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19 Sep

semiconductor industry

Improving Diamond Dicing Blade Performance: Key Factors and Strategies

September 23, 2025
Posted by contactor6

Diamond dicing is one of the most important step in semiconductor & microelectronics manufacturing package. Although the process itself does not add direct value to the finished device, it has a decisive impact on yield,...

18 Sep

semiconductor industry

From Silicon Wafer to Microchip: The Role of Dicing in Integrated Circuit Manufacturing

September 18, 2025
Posted by contactor6

The making of the integrated circuit is a long and complex process that involves many critical steps. In most cases, the wafer travels to multiple facilities before it is completed and turned into the final...

17 Sep

semiconductor industry

Total Cost of Ownership – Measuring the Real Economics of Diamond Dicing

November 14, 2025
Posted by contactor6

Many companies still judge diamond dicing blades by purchase price alone. At first, the cheapest blade may appear to be the best choice. However, price does not equal cost. The real economics of diamond dicing...

02 Sep

semiconductor industry

Practical Guide to Semiconductor Wafer Dicing: Materials, Blades, and Process Optimization

November 14, 2025
Posted by contactor6

Semiconductor wafers are the foundation of nearly all modern electronics, from integrated circuits and photonic devices to advanced power components. As device geometries shrink and packaging density increases, the requirements placed on wafer dicing processes...

27 Aug

semiconductor industry

Selecting the Right Wafer Dicing Saw Practical Guide

October 3, 2025
Posted by contactor6

Selecting the proper wafer dicing saw is a important decision for manufacturers, researchers, and engineers working with large variety of materials. Whether processing silicon wafers in microelectronics, ceramics in materials science, or glass substrates in...

02 Jun

semiconductor industry

Dicing Blade Case Studies

November 5, 2025
Posted by Alexander Schneider
0 comments

Selecting the right dicing blade is important to achieving high yields, superior edge quality, and consistent reliability in microelectronics and optics manufacturing. Across industries such as semiconductors, electronics packaging, photonics, and precision optics, even small...

02 Jun

semiconductor industry

Application Recommendations

November 5, 2025
Posted by Brian Farberov
0 comments

This article provides important guidelines for optimizing the dicing process in semiconductor packaging, focusing on package singulation for various technologies such as BGA, QFN, LED, CMOS, and wafer substrates. It covers key variables such as...

02 Jun

Uncategorized, semiconductor industry

Trouble Shooting Dicing Problems

July 14, 2025
Posted by Leon Meyer
0 comments

Guide on most common dicing problems and how to resolve them Share this Article with Friend or Colleague ARE YOU USING RIGHT TOOLS FOR YOUR APPLICATION? LET USHELP YOU CONTACT US HAVING ISSUES WITH YOUR CURRENT TOOLS? What...

02 Jun

semiconductor industry

Optimizing your Diamond Dicing Performance

October 7, 2025
Posted by Ayan Sadyk
0 comments

Share this Article with Friend or Colleague The performance of diamond dicing blades is influenced by a wide range of interdependent variables, and understanding these factors is essential for selecting the correct blade specifications and...