Dicing Blade Case Studies
02
Jun
This article provides important guidelines for optimizing the dicing process in semiconductor packaging, focusing on package singulation for various technologies such as BGA, QFN, LED, CMOS, and wafer substrates. It covers key variables such as the recommended blade types, coolant options, RPMs, feed rates, and mounting methods to ensure high-quality results and efficient throughput. By exploring specific material requirements and common concerns, this guide offers valuable insights into selecting the ideal dicing parameters for each application.
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DICING SOLUTIONS FOR PACKAGE SINGULATION
BGA (Ball-Grid Array)
Common Materials: FR4 and epoxy mold compound
Variations:
- LFBGA (Low-Profile Fine-Pitch)
- TFBGA (Thin & Fine-Pitch)
- W-BGA (Window-Type)
- FC-BGA (Flip Chip)
- VFBGA (Very Fine-Pitch)
- POP (Package-on-Package)
- SIP (System-in-Package)
- SD (Secure Digital)
- Micro SD Card
- CBGA (Ceramic)
- PBGA (Plastic)
- UFBG (Ultra-Fine)
- MBGA (Micro)
Typical Concerns:
- Cut quality
- chipping
- burrs
- slivers
- protrusions
- race shorts
- Blade life
Dicing Blade Recommendation:
- SMART CUT HYBRID BOND or sintered (metal bond) series
- Diamond size: 30 – 55 microns
- Blade Thickness: .008” – .014”
Dicing Process Recommendations:
- Feed rate: 50-250 mm/sec
- Spindle speed: 20-40 krpm depending on blade O.D.
- Multi panel mounting on UV tape
- Minimal dressing so as not to create a large radius on the blade edge
Common Materials - C194 and epoxy mold compound.
Variations:
- HVQFN (Heatsink Very-Thin)
- MLF (Micro Lead Frame)
- FUSION QUADR
- (VQFP: Very Thin Quad Flat Package)
- HQFN (High Power)
Typical Concerns:
- Chipping
- Burrs
- Lead smearing
- Melting
Dicing Blade Recommendation:
- SMART CUT HYBRID BOND or sintered (metal bond) series
- Diamond grit size: 45 – 88 microns
- Thickness: .008” – .020”
Dicing Process Recommendations:
- Feed rate: Half Etched substrates 30-75 mm/sec, Full Copper substrates 15-30 mm/sec
- Spindle speed: 22-35 krpm depending on blade O.D.
- Multi panel mounting on UV tape
- Override process over one substrate to reach final feed rate
LED (Light-Emitting Diode)
Common Materials - Copper, HTCC (High Temperature Co-fired Ceramics), LTCC (Low Temperature Co-fired Ceramics).
Variations:
Chip LED, High Power LED.
Typical Concerns:
- Copper burrs
- End of blade life due to limited exposure
- Throughput (maximize UPH)
Dicing Blade Recommendation:
- SMART CUT HYBRID BOND or Nickel Bond series
- Diamond size: 10,13 & 17 microns
- Thickness: .003” – .008”
Dicing Process Recommendations:
- Feed rate: 80-150 mm/sec
- Spindle speed: 25-30 krpm
- Multi panel mounting on UV tape
CMOS (Complementary Metal-Oxide Semiconductor)
Common Materials - Borosilicate Glass, HTCC (High Temperature Co-fired Ceramics).
Variations:
CIS (CMOS Image Sensor) Glass Lid, CIS (CMOS Image Sensor) Substrate.
Typical Concerns:
- Chip Damage and Breakage
- Cutting Precision and Kerf Control
- Heat Dissipation
- Surface Quality
- Blade Life & Consistency
Dicing Blade Recommendation:
- Bond Type: Resin Bond, Sintered (Metal Bond), Hybrid Bond, Nickel bond
- Diamond Size: 2 to 30 microns
- Kerf Thickness:10 to 30 microns
Dicing Process Recommendations:
- Feed rate: 80-150 mm/sec
- Spindle speed: 25-30 krpm
- Multi panel mounting on UV tape
DWDM (Dense Wavelength Division Mulitplexing) Filters
Common materials: Glass, Quartz.
Variations:
SAW (Surface Acoustic Wave) Filter devices, Beam Splitters, Passive Components
Typical Concerns:
- Top-side and back-side chipping
- Cut perpendicularity
- Kerf side surface finish
Dicing Blade Recommendation:
- SMART CUT series Resin, HYBRID, & Sintered (metal bond) blades
- Diamond size: 30 – 45 microns (resin) and 7 – 15 microns (sintered)
- Thickness: .006″ – .012”
Dicing Process Recommendations:
- Feed rate: 4 – 20 mm/sec
- Spindle speed: 20 – 30 krpm (2″) 10 – 15 krpm (4″)
- SMART CUT® XP Dicing Coolant Lubricant Surfacant may reduce chipping and improve surface finish
HDD (Hard Disk Drive)
Common Material: AlTic (Aluminum Titanium Carbon), Ferrite Ceramic.
Typical Concerns:
- High Mechanical (internal) stress
- burrs
- large kerf width
- lack of accuracy
Dicing Blade Recommendation:
- Bond Type: Resin Bond, Sintered (Metal Bond)
- Diamond Size: 1 to 25 microns
- Kerf Thickness: 15 to 100 microns
Dicing Process Recommendations:
- Feed Rates: 1 mm/s to 5 mm/s
- RPM’s: 15,000 RPM to 30,000 RPM
- Mounting Type: Vacuum chucks or magnetic chucks
- Coolant Used: Water-soluble coolants
The MR head substrate is made of ferromagnetic ceramic material, which has an extremely hard wear resistance and excellent magnetic properties. a typical MR substrate is AlTiC. Substrate thickness typically ranges from 200 to 300 microns. Substrates for HDD read heads require machining after being sintered into bars or sheets. Than they have to be diced into very small unit with very high precision tolerances.
Semiconductor Wafer
Common Material: Silicon, LiNbO3 (Lithium Niobate).
Typical Concerns:
- Feed Rates: 1 mm/s to 5 mm/s
- RPM’s: 15,000 RPM to 30,000 RPM
- Mounting Type: Vacuum chucks or magnetic chucks
- Coolant Used: Water-soluble coolants
Dicing Blade Recommendation:
- SMART CUT Nickel Bond or HYBRID series
- Diamond size: 4 – 6 microns
- Thickness: .0008” – .0016”
Dicing Process Recommendations:
- Feed rate: 25 – 75 mm/sec
- Spindle speed: 30 – 50 krpm
- Mounting: Blue or UV tape
- Cooling type: DI water with and without additives
- Carbon dioxide bubbler is optional
Silicon & GaAs are the two most common materials used for semiconductor wafers. Wafers are typically available in sizes up to 12" in diameter, with 6" and 8" most popular. Typical thicknesses are between 100 - 650 microns.
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