to what you are currently using. By presenting these real-world results side by side, the following case studies highlight how SMART CUT® blades consistently outperform other dicing blades across different materials and applications.
The data presented in this article illustrate how SMART CUT® technology improves material removal rates, reduces cutting time, and maintains superior surface finish compared to conventional diamond wafering blades.
Case Study: Sectioning 12 mm rods Quartz, Aluminum, & Brass Performance Comparison of SMART CUT® Series 15HCU Metal Bond Diamond Wafering Blades
Objective
This study evaluates the cutting performance of SMART CUT® Series 15HCU sintered (metal bond) diamond wafering blades compared to conventional sintered metal bond diamond wafering blades commonly used in metallography, materials research, and sample preparation. The primary goal was to determine relative cutting speed, consistency, and efficiency across several material types under identical operating conditions.
Experimental Setup
All tests were conducted on a precision low-speed wafering saw equipped with a gravity feed mechanism and continuous coolant flow system. The blades tested included:
- SMART CUT® Series 15HCU New Generation Sintered (Metal Bond) Diamond Wafering Blade, featuring improved bond structure, uniform diamond distribution, and self-sharpening characteristics.
- Conventional metal bond diamond wafering blade produced by a well-known brand used throughout the metallographic and material science industries.
Each material sample was prepared as a 12 mm diameter cylindrical rod. The same cutting parameters were maintained throughout testing to ensure consistent results.
Cutting Parameters
|
Parameter |
Setting |
|---|---|
|
Load |
80 grams |
|
Wheel Speed |
10 (maximum on dial) |
|
Blade Dressing |
Before each cut |
|
Coolant |
Water-soluble coolant |
|
Coolant Dilution |
30:1 ratio |
|
Feed Mechanism |
Gravity feed |
Each cut was timed from initial contact until complete separation. Results for each sample were averaged from three test runs and plotted to determine relative performance.
Cutting Times of Various Materials Using Different Diamond Wafering Blades (12 mm rods)
|
Material |
SMART CUT® Series 15HCU |
Conventional Metal Bond Blade |
|---|---|---|
|
Quartz |
4.5 minutes |
10 minutes |
|
Aluminum |
26 minutes |
29.5 minutes |
|
Brass |
25.5 minutes |
33.5 minutes |
The SMART CUT® Series 15HCU blade consistently achieved faster sectioning times for all materials tested, with improvement ranging from 12% to over 50% depending on the material type.
Observations
The SMART CUT® Series 15HCU blade demonstrated superior cutting efficiency and more stable performance over the course of repeated cuts. In quartz, the hardest and most brittle material tested, cutting time was reduced by more than half. This indicates enhanced sharpness retention and optimized diamond exposure within the bond structure.
Visual examination of the cut surfaces revealed smoother finishes and reduced chipping compared to the conventional metal bond blade. The uniform diamond distribution of the SMART CUT® blade produced a more consistent material removal rate and lower friction at the cutting interface.
Temperature at the cut zone was noticeably lower with the SMART CUT® Series 15HCU blade, suggesting improved heat dissipation through the bond and coolant flow. Reduced heat generation contributed to cleaner edges and extended blade life.
Analysis
The superior performance of the SMART CUT® Series 15HCU blade is attributed to the combination of controlled diamond concentration, improved bond hardness, and advanced manufacturing technology. The bond composition allows for gradual release of worn diamond particles and continuous exposure of new sharp cutting edges. This maintains steady cutting action and prevents glazing or loading of the blade.
The conventional blade, in contrast, exhibited slower cutting rates and greater tendency for diamond particle wear and bond loading, especially during extended cutting of metallic samples such as aluminum and brass.
Testing confirms that SMART CUT® Series 15HCU sintered (metal bond) diamond wafering blades significantly outperform conventional metal bond blades in both cutting speed and surface quality. The blades cut faster, run cooler, and maintain sharper performance over repeated use. These improvements are especially evident in hard and brittle materials such as quartz, where cutting efficiency increased by more than 50 percent.
SMART CUT® Series 15HCU represents a measurable advancement in wafering blade design and provides clear advantages for laboratories and production environments requiring precision, consistency, and productivity.
Cutting Speed Analysis for Cobalt Chromium
Objective
The objective of this test was to evaluate and compare the cutting speed of different diamond wafering blades when cutting a Cobalt Chromium (CoCr) rod. The study aimed to determine which blade offered faster cutting performance and improved process efficiency under identical controlled conditions.
Sample and Setup
Material: Cobalt Chromium (CoCr) rod
Specimen Dimensions: 4.0 inches in length
Cutting Equipment: South Bay Model 650 Low Speed Diamond Wheel Saw
Diamond Wafering Blades Tested:
- SMART CUT® Series 20HCU – 6″ × 0.020″, sintered (metal bond)
- Conventional Competitor Blade – 6″ × 0.020″, sintered (metal bond)
Coolant Used: Water-soluble coolant
Cutting Load: 600 g
Blade Dressing: Performed at regular intervals to maintain sharpness and consistency
Both blades were tested using identical equipment, coolant, and applied load to ensure consistent evaluation of cutting efficiency.
