Diamond Smart Cut

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SMART CUT® Braised Diamond Grinding Discwith Depressed Center

For heavy stock removal with right angle grinder

SMART CUT® Braised Diamond Grinding Disc is a high-performance tool designed for efficient and heavy stock removal using a right angle grinder. This disc is specifically crafted to tackle demanding grinding tasks with ease, making it a versatile choice for professional and DIY projects alike.

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Item No
Diameter
Diamond Grit
Max RPM’s
Arbor Size
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6914041
4.0" (100mm)
50
15,300
5/8-11"
6914042
4.5" (115 mm)
24
13,600
5/8-11"
6914043
4.5" (115 mm)
50
13,600
5/8-11"
6914044
5" (125mm)
24
12,225
5/8-11"
6914045
5" (125mm)
50
12,225
5/8-11"
6914046
6" (150mm)
24
10,200
5/8-11"
6914047
6" (150mm)
50
10,200
5/8-11"
6914048
7" (180 mm)
24
8,600
5/8-11"
6914049
7" (180 mm)
50
8,600
5/8-11"
6914050
9" (225mm)
24
6,600
5/8-11"
6914041,6914042,6914043,6914044,6914045,6914046,6914047,6914048,6914049,6914050,
Materials
  • Marble
  • Fiberglass
  • Composites
  • Natural Stone
  • Graphite
  • Silicon
  • Ferrous Metal
  • Concrete
  • Construction Materials
  • Iron
  • Steel
  • Rebar
  • Alloy steels
  • Ductile materials
Additional Information
  • Flange with 5/8 -11 thread (female)
  • Or 7/8 Hole
Features
  • Solid Stainless Steel Backing: Provides strength and durability while maintaining a lightweight design, ensuring ease of use during prolonged grinding tasks.
  • Fully Exposed Diamond Surface: This feature allows for minimal effort in material removal, enhancing efficiency and reducing work time.
  • Dry Application Compatibility: Ideal for situations where wet grinding is not feasible, offering versatility across various working conditions.
  • Universal Application: Excellently suited for roughing and a wide range of other applications, making it a valuable tool in any workshop.Ideal for tasks like weld removal, pipe beveling, and stock removal in both ferrous and non-ferrous metals, including hard-face metal alloys and ceramic.
  • Thread Options: Comes with a flange featuring a 5/8 -11 thread (female) or an option for a 7/8 hole, catering to different grinder models.
  • Very Long Life: Engineered for longevity, lasting up to 200 times longer than standard abrasive wheels.
  • Enhanced Safety and Efficiency: Produces less sparks and dust compared to traditional abrasive wheels, ensuring a safer and cleaner working environment.
  • Faster Grinding Speed: Offers up to 50% quicker grinding than conventional abrasive wheels, saving time and increasing productivity.
  • Smooth Grinding and Finishing: Delivers a high-quality finish, reducing the need for additional finishing steps.
Application of Brazed Bond Tools

Brazed Bond Diamond Tools are perfect for machining tough-to-cut materials where fast stock removal and deep cuts are required. Including applications such as: non-metallic materials such as graphite epoxy, FRP, graphite, fiberglass, friction material, honeycomb and other composites.

Examples of Industries Used in

  • Ophthalmic Lens
  • Composites
  • Construction
  • Quartz
  • Carbide
  • Silicon
  • Granite / Marble
  • Fired and pre-fired Ceramics
  • Plastics Industry
  • Glass
  • Graphite
  • Ceramics (pre fired & post fired)

Advantages of

Brazed Bond Diamond Tools
  • Very fast & aggressive cutting speed
  • Maximum diamond crystal exposure
  • Ideal for hard to machine materials
  • Strong retention of diamond grits
  • Can be used at faster cutting speeds
  • Can be used dry and tough environments
  • Less Required Power
  • Capability to Retain Form
  • Minimizing & Often Eliminating Need for Dressing
  • Ability to Strip and re-plate the tool (re-use)
  • Lower Cost
About Brazed Bond

Brazed Diamond Tools are produced using and process that creates a fusion between the diamonds and the metal bond. While they may appear similar to electroplated (nickel bond) diamond tools. They are produced utilizing completely different process. Brazed Bond Diamond Tools are produced inside vacuum oven at a high temperature, single layer of diamond crystal bonded to steel body with very high diamond exposure. Not only does it promote high diamond exposure, but it also eliminates the loss of diamond particles through pull-out. The diamond section will not strip or peel from the steel body. This translates into multiple benefits, including: aggressive tools that last longer, cut faster, run cooler and load less, providing increased productivity and part consistency.

No Glazing

Diamond & CBN tools with SMART CUT® technology require minimum dressing, the bond renews itself.

More Consistent Performance

Diamond & CBN Wheels are produced using only the highest quality raw materials are used in manufacturing process. Utilizing world class quality control, inspection, and measurement equipment. Highly Experienced Engineers constantly monitor and control all material input & output at all stages of manufacturing process. Insuring product consistency for use in demanding & sensitive applications SMART CUT® DIAMOND & CBN wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing.

Faster Cutting Action

Diamond & CBN tools made utilizing SMART CUT® technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

Longer Life

In most cases tools manufactured utilizing SMART CUT® technology, will outlast other conventional material (sintered), resin, and nickel bonded diamond & CBN tools. SMART CUT® diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

Best Performance & Value on the Market​

SMART CUT® Diamond & CBN Wheels are the best investment you can make! Although we may not always be the lowest cost solution provider. Our Diamond & CBN wheels can provide the best ROI. Designed for users that understand and appreciate quality. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Why Choose Us?

Optimize your application to ultimate level of efficiency

Diamond & CBN Wheel
Selection Variables

Diamond Concentration

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Blade Thickness

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning

For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. .

Diamond Particle/Grit size

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain. Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.

Bond Type

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Blade Outside Diameter

typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Feed Rates

load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Bond Hardness

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Blade Speeds/RPM’s

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

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