SMART CUT® Water Soluble Dicing Coolant

• Improve Cutting Speed, Yield, & Efficiency
• Extend Blade Life
• Improve Material Surface Finish
• Reduce Chipping, Thermal Stress
• Reduce Material Micro Cracking & Edge Damage
• Preserve Material True Micro Structure

• No Foam
• Non Staining
• Compatible with all filtration systems
• Non Corrosive
• Safe to handle and dispose
• Friendly to operator and environment

• 1 (one) Quart Bottles
• 1 (one) Gallon Bottles
• 5 (five) Gallon Pails
• 55 Gallon Drums

Stream of SMART CUT™ Dicing Coolant added to deionized (DI) water reduces material thermal stress, edge damage, and internal cracking, assuring long-term integrity of  material being cut. Since SMART CUT Dicing Coolant is both coolant and lubricant, both the dicing blade and material benefit. 

As a coolant, SMART CUT  KOOL reduces heat caused by friction. As a lubricant, SMART CUT KOOL lowers friction and surface tension, which increases swarf dispersion. 

Contains no nitrides, phosphates, chromates, phenols, heavy metal salts, Petroleum oils, chlorine or phosphorus. Do not add inorganic nitrates, nitrites, or organic-nitro compounds.

Advanced in technology require smaller devices. As the size of devices decrease, the size of wafers overall have increased. This creates additional challenges for package and wafer manufacturers to increase production output and speed, while reducing product cost. SMART CUT water soluble coolant has been specifically formulated for this purpose.

In dicing, the wafer is mounted in a frame and placed under the saw.  The blades rotates at 30K–60K RPM to cut a slot through the space between the die (known as a street) while using a dicing fluid/water mixture.  Once all the die are singulated, the frame is rinsed or cleaned and the individual die are removed for packaging.  

As wafers become larger and thicker, the time it takes to dice them into individual die increases.  Subsequently, extended exposure to coolant during a dicing process increases the risk of corrosion and the formation of oxide, making bonding more difficult and device failure more prevalent. Thicker wafers and narrower streets can lead to chipping and cracking especially when using harder, thinner blades, resulting in device failure and decreased yield. Kerf material generated during dicing can stick to the bond pads making for difficult packaging/cleaning downstream. The use of a specialized dicing fluid, at economical dilution ratios of 100 parts water to one (100:1), will inhibit corrosion, keep the die clean, extend wheel life and decrease chipping and cracking for a dramatic increase in yield. Using SMART CUT™ water soluble dicing fluid also eliminates the need for a CO2 injector and protects against electrostatic discharge (ESD).