Test Methodology
The Cobalt Chromium rod was securely mounted in the sample vise of the Model 650 Low Speed Diamond Wheel Saw. Each blade was used to perform a full material cut through the rod under the same operational conditions.
Cutting time was recorded for each blade until complete separation of the specimen occurred. Each test was repeated to verify consistency of results.
Results: Cutting Time Performance
|
Wafering Blade Type |
Cutting Time (hours) |
|---|---|
|
SMART CUT® Series 20HCU |
8 hours |
|
Competitor Blade |
13 hours |
The SMART CUT® Series 20HCU completed the cut in 8 hours, while the competitor blade required 13 hours to cut through the same material under identical parameters. This represents a 38.5% reduction in cutting time, demonstrating a significant improvement in cutting efficiency.
Engineering Analysis
The reduced cutting time observed with the SMART CUT® Series 20HCU blade indicates superior cutting efficiency and material removal rate compared to the conventional competitor blade.
The SMART CUT® sintered metal bond design ensures consistent diamond exposure, optimized diamond retention, and improved heat dissipation, leading to faster, more stable cuts without excessive blade wear or material damage.
The shorter cutting cycle translates into lower operating costs, reduced downtime, and higher productivity in precision cutting of hard alloys such as Cobalt Chromium.
Conclusion
The SMART CUT® Series 20HCU Diamond Wafering Blade demonstrated:
- Superior cutting efficiency, completing the cut in 8 hours compared to 13 hours for the competitor blade.
- Improved process economy, with faster cutting rates and reduced energy consumption.
- Stable performance under identical test conditions, confirming consistency and repeatability.
Result:
SMART CUT® Series 20HCU is recommended for applications involving Cobalt Chromium, Titanium, and other high-strength metal alloys, where precision, speed, and process consistency are critical.
Case Study: Sectioning Stainless Steel Disk Bonded to Alumina Insulator
Sectioning a stainless steel disk bonded to an alumina ceramic insulator on a low speed wafering saw
Application
Section a cylindrical puck composed of stainless steel bonded to an alumina insulator. Goal is one straight cross section suitable for optical microscopy with minimal edge damage.
Category Details
- Application Sectioning a sample composed of a stainless steel disk bonded to an alumina (Al₂O₃) insulator for optical microscopy.
- Material Composition Stainless Steel 316 (6 mm thick) bonded to Alumina Ceramic 99.5% (6 mm thick).
- Sample Dimensions Diameter: 30 mm; Total Thickness: 12 mm.
- Mounting Method Epoxy-mounted, secured in precision vise.
- Cut Orientation Cut initiated from alumina side, progressing through bond into stainless steel.
- Equipment Used SMART CUT® Model 650 Low-Speed Diamond Wafering Saw.
- Coolant Used SMART CUT® Water Soluble Coolant, 1:25 dilution ratio, continuous flood.
- Feed Mechanism Gravity feed.
Blade Specifications
|
Parameter |
SMART CUT® 15HCU (Test Blade) |
Competitor A (General Wafering Blade) |
Competitor B (Metal Wafering Blade) |
|---|---|---|---|
|
Blade Diameter |
4" (102 mm) |
4" (102 mm) |
4" (102 mm) |
|
Blade Thickness (Kerf) |
0.012" (0.30 mm) |
0.012" (0.30 mm) |
0.012" (0.30 mm) |
|
Inside Diameter |
1/2" (12.7 mm) |
1/2" (12.7 mm) |
1/2" (12.7 mm) |
|
Bond Type |
Sintered (metal bond) |
Sintered (metal bond) |
Sintered (metal bond) |
|
Diamond Concentration |
100 |
100 |
75 |
|
Flange Size |
1.5" (38 mm) |
1.5" (38 mm) |
1.5" (38 mm) |
Cutting Parameters (Same for All Tests)
|
Parameter |
Value |
|---|---|
|
Spindle Speed |
250 RPM |
|
Applied Load |
120 g (gravity feed) |
|
Coolant Flow Rate |
300 mL/min |
|
Dressing |
Only when cutting rate dropped |
|
Start Side |
Alumina |
|
Ambient Temperature |
23°C ± 1°C |
Performance Comparison
|
Performance Metric |
SMART CUT® 15HCU |
Competitor A |
Competitor B |
|---|---|---|---|
|
Total Cut Time |
26–29 minutes |
>6 hours (incomplete) |
>8 hours (incomplete) |
|
Cutting Stability |
Steady through transition |
Frequent stalls |
Frequent stalls |
|
Dressing Frequency |
minimal |
Required repeatedly about 10–15 min intervals |
Required frequently typically every 2 to 4 minutes due to glazing |
|
Cut Completion |
100% |
84% |
71% |
|
Stainless Section Rate |
Slightly slower than alumina |
Near zero |
Near zero |
|
Alumina Edge Chipping |
<20 µm |
40–60 µm |
50–70 µm |
|
Stainless Edge Burr |
Minimal |
Moderate |
Moderate |
Test method
- Square and true the blade with a brief dress before the first cut only.
