SMART CUT® Diamond Electroplated (NICKEL BOND) Hole Saws / Core Drills with Pilot

For heavy stock removal with right angle grinder

SMART CUT® Diamond Electroplated Hole Saws and Core Drills with optional Pilots. These diamond hole saws feature diamond electroplating with a nickel bond and are available with windows and slots for enhanced performance.

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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1/2" (12.7mm)
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
9/16"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
5/8"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
7/8"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-1/16"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-1/8"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-1/8"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-1/8"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-3/16"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-3/16"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-1/4"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-3/4"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
1-7/8"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
2"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
2-1/4"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
2-1/2"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
3"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
3-1/4"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
3-1/2"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
4"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
4-1/4"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
4-1/2"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
5"
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SMART CUT® DIAMOND ELECTROPLATED (NICKEL BOND) HOLE SAWS / CORE DRILLS WITH PILOT
6”
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Customization Options:
  • Continuous rim or slotted designs
  • Customizable pilot diameters, with or without diamond coating
  • Fully customizable sizes, drilling depths, rim types, shank diameters and lengths, pilot sizes, diamond depths, grit sizes, and keyhole configurations
  • Precision tolerances available for specialized tasks

We also offer customization using standard hole saw brands like STARRETT, NICKLESON, BLACK & DECKER, MILLER FALLS, MILWAUKEE, and DO-ALL. For these, the teeth are replaced with a diamond-plated cutting surface.

Recommended RPMs:
  • 1/2″ to 1-1/4″: 2100 RPM
  • 1-1/4″ to 2″: 1500 to 1700 RPM
  • 2″ to 3″: 1100 RPM
  • 4-1/2″: 600 RPM
  • Larger than 4-1/2″: 250 to 400 RPM (Note: Lower speeds are recommended for harder materials.)
Benefits:
  • Faster & Freer Drilling
  • Minimum Heat Generation
  • Reduce Fiber Pull Out
  • Minimize Material Delamination
  • Minimum Amount of Material Stress
  • Preserve Material Micro Structure
  • Minimum Dust Generation
  • More Accurate Holes

Example of

Custom Diamond Tool for Composites

About Nickel Bond (Electroplated) Tools

Electroplated (nickel bond) diamond products usually have a single layer of diamonds, held by a tough durable nickel alloy. Nickel is frequently used as a base for plating diamond. Because of its excellent strength, toughness and flexibility during the plating process. Electroplated diamond products are able to retain their original shape and dimensions thought their working life. Unlike sintered (meal bond) or resin bond diamond products, where diamond particles are buried in bond and held together by metal or resin binder deep inside.

Electroplating allows diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT ® Bond Works?

Step 1
COUNTER SINKS Step 1

Sharpest And Finest Quality Diamonds

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT®  Bond Diamond Bond makes sure every diamond is in the right place. and at the right time, working where you need it most.

Step 2
COUNTER SINKS Step 2

Diamonds or CBN Crystals

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT®  remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 3
COUNTER SINKS Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast
cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

Faster Cutting Action

Diamond & CBN tools made utilizing SMART CUT® technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

SMART CUT® 1A1 DIAMOND & CBN WHEELS
Longer Life

In most cases tools manufactured utilizing SMART CUT® technology, will outlast other conventional material (sintered), resin, and nickel bonded diamond & CBN tools. SMART CUT® diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

More Consistent Performance

SMART CUT Sintered (Metal Bond) Tools have diamonds crystals oriented and evenly positioned inside bond matrix. Unlike Many Other Tool Types, they wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing even on the hardest to cut materials

Minimize Chipping & Improve Surface Finish

SMART CUT® Sintered (Metal Bond) Tools have diamonds oriented and evenly distributed in a bond matrix. Providing faster, freer cutting action with minimum heat generation. This translates in improved surface finish and minimum chipping.

Best Performance & Value on the Market​

SMART CUT® Sintered (Metal Bond) Diamond Tools are the best investment you can make! Although they may cost more than some Sintered (Metal Bond) Tools. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

High Quality & Consistency

Electroplated (Nickel Bond) Tools

Our standard stock program and custom electroplated diamond tools are produced in a clean environment. Steel bodies are machined to very high precision tolerances from hardened steel on newest CNC machines. Only the highest quality raw materials are used in manufacturing process. Utilizing world class quality control, inspection, and measurement equipment. Highly Experienced Engineers and chemists constantly monitor and control all material input & output at all stages of manufacturing process. Insuring product consistency for use in demanding & sensitive applications

We have experience in working in fields challenging fields such: Nano Technology, MEMS, Materials Research, and etc. In last 25 years over 9 million plated tools/parts have been produced. Customers include some of the Leading Fortune 500 companies, Universities, Military, Space Flight Organizations, Laboratories, Advanced Material Fabricating Facilities to small machine shops.

