SMART CUT® Diamond Notch

⦁ Electroplated Wheels: These wheels feature a multi-layered electroplated diamond coating, offering excellent cutting efficiency, minimal wear, and consistent performance. They are best for precision grinding with a lower risk of contamination.

⦁ Sintered (Metal Bond) Wheels: These wheels use a metal bond for higher durability and longer life. They are ideal for tougher grinding applications where enhanced material removal and extended service life are required.

The SMART CUT Diamond Notch Grinding Wheel is designed specifically for high-precision grinding of semiconductor wafers, including materials such as Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs), and Sapphire. These wheels are ideal for the semiconductor industry, where accuracy and consistency are crucial.

The SMART CUT wheels are available in a wide range of grain sizes, from #600 to #1500 mesh, allowing for both coarse and fine grinding depending on your specific application.

The SMART CUT Diamond Notch Grinding Wheel offers multiple angle options of 11°, 20°, and 22°, as well as depth options of 1.09 mm and 0.43″. These customizable specifications allow the wheel to meet the exact requirements for your wafer notching processes.

The groove shape tolerance for this wheel is ≥1 degree at the aperture angle, ensuring high precision and accuracy in notch grinding.

While the primary application for the SMART CUT Diamond Notch Grinding Wheel is semiconductor wafer notching, it may also be used for other high-precision grinding and notching tasks that require fine-tuned cutting performance and minimal wear.

The F-type grooves are typically used for general applications, while the R-type grooves are better suited for specialized processes, such as mirror edge grinding. The choice of groove type depends on the specific requirements of the wafer material and the desired notch geometry.

SMART CUT technology ensures that the diamond grain is consistently and precisely applied, providing superior wear resistance, improved cutting efficiency, and extended service life. Additionally, the proprietary dressing technology (AD-C) helps maintain the wheel’s optimal performance and longevity.

The deflection accuracy of the SMART CUT Diamond Notch Grinding Wheel is ≥5 µm, ensuring high precision and stability during the grinding process, which is essential for semiconductor wafer notching.

To maintain the performance and lifespan of the SMART CUT wheel, regular dressing is recommended. Our proprietary dressing technology (AD-C) enhances the wheel’s service life by keeping the diamond grain exposed for efficient grinding. Regular monitoring of wear and checking for run-out is also advised to ensure optimal performance.

The SMART CUT Diamond Notch Grinding Wheel stands out due to its superior durability, customizable specifications, and advanced technology. With an optimized bond for extended life and reduced wear, it provides better performance and longevity compared to other brands, especially for high-demand applications like semiconductor wafer notching.

The SMART CUT wheels are available in multiple sizes, with inner thicknesses of 30.0 ± 0.2 mm and 38.0 ± 0.2 mm, outer diameters ranging from 3.90 ± 0.1 mm to 4.24 ± 0.2 mm, and groove numbers of 1-2. Custom sizes may be available upon request.

Yes, the SMART CUT Diamond Notch Grinding Wheel is designed to handle both coarse and fine grinding processes. With a grain size range from #600 to #1500 mesh, it provides flexibility for various grinding needs depending on your application.

The SMART CUT wheel provides higher precision, longer life, and better performance compared to conventional grinding wheels. Its ability to handle higher precision notching and fine-tuning capabilities make it ideal for semiconductor wafer processing, where the notch area’s quality is critical. Additionally, its advanced bond technology helps extend wheel life while maintaining consistent performance.

The lifespan of the SMART CUT Diamond Notch Grinding Wheel depends on the application and the material being processed. However, thanks to its advanced bonding technology and the use of high-quality diamond grain, the wheel offers extended service life, even in high-demand applications. Using the proprietary AD-C dressing technology further enhances wheel longevity.

The wheel may need dressing when you notice a decline in performance, such as a decrease in grinding efficiency, excessive heat generation, or rougher surface finishes. Regular monitoring of the wear patterns and inspecting the run-out accuracy will help you determine when dressing is required to restore optimal performance.

While the SMART CUT Diamond Notch Grinding Wheel is primarily designed for semiconductor wafers, it can also be used on other hard and brittle materials, such as ceramics, certain metals, and glass. However, the best results are achieved when used within its intended semiconductor wafer notching applications.

⦁ Electroplated Diamond Wheels: Offer exceptional cutting efficiency, reduced wear, and finer precision for applications that require a higher level of accuracy. They are ideal for applications where frequent dressing or a more delicate finish is required.

⦁ Sintered Metal Bond Wheels: Provide superior durability and wear resistance, making them the ideal choice for more aggressive grinding applications that require faster material removal. They last longer under heavy use and are better suited for high-volume production.

Yes, the SMART CUT Diamond Notch Grinding Wheel is designed to be compatible with a wide variety of grinding machines commonly used in the semiconductor and precision machining industries. Always ensure that the grinding machine supports the specific size and specifications of the wheel you are using.

For optimal performance, we recommend using appropriate cooling fluids (such as water-soluble coolants or oils) to reduce heat generation during the grinding process. Proper cooling helps prevent overheating, which can affect wheel life and performance, as well as ensure a smoother and more consistent grinding result.

While diamond grinding wheels generally have limited reconditioning possibilities compared to other types of grinding wheels, the SMART CUT Diamond Notch Grinding Wheel can be maintained and refreshed using the proprietary AD-C dressing technology. This technology helps expose fresh diamond particles and ensures optimal performance over time, reducing the need for reconditioning.

⦁ Shank Diameter Tolerance: h6, ensuring precise fitment and stable performance during grinding operations.

⦁ Deflection Accuracy: ≥ 5 µm, maintaining high precision throughout the grinding process.

⦁ Groove Shape Tolerance: ≥ 1 degree at aperture angle, ensuring the highest notch accuracy.

The number of grooves on the SMART CUT Diamond Notch Grinding Wheel can be customized to suit your specific application needs. Single groove designs are suitable for simpler, single-notch applications, while multi-groove designs can be used for more complex, multi-notch operations. Having multiple grooves allows for improved efficiency and precision when processing semiconductor wafers with multiple notch requirements.

The maximum operating speed (RPM) for the SMART CUT Diamond Notch Grinding Wheel should be determined based on the specific diameter and application requirements. Typically, higher speeds are used for finer grain sizes, while slower speeds may be appropriate for coarse grinding. Always refer to the product specifications for the specific wheel you are using to ensure safe operation.

⦁ Finer Grain Sizes (e.g., #1500 mesh): Provide a smoother finish and are ideal for precision grinding applications where high surface quality is critical.

⦁ Coarser Grain Sizes (e.g., #600 mesh): Offer faster material removal rates, making them suitable for heavy-duty grinding applications that prioritize speed over surface finish.

Yes, SMART CUT offers custom sizes and specifications based on your specific needs. If you have unique wafer sizes, groove configurations, or bond requirements, we can work with you to create a tailored solution that meets your operational demands.

When using any grinding wheel, including the SMART CUT Diamond Notch Grinding Wheel, always adhere to the following safety precautions:

⦁ Wear appropriate personal protective equipment (PPE) such as safety goggles, gloves, and hearing protection.

⦁ Ensure that the grinding wheel is properly mounted and balanced to prevent vibration or instability.

⦁ Follow the manufacturer’s guidelines for maximum operating speeds (RPM) and avoid exceeding them.

⦁ Use proper cooling to reduce heat build-up and prevent damage to both the wheel and workpiece.