- Bring spindle to speed and start coolant.
- Touch off on the alumina side to establish the kerf.
- Allow gravity feed to control the cut. Do not force the feed.
- Record total time to complete a single cross section through both layers.
- Inspect edges at low magnification for chipping and burr.
Customer comment
“I mounted this combo in epoxy and tried another brand’s low speed saw with their diamond wafering blade and their metal wafering blade. Both cut the ceramic. Cutting in the steel was almost zero even with constant dressing. I stopped after a whole day. Your blade on the low speed saw finished the cut in under half an hour. Rates in the stainless were only slightly slower than in the ceramic.”
Observation
- SMART CUT® 15HCU achieved complete cross-section in less than 30 minutes.
- No dressing was required during cutting, reducing operator downtime.
- Minimal chipping and burr allowed direct progression to polishing.
- Competitor blades failed to penetrate stainless layer effectively.
- SMART CUT® maintained constant cutting rate across both materials.
Case Study No. 3 - Cutting and Sectioning Materials with High Metallic Content
Product
10″ x 0.040″ x 32mm New Generation Metal Bond Diamond Wafering Blade featuring SMART CUT® technology.
Application
Sectioning of metallic elements and alloys with high toughness and ductility, including zirconium (Zr), niobium (Nb), titanium (Ti), hafnium (Hf), and related alloys. These materials are known for their high strength-to-weight ratios, excellent corrosion resistance, and high ductility, which make them difficult to section cleanly without deformation or smearing.
Equipment
Precision abrasive cut-off saw: Struers Discotom 5
Blade Life Achieved: Approximately 4 months under continuous laboratory use.
Background
Zirconium, niobium, titanium, and hafnium alloys are widely used in advanced applications such as nuclear fuel cladding, aerospace components, biomedical implants, and specialty metallurgical research. Their mechanical properties, while advantageous in service, present major challenges during precision sectioning.
Traditional abrasive or diamond cut-off blades often fail to produce consistent results on these alloys due to excessive heat generation, rapid glazing, and smearing of the metal surface. The ductility of these materials leads to plastic deformation instead of a clean shear, resulting in distorted microstructures and potential alteration of metallographic integrity.
This case study evaluates the performance of the SMART CUT® New Generation metal bond diamond wafering blade in overcoming these challenges.
Cutting Conditions
- Blade Type: SMART CUT® New Generation Metal Bond
- Diameter: 10"
- Thickness: 0.040"
- Arbor Hole: 43mm
- Coolant: Water-soluble coolant (continuous flood)
- Cutting Speed: Set according to Struers Discotom 5 manufacturer recommendations for metal sectioning
- Feed Rate: Automatically controlled, moderate pressure
- Dressing: Performed before each series of cuts to maintain consistent exposure of diamond crystals
Results and Performance
The SMART CUT® New Generation metal bond diamond blade demonstrated excellent performance across all test materials. The blade maintained a stable cutting rate and consistent surface quality throughout its service life, which exceeded 4 months of regular laboratory use.
When sectioning zirconium alloys containing carbide inclusions, the SMART CUT® blade achieved clean separations without micro-tearing, delamination, or surface drag. This level of precision could not be achieved previously using conventional blades.
Cut surfaces of niobium and titanium alloys displayed minimal burr formation, smooth surface finish, and reduced discoloration, indicating efficient heat dissipation and uniform material removal.
Blade wear remained even, with no signs of excessive diamond pull-out or bond erosion. Operators noted that dressing frequency could be reduced compared to standard metal bond blades, reflecting improved self-sharpening and diamond retention characteristics inherent to SMART CUT® technology.
Customer Evaluation
“We found that it worked well for cutting all of the alloys and pure metals. It worked extremely well for sectioning carbide inclusions in Zircaloy. Before using your blade, we had little success sectioning these types of samples.”
The customer further reported that the SMART CUT® blade provided reproducible results and maintained consistent performance across multiple materials without the need for frequent blade replacement or adjustments.
Case Study No. 5 - Sectioning of Low Carbon Steel Using SMART CUT® New Generation Metal Bond Diamond Wafering Blades
Objective
The purpose of this study was to evaluate the performance of the SMART CUT® New Generation metal bond diamond wafering blade compared to a conventional metal bond wafering blade when sectioning low carbon steel specimens. The study focused on cutting speed, surface quality, and overall process efficiency.
Experimental Setup
Wafering Blade Tested
- SMART CUT® New Generation Metal Bond Diamond Wafering Blade
- Dimensions: 6" x 0.020" x ½" arbor hole
Material
- Low Carbon Steel (AISI 1018 type)
Specimen Size
- Diameter: 5/8 inch (15.9 mm)
Equipment Used
- Isomet 1000 precision low-speed wafering saw
Cutting Parameters
|
Parameter |
Setting |
|---|---|
|
Feed Mechanism |
Gravity feed |
|
Coolant |
Water-soluble coolant, continuous flow |
|
Coolant Dilution |
25:1 |
|
Blade Dressing |
Prior to each cut |
|
Applied Load |
80 grams |
|
Wheel Speed |
Full dial setting (maximum recommended by Isomet 1000) |
Each specimen was sectioned perpendicular to the longitudinal axis, and cutting times were measured from initial contact to complete separation. The average cutting time for each blade type was calculated from three repeated trials.
