Diamond dicing is one of the most important step in semiconductor & microelectronics manufacturing package. Although the process itself does not add direct value to the finished device, it has a decisive impact on yield,...

The making of the integrated circuit is a long and complex process that involves many critical steps. In most cases, the wafer travels to multiple facilities before it is completed and turned into the final...

Many companies still judge diamond dicing blades by purchase price alone. At first, the cheapest blade may appear to be the best choice. However, price does not equal cost. The real economics of diamond dicing...

Semiconductor wafers are the foundation of nearly all modern electronics, from integrated circuits and photonic devices to advanced power components. As device geometries shrink and packaging density increases, the requirements placed on wafer dicing processes...

Selecting the proper wafer dicing saw is a important decision for manufacturers, researchers, and engineers working with large variety of materials. Whether processing silicon wafers in microelectronics, ceramics in materials science, or glass substrates in...