SMART CUT®
Water Soluble Dicing Coolant / Lubricant

SMART CUT® Water Soluble Dicing Coolant added to deionized (DI) water reduces surface tension flowing from saws injection system and is carried directly of dicing blade.

This reduces material thermal stress, edge damage, and internal cracking, assuring long-term integrity of material being processed. Since SMART CUT® Dicing Coolant is a coolant and lubricant, both the dicing blade and  substrate / wafer / package benefit.

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SMART CUT® Dicing Fluid

Available in 4 Different Formulas to Fit Most Dicing Applications

XP-1 is a general-purpose dicing fluid within the SMART CUT® range, designed to reduce debris, improve tool life, and prevent corrosion, while ensuring smooth cutting and protecting sensitive materials from ESD.

XP-2 enhances lubrication for demanding applications, offering superior cutting speeds, tool longevity, and advanced cleaning capabilities for tough materials like SiC and sapphire.

XP-3 is ideal for high-pressure systems, offering consistent cooling performance without foam buildup.

XP-4 specifically protects electrostatic-sensitive components by eliminating ESD, reducing defects, and extending tool life during the dicing process.

Features

Water Soluble Dicing Coolant

Advantages

SMART CUT® XP-1: Standard Dicing Fluid

XP-1 is the standard water-soluble dicing coolant formulated to meet the needs of most dicing applications and backgrinding applications.  This specially-formulated chemical product combines detergent, coolant, lubricant, and corrosion inhibitor functions. It helps reduce debris during the dicing process, improves tool life, and ensures smooth cutting with minimal tool wear. The product acts as a detergent to reduce saw debris, simplifying or eliminating the need for post-process cleaning. Additionally, it helps reduce heat and stress on the die or package, while keeping blades free-cutting, improving cutting speed and tool life. The corrosion inhibitors prevent oxide formation and corrosion on exposed metal pads, improving bonding and connectivity. Furthermore, XP-1 adds conductivity to DI water, eliminating the risk of electrostatic discharge (ESD) during the dicing process, making it ideal for sensitive materials. With its low Chemical Oxygen Demand (COD), XP-1 is an environmentally friendly option that contributes to sustainability and safer disposal.

Application:

XP-1 is suitable for general-purpose dicing of materials such as semiconductors, ceramics, glass, and precision tasks. It is ideal for routine use in high-precision applications where cooling, lubrication, and corrosion prevention are critical.

Features:

SMART CUT® XP-2: High Lubricity Dicing Fluid

XP-2 is a next-generation version designed for more demanding applications that require enhanced lubricity and improved cleaning capabilities. It provides superior lubrication, reduces friction, and maintains cutting blade performance even under high load or high-speed conditions. XP-2 also contains an effective corrosion inhibitor to minimize oxide formation. The high lubricity of XP-2 reduces friction and heat during high-speed or high-load cutting, allowing for faster cutting speeds and extended tool life. The enhanced surfactants in the product improve the removal of cutting debris, especially in challenging materials like bonded wafers, sapphire, and SiC. Effective corrosion inhibition prevents oxide growth and protects metal pads, improving device bonding and connectivity. XP-2 also helps eliminate ESD effects by adding conductivity to DI water, ensuring the protection of sensitive components during the cutting process. With a low COD value, XP-2 is an environmentally friendly choice, contributing to safer disposal.

Application:

XP-2 is perfect for high-speed dicing and back-grinding of tough materials like advanced ceramics and SiC. It is also ideal for dicing operations that require increased lubrication for smoother cuts and reduced defects, as well as applications that demand advanced cleaning capabilities and improved lubrication.

Features:

SMART CUT® XP-3: Low-Foaming Dicing Fluid

XP-3 is formulated to be low-foaming, making it ideal for use in high-pressure dicing systems or systems that utilize atomizing nozzles. It reduces foam buildup, ensuring consistent flow, cooling performance, and minimizing contamination during the cutting process. The low foaming characteristics of XP-3 prevent foam formation in high-pressure or atomizing nozzle systems, ensuring optimal coolant performance without disrupting the cutting process. The surfactants in XP-3 improve the suspension of debris, reducing the risk of re-adherence to the material surface. In addition, XP-3 includes corrosion inhibitors that protect metal surfaces, preventing oxide buildup and reducing bonding issues. It also adds conductivity to the DI water supply to prevent electrostatic buildup, protecting sensitive devices during dicing. The product is biodegradable with a low COD value, making it an eco-friendly choice compared to other lubricants.

Application:

XP-3 is ideal for back-grinding and high-pressure dicing systems that use atomizing or high-pressure nozzles. It is also perfect for low-foam applications in precision dicing of microelectronics and MEMS devices and works well in cleanroom environments or sensitive processes where foam buildup could impact precision.