Average Cutting Time for Low Carbon Steel (in minutes)
|
Blade Type |
Average Cutting Time |
|---|---|
|
SMART CUT® New Generation Metal Bond |
1.51 minutes |
|
Conventional Metal Bond |
5.15 minutes |
The SMART CUT® wafering blade completed the cut 2.32 times faster than the conventional metal bond blade. The improvement in cutting efficiency was accompanied by smoother surface finishes and less thermal discoloration at the cut interface.
Observations
The SMART CUT® blade exhibited a stable cutting rate and consistent performance through multiple runs, with no glazing or significant drop in speed. The conventional metal bond blade, by comparison, showed progressive slowing after initial cuts, indicating bond loading and reduced diamond exposure.
Visual inspection under a metallographic microscope revealed that samples sectioned with the SMART CUT® blade maintained a uniform surface finish with minimal burr formation and negligible deformation at the edges. The improved results are attributed to superior diamond retention and the self-sharpening behavior of the SMART CUT® bond matrix.
Blade wear was uniform, and the dressing frequency required was noticeably lower than that of the conventional blade. This confirmed improved wear resistance and higher efficiency per unit of material removed.
Discussion
Low carbon steel is a relatively soft and ductile material that often poses challenges during precision sectioning. Conventional metal bond blades tend to load quickly, resulting in reduced cutting rates and poor surface quality. The SMART CUT® New Generation metal bond design incorporates several improvements to address these limitations:
- Optimized Diamond Exposure: Ensures consistent engagement of sharp cutting edges and reduces material smearing.
- Enhanced Bond Composition: The proprietary metal matrix maintains balance between diamond retention and release, improving cutting efficiency and blade life.
- Improved Heat Dissipation: Lower cutting temperature minimizes structural changes in the steel and reduces coolant demand.
The combination of these features enables faster sectioning with cleaner surfaces and less risk of thermal or mechanical alteration to the specimen microstructure.
Conclusion
Testing confirmed that the SMART CUT® New Generation Metal Bond Diamond Wafering Blade cut low carbon steel 2.32 times faster than the conventional metal bond wafering blade. It also produced cleaner, cooler, and more consistent cuts, with longer service life and reduced dressing requirements.
This study demonstrates the superior performance of SMART CUT® blades in metallographic applications where both speed and precision are required. Laboratories and research facilities performing high-throughput sectioning of metallic samples can achieve substantial gains in productivity and sample quality using SMART CUT® New Generation Metal Bond Wafering Blades.
Case Study No. 7 - Wafering Blade Cutting Time Comparison for Ferrous Metals
Objective
The purpose of this study was to compare the cutting performance of SMART CUT® Series 15HCU and SMART CUT® Series 20HCU metal bond diamond wafering blades with a CBN (Cubic Boron Nitride) wafering blade when sectioning various ferrous metals under controlled laboratory conditions. The goal was to evaluate the influence of blade type and cutting speed (RPM) on cutting time, precision, and consistency.
Materials and Equipment
Materials Tested:
White Iron, 304 Stainless Steel, and Gray Iron
Equipment Used:
Precision abrasive cut-off saw with adjustable RPM and controlled feed rate.
Blade Types:
- SMART CUT® Series 15HCU – Fine diamond size, optimized for precision and reduced surface damage.
- SMART CUT® Series 20HCU – Medium diamond size, engineered for higher removal rates and extended blade life.
- CBN Wafering Blade – Used for reference to evaluate comparative cutting behavior on ferrous materials.
Cutting Parameters
|
Parameter |
Value |
|---|---|
|
Cutting Speeds Tested |
950 RPM and 4,000 RPM |
|
Coolant |
SMART CUT® Water-Soluble Coolant |
|
Coolant Dilution Ratio |
25:1 |
|
Feed Type |
Gravity feed |
|
Dressing |
Performed before each test sequence |
|
Sample Size |
12 mm diameter rods |
|
Applied Load |
80 grams |
All tests were conducted under identical operating conditions to ensure repeatable results. Cutting times were recorded from the start of material engagement until complete separation.
Results
The data show that cutting speed has a major effect on sectioning efficiency and that SMART CUT® diamond wafering blades significantly outperform conventional and slower-cutting options at both low and high speeds.
At 950 RPM, large differences were observed between the three blade types. The CBN blade consistently produced the fastest cuts, followed by the SMART CUT® Series 15HCU and 20HCU blades. However, when cutting speed increased to 4,000 RPM, the variation among blades narrowed substantially, with all blades achieving much faster cutting times.
Key Observations from Results (from chart data):
- At 950 RPM, cutting White Iron with SMART CUT® Series 15HCU required approximately 60% less time than with Series 20HCU.
- 304 Stainless Steel showed similar behavior, where SMART CUT® 15HCU cut more than twice as fast as Series 20HCU at low RPM.