Why Choose Us?

Optimize your application to ultimate level of efficiency

Diamond & CBN Wheel
Selection Variables

Concentration for Diamond & CBN blades

Diamond Concentration

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond & CBN Kerf Thickness

Blade Thickness

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning

For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. .

Grit Sizes for Diamond & CBN Blades

Diamond Particle/Grit size

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain. Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.

Bond Type

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Blade Outside Diameter

Blade Outside Diameter

typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Feed Rates

load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Diamond & CBN Blade Bond Hardness

Bond Hardness

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Diamond & CBN Blade RPM’s

Blade Speeds/RPM’s

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

Diamond & CBN Wheel
Selection Variables

Concentration for Diamond & CBN blades

Diamond Concentration

Diamond concentration plays a critical role in determining the life and cutting speed of diamond core drills. Higher concentration offers longer tool life and faster cutting speeds, while lower concentration is typically used for softer materials that require a smoother finish.

Diamond & CBN Kerf Thickness

Drilling Speed/RPMs

Diamond core drills generally operate at RPMs between 500 and 3,000, depending on the material being drilled. Softer materials allow for higher RPMs, while harder materials require slower speeds for improved cutting efficiency and to avoid damaging the tool or material. Always adjust RPM according to the specific characteristics of the material and drill size.

Grit Sizes for Diamond & CBN Blades

Diamond Particle/Grit size

The diamond grit size is crucial in determining the cutting speed, surface finish, and precision of diamond core drills. Finer grits provide a smoother surface finish, but may cut more slowly, while coarser grits offer faster cutting speeds but can leave a rougher surface. The choice of grit size depends on the material being drilled and the desired outcome.

Bond Type

The bond type used in diamond core drills influences the drill’s life, durability, and heat resistance. Common bond types for diamond core drills include: Sintered (Metal Bond): Provides a longer tool life and high resistance to wear and heat, making it ideal for drilling hard and abrasive materials. Electroplated: Offers a good combination of speed and precision, typically used for softer materials or applications where a smoother surface finish is needed. Braised Bond: Ideal for applications requiring higher strength, these bonds are used for tougher materials and applications where durability is key. PCD (Polycrystalline Diamond): Used for ultra-hard materials, PCD bond drills offer excellent wear resistance and are ideal for materials like ceramics and composite materials. <:>CVD (Chemical Vapor Deposition) Diamond: Offers exceptional cutting performance, often used in extremely hard materials like high-performance ceramics and advance.

Blade Outside Diameter

Kerf (Wall) Thickness

The kerf, or wall thickness, of diamond core drills is a key variable in determining the overall performance of the drill. Standard core drills typically feature a kerf thickness ranging from 0.5mm to 3.0mm, with thicker kerfs providing longer tool life and greater stability during drilling. Thinner kerfs allow for faster cutting but may wear out quicker and require more frequent maintenance. The selection of kerf thickness depends on the material being drilled and the precision required.

Feed Rates

The load/feed rate applied to diamond core drills significantly impacts their performance and lifespan. For tougher materials, feed rates typically range between 5-50 mm/min, while softer materials may allow for higher feed rates. Proper feed rate adjustment ensures optimal tool life and drilling speed, while preventing overheating or excessive wear.

Diamond & CBN Blade Bond Hardness

Core Drill Diameter

The diameter of the diamond core drill is directly related to the size of the hole you wish to create. Core drills typically range from small diameters (e.g., 3mm) up to large diameters (e.g., 200mm or more). Larger core drills offer greater drilling capacity, while smaller ones provide more precision for fine hole making.

Diamond & CBN Blade RPM’s

Drilling depth

The depth of a diamond drill bit, often referred to as drilling depth, working length, or drilling length, is the maximum depth to which the drill can penetrate the workpiece. Drilling depth in diamond core drills depends on the material, drill size, and equipment. Softer materials allow for deeper holes with faster cutting, while harder materials require slower speeds and lower feed rates to prevent overheating. Larger drill diameters may reduce depth due to more material removal per rotation, often requiring multiple passes. Drilling equipment, including motor power and cooling systems, also plays a key role; more powerful motors and efficient cooling allow for deeper drilling.

