SMART CUT® HD-2B

Synthetic Low IFT Coolant/Lubricant For Diamond Wire Sawing & ID Cropping Blades, Diamond Band Saws, Edge Grinding of Semiconductor materials

SMART CUT® is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots using ID, band, and wire saws. SMART CUT® HD-2B can also be used as a non-re-circulating edge grinding coolant or lubricant for silicon wafers and ingots.

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Range of Applications SMART CUT® HD-2B is Used:

  • icons8-ok-208 Top & Tail Cut
  • icons8-ok-208 Squaring
  • icons8-ok-208 Cropping
  • icons8-ok-208 Wafering
  • icons8-ok-208 Face Grinding
  • icons8-ok-208 Chamfering
  • icons8-ok-208 Surface Grinding
  • icons8-ok-208 Edge Grinding
  • icons8-ok-208 Back Grinding
  • icons8-ok-208 Double Disc Grinding
  • icons8-ok-208 Ingot Slicing
  • icons8-ok-208 ID Sawing

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Advantage

  • icons8-ok-208 Extended blade and wire life, reducing the need for frequent replacements and improving efficiency.
  • icons8-ok-208 Increased production due to faster and more consistent cutting, leading to higher throughput and reduced downtime.
  • icons8-ok-208 Minimal sub-surface damage, preserving the material’s integrity and quality.
  • icons8-ok-208 Reduced bow and warp, ensuring precise dimensions and shapes.
  • icons8-ok-208 Minimized blade and wire deflection, resulting in more accurate cuts and smoother surface finishes.
  • icons8-ok-208 Elimination of exit chipping and prevention of substrate tear, enhancing final product quality.
  • icons8-ok-208 Cleaner machines and working conditions, as the coolant is non-staining, non-corrosive, and odor-free.
  • icons8-ok-208 Extended Blade and Wire Life: Reduces the frequency of tool replacements, improving cost-efficiency and minimizing downtime in the production process.
  • icons8-ok-208 Increased Cutting Speed: Enables faster cutting due to enhanced heat dissipation and a clean diamond interface, leading to higher productivity and reduced cycle times.
  • icons8-ok-208 Superior Surface Finish: Delivers smooth, high-quality cuts with minimal sub-surface damage, ensuring optimal material quality and reduced rework.
  • icons8-ok-208 Reduced Deflection: Minimizes blade and wire deflection, leading to more accurate cuts, consistent dimensional control, and improved surface flatness.
  • icons8-ok-208 Elimination of Chipping and Tear: Prevents exit chipping and substrate tear, ensuring the integrity of the material is maintained during cutting processes.
  • icons8-ok-208 Cleaner Machines and Work Environment: Non-staining, non-corrosive, and odor-free, making it easier to maintain equipment and creating safer, more pleasant working conditions.
  • icons8-ok-208 Higher Production Yield: Supports higher cutting speeds and reduced tool wear, contributing to increased throughput and efficient production.
  • icons8-ok-208 Minimized Bow and Warp: Reduces distortion in materials, ensuring precise cuts and high-quality finished products.
  • icons8-ok-208 Cost-Effective: By improving tool life and reducing maintenance requirements, it lowers overall operating costs and enhances profitability.
  • icons8-ok-208 Environmentally Friendly: Free of harmful chemicals, non-toxic, and biodegradable, contributing to a safer and more sustainable workplace.