- At higher speed (4,000 RPM), the cutting time difference between diamond and CBN blades became negligible for all materials tested.
- Overall cutting time decreased by more than 80–90% when increasing the saw speed from 950 RPM to 4,000 RPM.
Analysis
The performance improvement with increased RPM demonstrates that higher cutting speeds reduce frictional loading and allow more efficient chip evacuation from the cut zone. This results in lower mechanical stress and shorter cutting times.
The SMART CUT® blades maintained consistent cutting action throughout testing, showing minimal glazing or loading compared to conventional metal bond blades. The bond formulation allowed for controlled diamond exposure, promoting continuous self-sharpening and stable cutting forces.
The CBN blade provided the highest initial cutting rate on ferrous metals, which is consistent with its material properties. However, SMART CUT® Series 15HCU and 20HCU exhibited smoother surface finishes, reduced burr formation, and less thermal damage, especially at high RPM.
Discussion
At lower speeds (950 RPM), cutting behavior is strongly influenced by diamond grit size and bond hardness. Finer diamond blades, such as SMART CUT® Series 15HCU, tend to cut slower but produce higher-quality surfaces. The Series 20HCU, designed for more aggressive cutting, shows greater variation at low speeds due to limited self-sharpening activity.
At higher speeds (4,000 RPM), the difference between diamond and CBN blades becomes less significant. The increase in peripheral speed allows all blade types to achieve more efficient cutting with less influence from bond characteristics.
However, while CBN blades excel in cutting speed on ferrous metals, SMART CUT® diamond blades offer broader versatility across metallic and non-metallic materials, making them the preferred choice for laboratories that process a wide range of sample types.
Conclusion
This study confirms that:
- Higher RPM operation significantly improves cutting efficiency for ferrous metals, reducing cutting time by up to 90%.
- SMART CUT® Series 15HCU and 20HCU diamond wafering blades perform consistently across a wide range of materials and cutting speeds.
- The CBN blade provides the fastest cutting rate on ferrous materials, but SMART CUT® blades deliver superior surface finish and longer tool life.
- Differences in performance between diamond and CBN blades become less noticeable at higher speeds (4,000 RPM).
The results demonstrate that the SMART CUT® New Generation Metal Bond Wafering Blades combine high performance, excellent cut quality, and stability across various materials and operating conditions, providing laboratories with a reliable solution for both precision and production applications.
Case Study No. 8 - Wafering Blade Cutting Time Comparison for Advanced Ceramics
Objective
The objective of this study was to evaluate and compare the cutting performance of three SMART CUT® Series metal bond diamond wafering blades—10LCU, 15LCU, and 20LCU—when sectioning advanced ceramic materials under identical operating conditions. The comparison focused on cutting time, performance consistency, and the effect of rotational speed (RPM) on overall sectioning efficiency.
Materials and Equipment
Materials Tested:
- Zirconia (ZrO₂)
- Alumina (Al₂O₃, 99.5% purity)
Equipment Used:
Precision low-speed wafering saw with adjustable rotational speeds and continuous coolant feed system.
Blades Tested:
- SMART CUT® Series 10LCU – Fine diamond size, designed for highest surface quality and minimal chipping.
- SMART CUT® Series 15LCU – Medium diamond size, balanced for cutting speed and surface integrity.
- SMART CUT® Series 20LCU – Coarser diamond size, optimized for faster sectioning and higher material removal rates.
Cutting Parameters
|
Parameter |
Value |
|---|---|
|
Cutting Speeds Tested |
950 RPM and 4,000 RPM |
|
Coolant Type |
SMART CUT® Water-Soluble Coolant |
|
Coolant Dilution Ratio |
25:1 |
|
Feed Type |
Gravity feed |
|
Blade Dressing |
Before each test sequence |
|
Specimen Diameter |
12 mm rods |
|
Applied Load |
80 grams |
All samples were sectioned under identical conditions to ensure consistent and repeatable data. Each cut was timed from initial contact to full separation of the specimen.
Results
The results demonstrate that cutting speed has a significant influence on sectioning performance for advanced ceramics. At lower rotational speeds (950 RPM), differences among blade series were much more pronounced, while at higher speeds (4,000 RPM), performance among all three blade types became more uniform.
|
Material |
SPEED |
20LCU |
15LCU |
10LCU |
|---|---|---|---|---|
|
Zirconia |
950 RPM |
~2.5 min |
~2.8 min |
~3.0 min |
|
Alumina |
950 RPM |
~3.0 min |
~4.0 min |
~15.5 min |
|
Zirconia |
4,000 RPM |
~1.2 min |
~1.3 min |
~1.4 min |
|
Alumina |
4,000 RPM |
~1.3 min |
~1.4 min |
~1.6 min |
At 950 RPM, the SMART CUT® 10LCU blade, which has the finest diamond grit, exhibited significantly longer cutting times, particularly when sectioning alumina, where cutting time exceeded 15 minutes. In contrast, the 20LCU and 15LCU blades achieved much faster cuts while maintaining excellent surface quality.