Bond Hardness

For diamond core drills, the bond hardness plays a crucial role in the performance and longevity of the drill. The bond matrix’s ability to retain diamonds directly impacts the drilling efficiency and the tool’s lifespan. As the hardness of the bond increases, the retention of diamonds improves, but the trade-off is typically a slower cutting speed. A harder bond matrix provides greater tool life but may lead to reduced cutting efficiency.

There are generally three categories for bond hardness in diamond core drills: Soft, Medium, and Hard. The bond’s hardness is selected based on the material being drilled. For example, harder materials such as ceramics or hard metals often require a softer bond to allow the diamonds to be released at a controlled rate, preventing excessive wear and improving cutting performance. Conversely, softer and more brittle materials like concrete or certain composites benefit from a harder bond, which maintains the diamond’s retention and extends the drill’s lifespan, though it may slow the cutting process.

Using the right bond hardness for the material you’re drilling is key to optimizing both cutting speed and tool life. A bond that is too soft will cause diamonds to be released too quickly, resulting in faster wear and a shorter drill life. On the other hand, a bond that is too hard may cause the drill to cut slower and require more frequent dressing to expose new diamonds.

Mounting Type

The mounting type of a diamond core drill refers to how the drill is secured to the drilling machine or equipment. The mounting type plays a significant role in stability, precision, and overall drilling performance. Here are the typical mounting types for diamond core drills:

Unmounted diamond core drills:

Unmounted diamond core drills are specialized tools designed for precision drilling without being pre-mounted to any specific holding mechanism such as a male, female, or straight shank. These drills comprise a steel tube paired with a diamond-embedded segment, offering flexibility in setup and application.

Shaft Mounting:

In this type, the diamond core drill is mounted directly onto a shaft or spindle of the drilling machine. The shaft typically has a locking mechanism (like a set screw or collar) to securely hold the drill in place. This mounting method ensures a stable connection and allows for precise drilling. Shaft mounting is commonly used in machines where the drill operates at high speeds and requires excellent stability.

Threaded Mounting:

Some diamond core drills feature a threaded arbor or core bit holder, allowing the drill to be screwed directly onto the machine’s spindle. This method is commonly found in portable core drilling systems or for specific applications like wet drilling, where easy removal and installation are essential.

Choosing the right mounting type for your diamond core drill depends on factors such as the size of the drill, the type of drilling machine, and the specific application requirements. Proper mounting ensures optimal performance, stability, and safety during the drilling process.

Tolerances on Outside or Inside Diameter

The tolerance range for the outside diameter of diamond core drills varies depending on several factors including the drill’s diameter, wall thickness, bond type, and the intended application. These tolerances are crucial as they determine the drill’s suitability for precision tasks and influence how the drill interacts with the material it cuts.

For small diamond core drills with diameters less than 10mm, the diameter tolerance typically ranges from ±0.02 to ±0.05 mm. This tight tolerance is necessary for applications that require high accuracy, such as in electronics or medical device manufacturing, where small, precise holes are crucial.

Medium-sized drills, ranging from 10mm to 50mm in diameter, usually have a tolerance of ±0.05 to ±0.15 mm. These are commonly used in mechanical applications and construction where slightly larger variances are acceptable.

Run Out

Runout is a critical specification for diamond drills as it directly impacts the quality of the holes drilled and the longevity of the tool itself. The term “runout” refers to the degree to which a tool or workpiece deviates from perfect rotation along its central axis. High runout can lead to uneven wear on the tool, compromised hole quality, and increased heat generation, which are particularly detrimental when drilling hard, brittle materials such as glass, ceramics, and certain stones where precision is critical.

Standard and Precision Diamond Drills – Standard diamond drills typically exhibit runout ranging from 0.0005 inches (0.013mm) to 0.002 inches (0.05mm), which is acceptable for general-purpose drilling where absolute precision is not necessary. However, “standard” runout may vary based on the drill’s manufacturer and specific applications. Precision diamond drills, manufactured to higher standards with stricter tolerances, usually have runout less than 0.0002 inches (0.005mm), with ultra-precision drills potentially having even tighter runout specifications.

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