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SMART CUT® RP 4000YX / 5000YX
Precision Grinding & Polishing Machine
SMART CUT® RP 4000YX / 5000YX Precision Grinding & Polishing Machine is a next-generation semi-automatic system engineered for high-precision sample preparation in applications involving semiconductor wafers, advanced ceramics, metallographic specimens, and other hard or brittle materials requiring stringent surface finish tolerances and material removal accuracy.
This system offers vacuum adsorption to securely hold samples in place during the grinding and polishing process. The 4000YX model is specifically designed to accommodate samples up to 4 inches in diameter, while the 5000YX model supports wafers up to 6 inches.
DESCRIPTION
SPECIFICATIONS
FEATURES
INDUSTRIES USED IN
FAQ
ACCESSORIES
OPERATING MANUALS
DESCRIPTION
Both models allow for adjustable sample tilt ranging from 0 to 10 degrees, enabling users to optimize contact uniformity and achieve superior polishing results across uneven or variably shaped surfaces.
To enhance control over the process, the machine utilizes a gravity-based pressurization mechanism, allowing users to continuously adjust the sample loading force between 0 and 4 kilograms. The polishing head incorporates a programmable oscillation mechanism, swinging the sample left and right to simulate the manual polishing motion, which improves the evenness of surface finishing. The swing amplitude can be adjusted between 0 and 15 degrees, while the swing speed of the arm remains stable and can be fine-tuned to match the specific polishing requirements of different materials.
A powerful 1-kilowatt independent motor drives the polishing disc, ensuring consistent torque across the entire speed range. This system maintains performance regardless of the rotational speed or the pressure applied during the operation. The grinding and polishing disc operates within a wide rotational speed range from 5 to 100 revolutions per minute, enabling operators to tailor the process to both coarse and fine grinding requirements.
Users interact with the system through an intuitive full-touchscreen interface that simplifies parameter setup and process control. All operational settings—including disc rotation speed, duration, direction, and swing parameters—are digitally programmable and can be saved for future use. The system supports up to 64 user-defined polishing programs, which allow repeatable processes and efficient transitions between different sample types or preparation protocols.
An integrated four-station droplet dispensing system is included to facilitate the precise application of different abrasives or polishing fluids. Each droplet channel supports a flow rate adjustable between 1 and 100 milliliters per minute, enabling tailored control of fluid delivery to each polishing station.
Both models are powered by a standard AC220V 50Hz power supply and come housed in a compact, durable frame with physical dimensions of 760 × 430 × 360 mm (L × W × H) and a net weight of approximately 30 kg. The system includes all necessary standard accessories such as grinding/polishing platens, vacuum trays, abrasive dispensers, and a maintenance tool kit.
this system combines engineering precision, user-centric design, and process automation to meet the rigorous demands of material research, quality assurance, semiconductor fabrication, and petrographic analysis. It offers a high degree of flexibility, making it ideal for laboratories and facilities requiring precise, repeatable, and customizable grinding and polishing performance.
SPECIFICATIONS
Technical Specifications:
Specification |
SMART CUT® RP 4000YX |
SMART CUT® RP 5000YX |
---|---|---|
Number of Grinding/Polishing Heads |
1 |
2 |
Max Sample Diameter |
3” (optional: 4”) |
5” (optional: 6”) |
Resolution |
1 micron |
1 micron |
Sample Tilt Angle Range |
0° to 10° |
0° to 10° |
Adjustable Sample Loading Force |
0 – 4 kg (continuous) |
0 – 4 kg (continuous) |
Arm Swing Amplitude |
0° to 15° adjustable |
0° to 15° adjustable |
Arm Swing Speed |
Variable & adjustable |
Variable & adjustable |
Disc Diameter |
Ø300 mm |
Ø400 mm |
Disc Drive Motor |
1.0 kW |
1.0 kW |
Disc Speed Range |
5 – 100 RPM |
5 – 100 RPM |
Rotation Direction |
Clockwise/Counterclockwise with auto switching |
|
Manual Speed Settings |
V1 = 5, V2 = 15, V3 = 25, V4 = 50 (User-defined) |
|
Stored Process Parameters |
64 programmable modes |
64 programmable modes |
Droplet Dispensing Units |
4 |
4 |
Droplet Speed |
1 – 100 mL/min |
1 – 100 mL/min |
Power Supply |
AC 220V, 50 Hz |
AC 220V, 50 Hz |
Dimensions (L × W × H) |
760 × 430 × 360 mm |
760 × 430 × 360 mm |
Weight |
30 kg |
30 kg |
FEATURES
Key Features:
- High-Precision Material Removal:
Engineered for precision grinding and polishing applications requiring sub-micron level accuracy. - Vacuum Sample Fixation:
Secure sample holding through vacuum adsorption.- 4000YX: Compatible with wafers up to 4 inches
- 5000YX: Supports wafers up to 6 inches
- Adjustable Sample Tilt:
Enables fine-tuning of sample angle from 0° to 10°, improving polishing uniformity on uneven surfaces. - Gravity-Based Sample Loading:
Provides adjustable and stable loading force, continuously variable between 0 – 4 kg for optimal sample contact. - Semi-Automatic Sample Swing Functionality:
The sample stage oscillates laterally to simulate manual movement, improving polishing uniformity. - Programmable Swing Arm Speed and Amplitude:
- Swing amplitude adjustable from 0° to 15°
- Uniform and user-defined swing speed for repeatable results
- High-Powered Drive System:
Integrated 1KW independent motor ensures constant torque across all speeds for consistent performance, even under load. - Wide Speed Range:
Grinding/polishing disc speed adjustable from 5 to 100 RPM to suit various materials and process stages. - Touchscreen User Interface:
Full digital interface with intuitive controls for setting and saving process parameters. - Advanced Parameter Management:
Up to 64 programmable grinding and polishing modes, including:- Speed
- Time
- Rotation direction (clockwise/counterclockwise, forward/reverse switching)
- Abrasive Dispensing System:
- Integrated 4-station droplet control system
- Drip speed adjustable from 1 – 100 mL/min
- Allows different abrasives to be used at each polishing station
INDUSTRIES USED IN
Tab Content
FAQ
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ACCESSORIES
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OPERATING MANUALS
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Advantages:
High-Precision Performance
Delivers sub-micron level grinding and polishing accuracy, ideal for advanced materials and critical applications.
Vacuum-Based Sample Holding
Ensures stable and secure sample fixation without mechanical clamping, minimizing deformation or slippage.
Supports Multiple Wafer Sizes
AUTOPOL100YX accommodates up to 4″ wafers; AUTOPOL200YX supports up to 6″ wafers, offering flexibility across sample sizes.
Adjustable Sample Tilt
Sample tilt angle adjustable from 0° to 10°, enhancing contact uniformity and improving surface finish consistency.
Continuously Adjustable Loading Force
Gravity-based pressure system allows continuous adjustment of sample force from 0 to 4 kg for optimal polishing conditions.Lorem ipsum dolor sit amet, consectetur adipiscing elit. Ut elit tellus, luctus nec ullamcorper mattis, pulvinar dapibus leo.
Semi-Automatic Oscillating Motion
Swinging sample arm simulates manual motion to produce uniform results while reducing operator fatigue.
Adjustable Swing Amplitude and Speed
Swing amplitude customizable from 0° to 15°, with uniformly controlled swing speed for repeatable polishing motion.
Independent High-Torque Motor (1KW)
Maintains consistent torque across all RPMs, ensuring reliable performance even under heavy loading conditions.
Wide Speed Range (5 – 100 RPM)
Accommodates both rough grinding and final polishing through variable disc speeds, enabling a full range of operations.
Touchscreen Control Interface
User-friendly full-color touchscreen simplifies parameter input, control, and monitoring for efficient operation.
Process Memory and Automation
Stores up to 64 user-defined programs including speed, time, and direction—ensuring repeatability and process optimization.
Four-Channel Abrasive Dispenser
Integrated droplet system supports four different abrasive fluids, each with individually controlled flow rates (1–100 mL/min).
Compact Footprint with Low Operating Noise
Ideal for laboratory environments requiring quiet, compact, and efficient equipment.
Multi-Application Versatility
Suitable for semiconductor, petrographic, metallographic, ceramic, optical, and materials science sample preparation.
Robust Construction and Reliable Operation
Built for continuous use in research, quality control, and production environments with minimal maintenance required
Related Products
SMART CUT® NP-1A
SMART CUT® NP-2A Automatic Metallographic Grinder & Polisher
SMART CUT® AP Automatic Grinder/Polisher with Single Wheel
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UKAM Industrial Superhard Tools is a U.S. High Technology, Specialty Diamond Tool & Equipment manufacturer. We specialize in producing ultra thin, high precision cutting blades, precision cutting machines diamond drills, diamond micro tools, standard & custom advanced industrial diamond tools and consumables.
- 25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
-
Phone : (661) 257-2288
FAX : (661) 257 -3833 - lel@ukam.com
- 25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
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Phone : (661) 257-2288
FAX : (661) 257 -3833 - lel@ukam.com
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