When operating at 4,000 RPM, all blade types showed substantial improvements in cutting time, with the differences between series becoming minimal—typically less than 0.2 minutes apart. The higher RPM improved coolant effectiveness, reduced loading, and enhanced cutting stability.
Observations
- At lower RPM, finer diamond blades (10LCU) cut noticeably slower due to limited self-sharpening and reduced diamond exposure.
- At higher RPM (4,000), all SMART CUT® blades achieved similar performance, with cutting times decreasing by nearly 80–90% compared to low-speed operation.
- The SMART CUT® Series 15LCU provided an optimal balance of speed, surface finish, and wear resistance, making it ideal for routine sectioning of ceramics like zirconia and alumina.
- The SMART CUT® Series 10LCU remains preferred for critical applications where surface integrity and microstructure preservation are more important than cutting speed.
Discussion
Advanced ceramics such as zirconia and alumina present unique cutting challenges due to their extreme hardness, brittleness, and low fracture toughness. Improper blade selection or insufficient RPM often results in microcracking, excessive chipping, or thermal stress.
The results clearly indicate that higher cutting speeds significantly reduce the variation in cutting time between different blade grit sizes. At elevated RPM, coolant flow efficiency improves, and the increased peripheral speed promotes cleaner, faster sectioning with lower mechanical stress.
At lower RPM (950), coarse diamond blades like SMART CUT® 20LCU maintain better self-sharpening behavior and cut faster, while finer-grit blades such as 10LCU tend to polish rather than cut, leading to slower rates and potential heat buildup.
Conclusion
This study demonstrates that:
- Increasing the cutting speed from 950 to 4,000 RPM results in a substantial reduction in cutting time across all SMART CUT® blade series.
- The difference in cutting performance between fine, medium, and coarse diamond sizes becomes negligible at high RPM operation.
- SMART CUT® Series 15LCU provides the best balance between cutting speed and surface finish for most ceramic materials.
- For applications requiring extreme precision, SMART CUT® 10LCU remains the optimal choice despite slower cutting rates.
Overall, SMART CUT® Metal Bond Diamond Wafering Blades deliver consistent, high-quality performance for advanced ceramics, providing laboratories with precise, repeatable, and efficient sectioning results across a wide range of material hardness and brittleness.
Case Study No. 9 - Wafering Blade Cutting Time Comparison for Advanced Ceramics at 3,000 RPM
Objective
The purpose of this study was to evaluate and compare the cutting efficiency of SMART CUT® Series 15HCU and SMART CUT® Series 20HCU New Generation metal bond diamond wafering blades when sectioning various advanced ceramic materials under identical operating conditions. The goal was to determine the relationship between blade bond formulation, diamond concentration, and cutting performance at a rotational speed of 3,000 RPM.
Materials and Equipment
Materials Tested:
- 1. Extruded Alumina (Al₂O₃)
- 2. Hot-Pressed Silicon Nitride (Si₃N₄)
- 3. Yttrium Aluminum Garnet (YAG)
- 4. Tungsten Carbide (6% Cobalt Binder, WC-Co)
Equipment Used:
- Precision Cutting Machine: SMART CUT® 6001 GP
- Wafering Blade Dimensions: 6" x 0.020" x ½"
- Coolant: SMART CUT® Water-Soluble Coolant, Advanced Materials Formula
- Cutting Speed: 3,000 RPM
- Material Diameter: 0.25" (6.4 mm) rod for each sample
Cutting Parameters
|
Parameter |
Setting |
|---|---|
|
Speed |
3,000 RPM |
|
Feed Rate |
Medium (Low for Si₃N₄) |
|
Coolant |
SMART CUT® 6001 GP Advanced Formula |
|
Blade Type |
SMART CUT® Series 15HCU and 20HCU |
|
Diamond Concentration |
Standard concentration for each bond series |
|
Dressing |
Performed prior to test sequence |
|
Measurement |
Average cutting time in seconds per complete cut |
All samples were sectioned under identical load, coolant flow, and feed rate conditions. Each test was repeated three times to ensure data accuracy and repeatability.
Results
|
Material |
Blade Type |
RPM |
Feed Rate |
Average Cutting Time (seconds) |
|---|---|---|---|---|
|
Tungsten Carbide 6% Co |
SMART CUT® 15HCU |
3,000 |
Medium |
15 |
|
Extruded Alumina (Al₂O₃) |
SMART CUT® 15HCU |
3,000 |
Medium |
40 |
|
Yttrium Aluminum Garnet (YAG) |
SMART CUT® 15HCU |
3,000 |
Medium |
78 |
|
Hot-Pressed Silicon Nitride (Si₃N₄) |
SMART CUT® 20HCU |
3,000 |
Low |
35 |
The data clearly show that cutting time varies significantly based on both material hardness and microstructure. The SMART CUT® Series 15HCU achieved superior performance in most materials, providing faster and smoother cuts, while the 20HCU blade performed optimally in tougher, denser ceramics such as silicon nitride.
Observations
- Tungsten Carbide (6% Co) was sectioned in only 15 seconds, indicating excellent blade sharpness and minimal wear.
- YAG, a dense crystalline material, required the longest time (~78 seconds) due to its high hardness and thermal conductivity.
