Diamond Smart Cut

UKAM Industrial Superhard Tools

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SMART CUT® Double Row Diamond Cup Wheel

SMART CUT®Double Row Diamond Cup Wheel is designed to provide an excellent, economical, way to grind a variety of hard materials such as granite, marble, agate, jasper, concrete, stone and other materials. Use double row grinding wheels for finer finishing.

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SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6514078
4"(100mm)
5.5x8x32mm
8
7/8"
$105.00$120.00
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6514058
4"(100mm)
5.5x8x32mm
8
5/8-11"
$105.00$120.00
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6514578
4.5"(115mm)
5.5x8x32mm
9
7/8"
$116.00$135.00
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6514558
4.5"(115mm)
5.5x8x32mm
9
5/8-11"
$116.00$135.00
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6515078
5"(125mm)
5.5x8x32mm
10
7/8"
$132.00$155.00
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6515058
5"(125mm)
5.5x8x32mm
10
5/8-11"
$132.00$155.00
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6517078
7"(180mm)
5.5x8x32mm
12
7/8"
$178.81$199.75
Max:
Min: 1
Step: 1
SMART CUT® DOUBLE ROW DIAMOND CUP WHEEL
6517058
7"(180mm)
5.5x8x32mm
12
5/8-11"
$178.81$199.75
Max:
Min: 1
Step: 1

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

Sintered (Metal bonded) diamond blades are “impregnated” with diamonds. Diamonds sintered and multiple (hundreds) layers of diamonds impregnated inside the metal matrix. Electroplated and other types of diamond blades for lapidary application have only one layer of diamond that stays on the surface. Diamonds in a sintered (metal bond) diamond blade are furnaces sintered in a matrix made of iron, cobalt, nickel, bronze, copper, tungsten, alloys of these powders or other metals in various combinations. The compacted materials are then hot pressed or sintered to full density. Heating rate, applied pressure, sintering temperature and holding time, are all controlled according to the matrix composition. This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any materials such as sapphire, agate, emerald, ruby, opal, petrified wood, glass, and etc.

Better Cut Quality

& Less Material Deformation

Diamond & CBN tools with SMART CUT technology make any work much faster & easier, Thousands of sharp and high quality diamond or CBN particles oriented and evenly distributed on both matrix, allow most jobs to be completed by applying little or only moderate amount of pressure even on the most toughest and challenging materials. Freeing the user from constantly having to dress and renew the diamond layer.

No Glazing

Diamond & CBN tools with SMART CUT® technology require minimum dressing, the bond renews itself.

More Consistent Performance

Diamond & CBN Wheels are produced using only the highest quality raw materials are used in manufacturing process. Utilizing world class quality control, inspection, and measurement equipment. Highly Experienced Engineers constantly monitor and control all material input & output at all stages of manufacturing process. Insuring product consistency for use in demanding & sensitive applications SMART CUT® DIAMOND & CBN wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing.

Faster Cutting Action

Diamond & CBN tools made utilizing SMART CUT® technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

Longer Life

In most cases tools manufactured utilizing SMART CUT® technology, will outlast other conventional material (sintered), resin, and nickel bonded diamond & CBN tools. SMART CUT® diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

Best Performance & Value on the Market​

SMART CUT® Diamond & CBN Wheels are the best investment you can make! Although we may not always be the lowest cost solution provider. Our Diamond & CBN wheels can provide the best ROI. Designed for users that understand and appreciate quality. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Why Choose Us?

Optimize your application to ultimate level of efficiency

Diamond & CBN Wheel
Selection Variables

Diamond Concentration

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Blade Thickness

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning

For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. .

Diamond Particle/Grit size

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain. Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.

Bond Type

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Blade Outside Diameter

typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Feed Rates

load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Bond Hardness

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Blade Speeds/RPM’s

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

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