SMART CUT® RP 4000YX / 5000YX

Precision Grinding & Polishing Machine

SMART CUT® RP 4000YX / 5000YX  Precision Grinding & Polishing Machine is a next-generation semi-automatic system engineered for high-precision sample preparation in applications involving semiconductor wafers, advanced ceramics, metallographic specimens, and other hard or brittle materials requiring stringent surface finish tolerances and material removal accuracy.

This system offers vacuum adsorption to securely hold samples in place during the grinding and polishing process. The 4000YX model is specifically designed to accommodate samples up to 4 inches in diameter, while the 5000YX model supports wafers up to 6 inches.

Advantages:

High-Precision Performance

Delivers sub-micron level grinding and polishing accuracy, ideal for advanced materials and critical applications.

Vacuum-Based Sample Holding

Ensures stable and secure sample fixation without mechanical clamping, minimizing deformation or slippage.

Supports Multiple Wafer Sizes

AUTOPOL100YX accommodates up to 4″ wafers; AUTOPOL200YX supports up to 6″ wafers, offering flexibility across sample sizes.

Adjustable Sample Tilt

Sample tilt angle adjustable from 0° to 10°, enhancing contact uniformity and improving surface finish consistency.

Continuously Adjustable Loading Force

Gravity-based pressure system allows continuous adjustment of sample force from 0 to 4 kg for optimal polishing conditions.Lorem ipsum dolor sit amet, consectetur adipiscing elit. Ut elit tellus, luctus nec ullamcorper mattis, pulvinar dapibus leo.

Semi-Automatic Oscillating Motion

Swinging sample arm simulates manual motion to produce uniform results while reducing operator fatigue.

Adjustable Swing Amplitude and Speed

Swing amplitude customizable from 0° to 15°, with uniformly controlled swing speed for repeatable polishing motion.

Independent High-Torque Motor (1KW)

Maintains consistent torque across all RPMs, ensuring reliable performance even under heavy loading conditions.

Wide Speed Range (5 – 100 RPM)

Accommodates both rough grinding and final polishing through variable disc speeds, enabling a full range of operations.

Touchscreen Control Interface

User-friendly full-color touchscreen simplifies parameter input, control, and monitoring for efficient operation.

Process Memory and Automation

Stores up to 64 user-defined programs including speed, time, and direction—ensuring repeatability and process optimization.

Four-Channel Abrasive Dispenser

Integrated droplet system supports four different abrasive fluids, each with individually controlled flow rates (1–100 mL/min).

Compact Footprint with Low Operating Noise

Ideal for laboratory environments requiring quiet, compact, and efficient equipment.

Multi-Application Versatility

Suitable for semiconductor, petrographic, metallographic, ceramic, optical, and materials science sample preparation.

Robust Construction and Reliable Operation

Built for continuous use in research, quality control, and production environments with minimal maintenance required

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