- Hot-Pressed Silicon Nitride (Si₃N₄), one of the most difficult ceramics to cut, demonstrated best performance with the SMART CUT® Series 20HCU, confirming that this coarser bond matrix provides better diamond retention under high stress.
- The SMART CUT® 15HCU maintained excellent stability and surface quality across all materials, with minimal edge chipping and no visible thermal cracking.
Cutting surfaces were examined under 50× magnification, confirming uniform material removal, minimal subsurface damage, and consistent kerf width across all specimens.
Analysis
The improved results achieved by SMART CUT® blades can be attributed to their advanced bond formulation and optimized diamond exposure mechanism.
- The 15HCU bond provides excellent sharpness and efficiency on moderately hard ceramics such as alumina and YAG. Its balanced hardness allows continuous exposure of new cutting edges without excessive diamond pull-out.
- The 20HCU bond, being slightly harder, performs better on dense, high-strength ceramics such as silicon nitride, where greater pressure and cutting resistance are encountered.
- Uniform coolant delivery and stable feed rates further enhanced performance by maintaining low cutting temperatures and preventing microfracture propagation in the brittle ceramic matrix.
These results demonstrate that both SMART CUT® Series 15HCU and 20HCU blades can deliver rapid, controlled, and repeatable cutting performance under high-speed operation.
Conclusion
At a cutting speed of 3,000 RPM, SMART CUT® New Generation Metal Bond Diamond Wafering Blades exhibited outstanding performance across a range of advanced ceramic materials.
- SMART CUT® 15HCU achieved cutting times as low as 15 seconds on tungsten carbide and maintained excellent surface integrity on alumina and YAG.
- SMART CUT® 20HCU was particularly effective for silicon nitride, demonstrating high cutting efficiency with minimal tool wear.
- Both blade types provided consistent performance and stable operation, confirming suitability for precision cutting of dense, brittle ceramics used in research and production environments.
These findings confirm that SMART CUT® technology provides measurable improvements in cutting speed, accuracy, and longevity, allowing laboratories to achieve faster sectioning without compromising sample quality or structural integrity.
Case Study No. 10 - Diamond vs. CBN (Cubic Boron Nitride) Cutting Speed Comparison for Ferrous Metals
Objective
The objective of this study was to compare the cutting performance of SMART CUT® Series 15HCU diamond wafering blades with CBN (Cubic Boron Nitride) wafering blades under identical cutting conditions on various ferrous-based materials. The study aimed to quantify differences in cutting time, consistency, and performance stability across multiple cuts and material types.
Experimental Setup
Materials Tested:
- Heat-Resistant Alloys (15 mm diameter)
- Tool Steel (12 mm diameter)
- Nickel-Based Superalloys (10 x 8 mm specimens)
Equipment Used:
- Precision Low-Speed Wafering Saw (450 RPM)
- Wafering Blade Size: 4" x 0.012" x ½"
- Bond Type: Sintered Metal Bond
- Grit Size: Medium
- Coolant: Mineral Oil
- Feed Rate / Load: Medium
- Dressing: None (blades were not dressed between cuts)
Blades Tested:
- SMART CUT® Series 15HCU Diamond Wafering Blade
- CBN (Cubic Boron Nitride) METACUT Wafering Blade
Each sample was subjected to three consecutive cuts to evaluate both initial and sustained cutting efficiency.
Methodology
Both diamond and CBN wafering blades were tested under identical conditions to ensure fair comparison. The primary variable measured was cutting time (in minutes) per cut. No blade dressing was performed between cuts to assess self-sharpening behavior, wear rate, and consistency.
Each cut was performed under continuous coolant flow to maintain constant lubrication and temperature control. Average cutting times were recorded and plotted across three successive cuts for each material.
Results
1. Heat-Resistant Alloys (15 mm diameter)
|
Cut |
SMART CUT® 15HCU (Diamond) |
CBN (METACUT) |
|---|---|---|
|
Cut 1 |
71 min |
9 min |
|
Cut 2 |
114 min |
14 min |
|
Cut 3 |
161 min |
18 min |
CBN Wafering Blades Cut 8.44× Faster
2. Tool Steel (12 mm diameter)
|
Cut |
SMART CUT® 15HCU (Diamond) |
CBN (METACUT) |
|---|---|---|
|
Cut 1 |
71 min |
8 min |
|
Cut 2 |
109 min |
8.5 min |
|
Cut 3 |
142 min |
14 min |
CBN Wafering Blades Cut 11.6× Faster
3. Nickel Superalloys (10 × 8 mm)
|
Cut |
SMART CUT® 15HCU (Diamond) |
CBN (METACUT) |
|---|---|---|
|
Cut 1 |
8 min |
3.5 min |
|
Cut 2 |
10 min |
4 min |
|
Cut 3 |
12 min |
4.5 min |
CBN Wafering Blades Cut 1.83× Faster
Observations
- Across all ferrous materials, CBN wafering blades consistently outperformed diamond blades, especially in high-strength tool steels and heat-resistant alloys.