Features

  • icons8-ok-208 Specifically formulated for cutting semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals, using fixed abrasive wire.
  • icons8-ok-208 Designed for use in "once-through" systems with diamond blades or wires.
  • icons8-ok-208 Exceptional heat transfer capabilities to quickly cool diamond blades or wires, extending tool life.
  • icons8-ok-208 Superior detergency properties that keep the diamond interface clean, ensuring free cutting and increased cutting speed.
  • icons8-ok-208 Enables consistent and sustainable cutting at high speeds typical of diamond wire cropping and squaring saws.
  • icons8-ok-208 Can be used as a non-re-circulating coolant for edge grinding silicon ingots and wafers.
  • icons8-ok-208 Non-staining, non-corrosive, and odor-free for cleaner machines and improved working conditions.
  • icons8-ok-208 Optimized for use in diamond abrasive cropping, squaring, and wafering of silicon ingots with ID, band, and wire saws.
  • icons8-ok-208 Provides reduced warp and total thickness variation (TTV) for superior material quality and surface finish.
  • icons8-ok-208 Ideal for use in high-performance environments where extended tool life and reduced maintenance are essential.
  • icons8-ok-208 Supports high cutting speeds, allowing for increased productivity in semiconductor material processing.
  • icons8-ok-208 Offers a sustainable cutting solution that helps maintain a clean diamond interface for consistent performance.
  • icons8-ok-208 Compatible with a wide range of semiconductor materials, ensuring versatility in different applications.
  • icons8-ok-208 Enhances the overall reliability of cutting systems by reducing the risk of blade or wire deflection and improving cut accuracy.
  • icons8-ok-208 Helps maintain operational efficiency with its easy-to-use, once-through formulation, minimizing machine downtime and coolant management efforts.
  • icons8-ok-208 Specifically designed to prevent excessive heat buildup, maintaining optimal cutting conditions and reducing the risk of thermal damage to materials.
  • icons8-ok-208 Provides excellent lubrication properties, ensuring smooth cutting and reducing friction between the diamond blade/wire and the material.
  • icons8-ok-208 Increases cutting efficiency by improving the flushing of debris from the cutting area, preventing clogging and maintaining consistent performance.
  • icons8-ok-208 Reduces the frequency of tool dressing and maintenance, helping to lower overall operational costs.
  • icons8-ok-208 Optimizes the performance of high-speed cutting operations, contributing to faster cycle times and improved throughput.
  • icons8-ok-208 Excellent for use in precision applications where high surface quality, minimal defects, and tight tolerances are required.
  • icons8-ok-208 Formulated to provide effective cooling in high-load cutting processes, enhancing both the diamond tool and material lifespan.
  • icons8-ok-208 Reduces environmental impact by being non-toxic, biodegradable, and free of harmful chemicals, promoting safer working conditions.
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Green & Environmental Friedly Coolant

NOTE: contains no nitrides, phosphates, chromates, phenols, heavy metal salts, Petroleum oils, chlorine or phosphorus. Do not add inorganic nitrates, nitrites, or organic-nitro compounds.

How it Works

SMART CUT® HD-2B Coolant enhances cutting performance by providing exceptional cooling and lubrication. The coolant's molecules interact with the cutting area, efficiently absorbing heat to prevent overheating. While SMART CUT® HD-2B is not specifically designed to be mixed with water, its advanced formula works effectively in "once-through" systems, where it helps maintain optimal cutting conditions by reducing friction. This results in improved tool life, superior material quality, and smoother cuts. By dissipating heat effectively, SMART CUT® HD-2B minimizes tool wear, improves cut quality, and enables faster, more efficient cutting, all while ensuring a cleaner, more environmentally friendly process.

HD-2B Coolant

SMART CUT® HD-2B 2B acts as both a coolant and lubricant, effectively reducing heat generated by friction and minimizing surface tension. As a lubricant, it enhances the dispersion of material swarf, ensuring that swarf particles are effectively moved away from the diamond tool and cutting zone, preventing buildup within the kerf. The coolant's advanced formula works by bonding with the cutting area, helping to penetrate the kerf and flush out material debris, preventing chipping and internal cracking. Additionally, because SMART CUT® HD-2B keeps the cutting area clean and free from debris, it minimizes the need for secondary material processing and cleaning operations, enhancing overall efficiency and reducing maintenance requirements.

SMART CUT® Coolant vs Plain Water

SMART CUT® HD-2B Coolant enhances cutting performance by providing exceptional cooling and lubrication. The coolant's molecules interact with the cutting area, efficiently absorbing heat to prevent overheating. While SMART CUT® HD-2B is not specifically designed to be mixed with water, its advanced formula works effectively in "once-through" systems, where it helps maintain optimal cutting conditions by reducing friction. This results in improved tool life, superior material quality, and smoother cuts. By dissipating heat effectively, SMART CUT® HD-2B minimizes tool wear, improves cut quality, and enables faster, more efficient cutting, all while ensuring a cleaner, more environmentally friendly process.

SMART CUT® HD-2B 2B acts as both a coolant and lubricant, effectively reducing heat generated by friction and minimizing surface tension.

Planwater

As a lubricant, it enhances the dispersion of material swarf, ensuring that swarf particles are effectively moved away from the diamond tool and cutting zone, preventing buildup within the kerf. The coolant's advanced formula works by bonding with the cutting area, helping to penetrate the kerf and flush out material debris, preventing chipping and internal cracking. Additionally, because SMART CUT® HD-2B keeps the cutting area clean and free from debris, it minimizes the need for secondary material processing and cleaning operations, enhancing overall efficiency and reducing maintenance requirements.

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