Features:

SMART CUT® XP-4: Electrostatic Discharge Sensitive Dicing Fluid

XP-4 is designed specifically to eliminate electrostatic discharge (ESD) effects during the dicing process, ensuring that sensitive materials such as semiconductors and MEMS devices are protected from static damage. This product combines the benefits of cooling, lubrication, corrosion inhibition, and ESD protection in one formula. XP-4 prevents electrostatic discharge, ensuring no shift in threshold voltage after dicing, thus protecting sensitive electronic components. It helps reduce friction and heat during cutting while keeping the blade free-cutting, extending tool life and increasing cutting efficiency. Additionally, XP-4 prevents oxide formation and corrosion on metal pads, which is crucial for maintaining the integrity of connections and device performance. The product’s low COD value ensures it is biodegradable and safer for disposal. XP-4 also reduces defects like chipping, cracking, and de-lamination by maintaining an organic micro-layer cushion between the blade, matrix, and material.

Application:

XP-4 is ideal for dicing electrostatic-sensitive devices such as semiconductors and MEMS. It is used in applications where ESD could lead to irreversible damage, particularly in cleanroom and high-tech manufacturing settings. XP-4 is also suitable for dicing processes that require high lubrication and effective cooling.

Features:

Dicing Fluid Comparison Table

Aspect

XP-1

XP-2

XP-3

XP-4

Description

Standard dicing fluid for most applications.

High lubricity fluid designed for increased lubrication.

Low-foaming fluid for applications where foaming is problematic.

Designed for applications sensitive to electrostatic discharge.

Applications

General dicing of semiconductors, ceramics, glass, and precision tasks.

Heavy load/high-speed cutting, precision slicing of tough materials like advanced ceramics, and for operations requiring enhanced lubrication.

Ideal for high-pressure dicing or areas where foam buildup may disrupt the cutting process.

Used in cleanroom environments and sensitive operations.

Used in applications where electrostatic discharge (ESD) can harm components like semiconductors, MEMS, and microelectronics.

Best For

General-purpose, routine dicing applications.

High-speed, high-load, and high-precision cutting.

Foam-sensitive, high-pressure dicing operations.

Electrostatic-sensitive materials like semiconductors, microelectronics, and MEMS.

Lubricity

Standard

High

Moderate

Standard

Foaming

Low

Low

Very Low

Low

Electrostatic Sensitivity

No

No

No

Yes

Recommended Materials

Common materials like ceramics, glass, semiconductors, and thin metals.

Tougher materials such as advanced ceramics, composites, and metals.

Thin-film electronics, microelectronics, and delicate substrates.

ESD-sensitive materials like semiconductors, ICs, MEMS, and sensitive electronics.

Cutting Speed

Moderate

High

Moderate

Moderate

Blade Wear

Moderate

Low

Moderate

Moderate

Cooling Efficiency

Good

Excellent

Good

Good

Application Example

Before
QFN Package Before use of SMART CUT® Coolant
After
QFN Package After use of SMART CUT® Coolant
Before
QFN Package Before use of SMART CUT® Coolant
After
QFN Package After use of SMART CUT® Coolant

Comparing Rates of Oxide Formation

Comparing Rates of Oxide Formation

Dicing Time / Exposure to Saw Water (minutes)

Oxide Thickness (in Å): SMART CUT Dicing Coolant @ 500:1

Oxide Thickness (in Å): Competitor Dicing Coolant @ 500:1

Oxide Thickness (in Å): DI Water Only

15 minutes

35.87

138.83

160.53

45 minutes

39.87

198.99

245.63

90 minutes

49.88

273.55

382.66

SMART CUT® Dicing Coolant helps Semiconductor Package & Wafer Manufacturers

Close-up view of a high-quality wheel diamond tool designed for precise cutting, grinding, and polishing in various industrial applications.

Reduces Surface Tension - by 25-40 dynes/cm2. SMART CUT KOOL allows more water into the material kerf / pores, dissipating heat generated by friction. 

Bonds Water Molecules - into the kerf and to the diamond dicing blade, allowing better swarf dispersion and lubrication.

Prevent Swarf Accumulation - on the diamond dicing blade and in Back and frontside edges, minimizing chipping and internal cracking.

Extend Blade Life - by up to 30%. The lubricated dicing blade runs cooler, reducing fatigue and blade wear.

Improve Material Yield and Reliability - from the reduced amount of chipping, cracking and consequent edge damage.

Eliminate Additional Material Processing Depending on the application and your objectives, SMART CUT Dicing Coolant frequently eliminates and minimizes secondary and subsequent material processing.

