Diamond Smart Cut

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SMART CUT

Diamond, Sintered (Metal Bond) Cut Off Blades for Petrographic Samples

Specifically Designed for Petrographic Samples & Thin Sections

SMART CUT Diamond Sintered Metal Bond Cut Off Blades are meticulously engineered for petrographic sample preparation. These blades offer unmatched accuracy, minimal material deformation, precision and durability, making them an essential tool for geologists, petrologists, and materials scientists.

SMART CUT petrographic blades feature a high concentration of premium-quality diamonds impregnated in side of soft bond bronze based matrix. This design ensures a smooth, swift cutting action, prolonged blade life, and minimal amount of material deformation even under rigorous laboratory conditions.

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Perfect for Ultra hard to Soft Rock & Mineral Samples

Whether slicing through hard minerals, rocks, shale, or concrete, these blades deliver clean, precise cuts, free of chipping, cracking. Their versatility makes them ideal for a wide range of petrographic materials, ensuring minimal sample deformation and maximum structural integrity.

Optimal Cutting Speed, Surface Finish & Minimum Material Deformation

The fine diamond grit size is carefully selected to balance cutting speed with cut quality. This results in reduced sample preparation time without sacrificing the quality of the cut, essential for efficient laboratory workflow. Save time on secondary operations such as polishing.

Compatible all popular petrographic and sample preparation thin section saws & machines

These SMART CUT Blades are designed to fit a variety of petrographic cut-off machines such as BUELER, STRUERS, LECO and many others. Their standard dimensions allow for easy integration into existing laboratory setups, ensuring seamless operation.

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Metal Bond Cut Off Blades for Petrographic Samples
3063218
6" (150mm)
.032” (0.80mm)
½” (12.7mm)
* we can change the arbor to anything you want same day
$174.00
2 pcs -
$230
3 pcs -
$225
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083217
8" (200mm)
.043” (1.14mm)
½” (12.7mm)
* we can change the arbor to anything you want same day
$214.00
2 pcs -
$209
3 pcs -
$204
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083218
8" (200mm)
.054” (1.37mm)
½” (12.7mm)
* we can change the arbor to anything you want same day
$214.00
2 pcs -
$209
3 pcs -
$204
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083240
10” (254mm)
.060” (1.52mm)
1.25”
* we can change the arbor to anything you want same day
$214.00
2 pcs -
$209
3 pcs -
$204
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083242
10” (254mm)
.060” (1.52mm)
32mm
* we can change the arbor to anything you want same day
$214.00
2 pcs -
$209
3 pcs -
$204
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083248
12" (300mm)
.075” (1.9mm)
1.25” 32mm
* we can change the arbor to anything you want same day
$275.00
2 pcs -
$280
3 pcs -
$275
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083250
12" (300mm)
.075” (1.9mm)
1.25” 32mm
* we can change the arbor to anything you want same day
$275.00
2 pcs -
$280
3 pcs -
$275
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083244
12” (300mm)
.051” (1.29mm)
1.25”
* we can change the arbor to anything you want same day
$285.00
2 pcs -
$270
3 pcs -
$265
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083246
12” (300mm)
.051” (1.29mm)
32mm
* we can change the arbor to anything you want same day
$285.00
2 pcs -
$270
3 pcs -
$265
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083254
14” (350mm)
.051” (1.29mm)
1.25”
* we can change the arbor to anything you want same day
$295.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083256
14” (350mm)
.085” (2.15mm)
32mm
* we can change the arbor to anything you want same day
$295.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083252
14” (350mm)
.051” (1.29mm)
1.25” 32mm
* we can change the arbor to anything you want same day
$305.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083262
16” (400mm)
.085” (2.15mm)
1.25” 32mm
* we can change the arbor to anything you want same day
$325.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083264
16” (400mm)
.085” (2.15mm)
32mm
* we can change the arbor to anything you want same day
$325.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083258
16” 400mm)
.051” (1.29mm)
1.25”
* we can change the arbor to anything you want same day
$345.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1
Metal Bond Cut Off Blades for Petrographic Samples
3083260
16” 400mm)
.051” (1.29mm)
32mm
* we can change the arbor to anything you want same day
$345.00
2 pcs -
$300
3 pcs -
$295
Max:
Min: 1
Step: 1

Benefits:

About Sintered (Metal Bond)

Sintered (metal bonded) diamond tools have multiple layers of diamonds impregnated inside the metal matrix. Diamonds are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. Metal bonded diamond tools are “impregnated” with diamonds. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any materials such as sapphire, advanced ceramics, optics, glass, granite, tile and etc. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting. Sintered (metal bonded) diamond tools are recommended for machining hard materials from 45 to 75 on rockwell scale (5 to 9.5 on mohe’s scale of hardness).

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT ® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

No

Glazing

Diamond & CBN tools with SMART CUT  technology require minimum dressing, the bond renews itself.

Faster

Cutting Action

SMART CUT® blades made utilizing SMART CUT® technology are much more aggressive then conventionally blades. They can cut faster, while still leaving behind a smooth surface finish.

Longer

Life

SMART CUT® blades will outlast almost all other blades on the market today. The longer life can be attributed not only the higher diamond depth, but to higher diamond quality used. Advanced diamond distribution an orientation techniques, and proprietary bond chemistry. Combined with our competitive prices you re sure to obtain the best value and return on investment possible.

More

Consistent Performance

SMART CUT® Sintered (Metal Bond) Diamond Blades have hundreds of diamond layers impregnated inside the metal matrix. Unlike Many Other Blade Types, they wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing even on the hardest to cut materials.

Best

Performance & Value on the Market

SMART CUT®  Sintered (metal bond) blades are the best investment you can make! Although they may cost more than other sintered (metal bond), blades. Designed for users that understand and appreciate quality. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using

The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Diamond Wafering Blade
Selection Variables

Diamond Concentration : 

Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.
Low Diamond Concentration - Typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.
High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond Particle/Grit size -  

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain.  Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended. 

Blade Thickness :

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness  typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning. For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.

Blade Outside Diameter :

Typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades.

Bond Hardness :

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness. Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Bond Type :

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Feed Rates :

Load/Feed Rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Blade Speeds/RPM’s :

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

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