- The cutting time difference became more pronounced with each consecutive cut. Diamond blades exhibited rapid wear and increased cutting time, while CBN blades maintained stable performance and lower cutting resistance.
- Heat-resistant alloys and hardened steels demonstrated the largest performance gap, with CBN blades cutting up to 11 times faster.
- For nickel-based superalloys, the performance difference was smaller but still significant, as CBN blades sustained faster cutting without glazing or dulling.
- Surface finish and edge quality produced by both blade types were comparable, though CBN blades generated less thermal discoloration and smoother kerf surfaces.
Analysis
Diamond wafering blades, while ideal for non-ferrous materials, are less effective when cutting ferrous metals. The primary reason is the chemical reactivity between iron and carbon, which causes diamond (carbon) to graphitize at elevated temperatures, leading to rapid wear and reduced efficiency.
CBN (Cubic Boron Nitride), by contrast, remains chemically stable in contact with ferrous metals. Its superior thermal conductivity and hardness (second only to diamond) allow for faster material removal, lower friction, and reduced wear.
The CBN METACUT blade maintained sharpness and structural integrity across all three cuts, demonstrating excellent wear resistance and self-sharpening characteristics. In contrast, SMART CUT® 15HCU blades gradually lost cutting efficiency due to bond glazing and diamond attrition, requiring higher force and longer cutting time.
Discussion
These results confirm that while SMART CUT® Diamond Wafering Blades provide exceptional performance for ceramics, composites, and non-ferrous materials, CBN blades are far superior for ferrous-based materials such as tool steels, heat-resistant alloys, and nickel superalloys.
The magnitude of improvement depends on the hardness and toughness of the metal being sectioned. Materials with higher iron content and greater toughness, such as hardened steels and nickel-based alloys, show the greatest benefit from using CBN blades.
In applications requiring both speed and durability, the use of CBN Wafering Blades significantly enhances productivity, reduces tool wear, and minimizes risk of metallurgical damage caused by excessive heat buildup.
Conclusion
- CBN Wafering Blades cut 8 to 12 times faster than SMART CUT® Diamond Wafering Blades when used on ferrous metals.
- Diamond blades exhibited progressive wear and increased cutting time across multiple cuts, while CBN blades maintained consistent cutting rates.
- CBN blades produced lower cutting temperatures, smoother kerf surfaces, and reduced loading, extending tool life and improving process reliability.
- For laboratories and production environments cutting steels, superalloys, or other ferrous materials, CBN wafering blades represent the optimal solution for performance, longevity, and cost efficiency.
SMART CUT® Diamond Wafering Blades remain the preferred choice for non-ferrous, ceramic, composite, and semiconductor materials where maximum surface integrity and precision are required.
Case Study No. 11 - Sectioning of Alumina Oxide Gas Cups Using SMART CUT® 4002 Precision Diamond Wafering Saw
Objective
The purpose of this case study was to evaluate the capability of the SMART CUT® 4002 Precision Diamond Sectioning Saw for sectioning advanced ceramic tubing used in alumina oxide gas cup applications. The customer’s objective was to precisely section 0.400 inches of ceramic tubing without microstructural damage or edge chipping. The customer initially believed that only a low-speed sectioning saw could achieve this level of precision.
Material and Application Details
|
Parameter |
Specification |
|---|---|
|
Material Type |
Alumina Oxide (Advanced Ceramic) |
|
Material Form |
Tubular – Ultra Hard and Brittle |
|
Material Length |
1.8 inches |
|
Material Diameter |
1.21 inches |
|
Application |
Sectioning of alumina oxide gas cups |
|
Sectioning Method |
Manual Feed |
|
Coolant Used |
Synthetic, water-soluble coolant |
|
RPM Used |
3,200 RPM |
The SMART CUT® 4002 precision diamond saw was selected for its ability to maintain tight dimensional tolerances and minimize microfracture in brittle materials at higher cutting speeds.
Process and Methodology
Series 15LCU SMART CUT® Metal Bond Diamond Wafering Blade was selected for this application. The blade was mounted on the SMART CUT® 4002 saw, and continuous coolant flow was applied during sectioning to ensure optimal temperature control and prevent thermal damage.
Cutting was performed manually with steady feed pressure. The coolant maintained lubrication and removed debris efficiently, contributing to stable blade performance and consistent surface finish.
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Carlos Sanchez is a senior technical specialist and field applications trainer with more than 17 years of experience in the use and optimization of industrial diamond tools, including ultra-thin diamond blades, core drills, and CBN grinding wheels. With a foundation in industrial engineering and technical operations, Mr. Sanchez has worked extensively with manufacturers and laboratories around the world, providing hands-on support and practical training for a wide range of cutting, grinding, and sample preparation applications.
Fluent in both English and Spanish, Carlos is known for his ability to translate complex tooling concepts into clear, actionable procedures for engineers, technicians, and production staff. His approach emphasizes real-world process improvement, tool longevity, and operator education—ensuring clients get the most out of their diamond tooling investments.
As an author, Mr. Sanchez shares field-tested insights on tool performance optimization, defect prevention, training methodologies, and troubleshooting common cutting issues.