Improved Die Tolerances Many of today's demanding package singulation and wafering dicing operations require very high precision tolerance. SMART CUT™ Dicing Coolant promotes attainment of close tolerances by removing heat generated at the point of contact between the dicing blade and substrate/wafer. Heat can cause deformations in both the blade and material that results in the loss of tolerance. When the generation of heat and its subsequent removal by a coolant is momentarily interrupted any coolant product will adversely affect the performance of a tool and therefore ruin a tolerance specification.

TOP 10 REASONS Why SMART CUT® Coolant is SUPERIOR

Dicing Blade Operations
  • Operator SensitivitySMART CUT KOOL is formulated with operator friendly additives that will not irritate skin (dermatitis), nasal passages, or eyes.
  • Bio-resistanceSMART CUT KOOL is formulated with biocides and fungicides to biologically control the growth of bacteria, fungi, and mold in the coolant system. The bio-resistance will determine its suitability for recycling in large central systems.
  • Corrosion ProtectionSMART CUT KOOL is formulated with corrosion inhibitors, which provide protection to machinery and the substrate. The protection needed will be determined by the customers requirements. With proper concentration, no corrosion should occur on the machinery.
  • Hard Water StabilitySMART CUT KOOL should be stable in all water conditions. Hard water ions react with coolant additives and reduce the effectiveness of the coolant solution.
  • MixabilityConcentrate SMART CUT KOOL should mix easily or .bloom. into the water. Any difficulty in mixing will not be tolerated by the customer.
  • FoamAll water based coolants can potentially foam. SMART CUT KOOL is formulated with defoamers to prevent foaming under most conditions. The proper selection of coolant concentration will help alleviate potential problems.
  • ResidueSMART CUT KOOL will not leave a .hard-to-remove. residue on the surface of the machine or substrates. As the water in the coolant. evaporates organic residue will be left on the machines. This residue should not be sticky and should be easily re-dissolved in water.
  • Oxidative StabilityHigh temperatures and pressures will cause changes in the composition of the coolant, such as fragmentation or polymerization of the additives in the coolant formulation. This can decrease the performance of the coolant and create difficult to remove deposits.
  • Emulsion StabilityConcentrate SMART CUT KOOL mixes easily with water and should not separate or create an invert on the surface of the coolant mixture. Customers currently using soluble oils may be experiencing particular difficulties with this problem.
  • Tramp Oil RejectionSMART CUT KOOL should reject the tramp oils and way lubricants, which may contaminate the sump. Other coolants which do not reject tramp oils are prone to attack by bacteria and fungal organisms.

Case Study: Dicing Silicon Wafers

Material: Silicon wafer
Blade: Nickel bond hubless blade
Blade Specifications: 3” (100 mm) diameter × 0.008” (0.203 mm) thickness × 40 mm arbor, 320 grit diamond
Spindle RPM: 30,000 RPM
Feed Speed: 40 mm/s

Objective:

Evaluate the impact of SMART CUT® Dicing Coolant / Lubricant on blade longevity and cutting efficiency compared to using only deionized (DI) water.

Results:
  • Blade life increased by 48% when using SMART CUT Dicing Coolant / Lubricant at a 0.20% concentration compared to DI water alone.
  • More consistent cutting performance maintained over extended operation, reducing blade wear rate.
  • Lower diamond matrix wear resulted in improved cutting consistency over the entire blade lifespan.
Conclusion:

Using SMART CUT® Dicing Coolant / Lubricant significantly extended blade longevity, reduced tool wear, and improved cost efficiency in high-volume silicon wafer dicing applications.

blade life comparison
Chipping Comaprison

Thermal Stress and Micro-Cracking Reduction in Ceramic Substrate Dicing

Material: Alumina (Al₂O₃) ceramic substrate
Blade: Metal bond dicing blade
Blade Specifications: 4.6” (118 mm) diameter × 0.020” (0.50 mm) thickness × 3.5” (88.9 mm) arbor, 270 grit diamond
Spindle RPM: 6,000 - 8,000 RPM
Feed Speed: 8 - 12 mm/s

Objective:

Determine whether SMART CUT® Dicing Coolant / Lubricant reduces thermal stress and micro-cracking during ceramic dicing.

Results:
  • Micro-cracking reduced by 38%, improving mechanical strength and final product integrity.
  • Lower thermal stress, preventing structural damage in the ceramic and maintaining material properties.
  • Blade wear reduced, ensuring longer blade life and consistent cutting performance over extended production runs.
Conclusion:

The use of SMART CUT® Dicing Coolant / Lubricant significantly improved cut quality, reduced stress fractures, and enhanced process efficiency for brittle ceramic materials, making it a valuable solution for precision dicing operations.

Blade Wear rate Comparison
Dicing Throughout Comparison
Thermal Stress Comparison
Micro Cracking Depth Comparison

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