SMART CUT® RP 4000YX / 5000YX Precision Grinding & Polishing Machine is a next-generation semi-automatic system engineered for high-precision sample preparation in applications involving semiconductor wafers, advanced ceramics, metallographic specimens, and other hard or brittle materials requiring stringent surface finish tolerances and material removal accuracy.
This system offers vacuum adsorption to securely hold samples in place during the grinding and polishing process. The 4000YX model is specifically designed to accommodate samples up to 4 inches in diameter, while the 5000YX model supports wafers up to 6 inches.
Both models allow for adjustable sample tilt ranging from 0 to 10 degrees, enabling users to optimize contact uniformity and achieve superior polishing results across uneven or variably shaped surfaces.
To enhance control over the process, the machine utilizes a gravity-based pressurization mechanism, allowing users to continuously adjust the sample loading force between 0 and 4 kilograms. The polishing head incorporates a programmable oscillation mechanism, swinging the sample left and right to simulate the manual polishing motion, which improves the evenness of surface finishing. The swing amplitude can be adjusted between 0 and 15 degrees, while the swing speed of the arm remains stable and can be fine-tuned to match the specific polishing requirements of different materials.
A powerful 1-kilowatt independent motor drives the polishing disc, ensuring consistent torque across the entire speed range. This system maintains performance regardless of the rotational speed or the pressure applied during the operation. The grinding and polishing disc operates within a wide rotational speed range from 5 to 100 revolutions per minute, enabling operators to tailor the process to both coarse and fine grinding requirements.
Users interact with the system through an intuitive full-touchscreen interface that simplifies parameter setup and process control. All operational settings—including disc rotation speed, duration, direction, and swing parameters—are digitally programmable and can be saved for future use. The system supports up to 64 user-defined polishing programs, which allow repeatable processes and efficient transitions between different sample types or preparation protocols.
An integrated four-station droplet dispensing system is included to facilitate the precise application of different abrasives or polishing fluids. Each droplet channel supports a flow rate adjustable between 1 and 100 milliliters per minute, enabling tailored control of fluid delivery to each polishing station.
Both models are powered by a standard AC220V 50Hz power supply and come housed in a compact, durable frame with physical dimensions of 760 × 430 × 360 mm (L × W × H) and a net weight of approximately 30 kg. The system includes all necessary standard accessories such as grinding/polishing platens, vacuum trays, abrasive dispensers, and a maintenance tool kit.
this system combines engineering precision, user-centric design, and process automation to meet the rigorous demands of material research, quality assurance, semiconductor fabrication, and petrographic analysis. It offers a high degree of flexibility, making it ideal for laboratories and facilities requiring precise, repeatable, and customizable grinding and polishing performance.
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Specification |
SMART CUT® RP 4000YX |
SMART CUT® RP 5000YX |
|---|---|---|
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Number of Grinding/Polishing Heads |
1 |
2 |
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Max Sample Diameter |
3” (optional: 4”) |
5” (optional: 6”) |
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Resolution |
1 micron |
1 micron |
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Sample Tilt Angle Range |
0° to 10° |
0° to 10° |
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Adjustable Sample Loading Force |
0 – 4 kg (continuous) |
0 – 4 kg (continuous) |
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Arm Swing Amplitude |
0° to 15° adjustable |
0° to 15° adjustable |
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Arm Swing Speed |
Variable & adjustable |
Variable & adjustable |
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Disc Diameter |
Ø300 mm |
Ø400 mm |
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Disc Drive Motor |
1.0 kW |
1.0 kW |
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Disc Speed Range |
5 – 100 RPM |
5 – 100 RPM |
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Rotation Direction |
Clockwise/Counterclockwise with auto switching |
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|
Manual Speed Settings |
V1 = 5, V2 = 15, V3 = 25, V4 = 50 (User-defined) |
|
|
Stored Process Parameters |
64 programmable modes |
64 programmable modes |
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Droplet Dispensing Units |
4 |
4 |
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Droplet Speed |
1 – 100 mL/min |
1 – 100 mL/min |
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Power Supply |
AC 220V, 50 Hz |
AC 220V, 50 Hz |
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Dimensions (L × W × H) |
760 × 430 × 360 mm |
760 × 430 × 360 mm |
|
Weight |
30 kg |
30 kg |
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Delivers sub-micron level grinding and polishing accuracy, ideal for advanced materials and critical applications.
Ensures stable and secure sample fixation without mechanical clamping, minimizing deformation or slippage.
AUTOPOL100YX accommodates up to 4″ wafers; AUTOPOL200YX supports up to 6″ wafers, offering flexibility across sample sizes.
Sample tilt angle adjustable from 0° to 10°, enhancing contact uniformity and improving surface finish consistency.
Gravity-based pressure system allows continuous adjustment of sample force from 0 to 4 kg for optimal polishing conditions.Lorem ipsum dolor sit amet, consectetur adipiscing elit. Ut elit tellus, luctus nec ullamcorper mattis, pulvinar dapibus leo.
Swinging sample arm simulates manual motion to produce uniform results while reducing operator fatigue.
Swing amplitude customizable from 0° to 15°, with uniformly controlled swing speed for repeatable polishing motion.
Maintains consistent torque across all RPMs, ensuring reliable performance even under heavy loading conditions.
Accommodates both rough grinding and final polishing through variable disc speeds, enabling a full range of operations.
User-friendly full-color touchscreen simplifies parameter input, control, and monitoring for efficient operation.
Stores up to 64 user-defined programs including speed, time, and direction—ensuring repeatability and process optimization.
Integrated droplet system supports four different abrasive fluids, each with individually controlled flow rates (1–100 mL/min).
Ideal for laboratory environments requiring quiet, compact, and efficient equipment.
Suitable for semiconductor, petrographic, metallographic, ceramic, optical, and materials science sample preparation.
Built for continuous use in research, quality control, and production environments with minimal maintenance required
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