An image showcasing the products of Precision Abrasives Group, offering high-quality abrasive tools for various industries.

UKAM Industrial Superhard Tools

Facebook-f Instagram Linkedin-in Youtube Tiktok

661-257-2288

9 am to 6 pm PST time

Request Consultation
  • Home
  • About Us
    • About Us
    • Achievements
    • Research & Development
    • What’s New
    • Become A Distributor
    • Become An Affiliate
    • Employment
    • Custom Diamond & CBN Tools
    • Sign Up For News Letter
    • Contact Us
  • Products
  • Technologies
    • SMART CUT®
    • Sintered (Metal Bond)
    • Resin Bond
    • HYBRID Bond™
    • Electroplating (Nickel Bond)
    • Braised Bond
    • Vetrified Bond
    • Polycrystalline
    • Chemical Vapor Deposition
    • Precision Carbide
  • Industries
    • Advanced Ceramics
    • Composites
    • Concrete & Construction
    • Glass & Quartz
    • Lapidary
    • Metallography
    • Semiconductor Industry
    • Stone
    • Photonics
  • Knowledge Center
  • Shop
  • Blog
  • Customer Service
  • Home
  • About Us
    • About Us
    • Achievements
    • Research & Development
    • What’s New
    • Become A Distributor
    • Become An Affiliate
    • Employment
    • Custom Diamond & CBN Tools
    • Sign Up For News Letter
    • Contact Us
  • Products
  • Technologies
    • SMART CUT®
    • Sintered (Metal Bond)
    • Resin Bond
    • HYBRID Bond™
    • Electroplating (Nickel Bond)
    • Braised Bond
    • Vetrified Bond
    • Polycrystalline
    • Chemical Vapor Deposition
    • Precision Carbide
  • Industries
    • Advanced Ceramics
    • Composites
    • Concrete & Construction
    • Glass & Quartz
    • Lapidary
    • Metallography
    • Semiconductor Industry
    • Stone
    • Photonics
  • Knowledge Center
  • Shop
  • Blog
  • Customer Service
  • Customer Support
  • 0 items in quote

    No products in the Quote Basket.

imgFind Products by
  • All Products
    img
    Diamond Core Drills
    img
    img
    Dicing Blades​
    img
    img
    Ultra Thin Precision Diamond​ Blades
    img
    img
    Diamond Micro Drill​s & Tools
    img
    img
    Diamond Routers, Points, Profile & Milling Tools
    img
    img
    Diamond & CBN Wheels​
    img
    img
    Custom Diamond & CBN Tools​
    img
    img
    Diamond Discs & Laps
    img
    img
    Diamond Wire Blades​
    img
    img
    Diamond Consumables
    img
    img
    Consumables For Metallography
    img
    img
    Diamond Tools For Construction
    img
    img
    Diamond Band Saw Blades​
    img
    img
    Diamond Dressers
    img
    img
    Diamond Rotary Dressers
    img
    img
    Ultra Thin Carbide Blades & Micro Tools
    img
    img
    Precision Abrasives
    img
    img
    Diamond Tool Accessories
    img
    img
    Process Development
    img
    img
    Precision Machining Services
    img
    img
    Precision Cutting Saws
    img
    img
    Grinding & Polishing Equipment
    img
    img img img img
  • Application
    img

    Industry

    img
    img

    Research

    img
    img

    Contractor

    img
    img

    Hobby

    img
    img

    Industry

    img
    img

    Research

    img
    img

    Contractor

    img
    img

    Hobby

    img
  • Industry
    • Aerospace
    • Advanced Ceramics
    • Automotive
    • Ceramics/Porcelain
    • Composites
    • Concrete
    • Construction
    • Dental
    • Diamond Industry
    • Disc Drive
    • Electronics
    • Failure Analysis
    • Glass
    • Lapidary
    • Jewelry
    • Materials Research
    • Masonary
    • Medical Devices
    • Metal
    • Metallography
    • Nano Technology
    • Optics
    • Photonics
    • Photovaltaic
    • Quartz
    • Research & Development
    • Sample Preparation
    • Semiconductor
    • Sculpting
    • Stone
    • Surface Preparation
    • Tool & Die
    • Engineering
wishlist
$0.00 0 Cart

Cart

  • My Account
Diamond Edge Grinding Wheels
Click to enlarge
Diamond Edge Grinding Wheels
Home Uncategorized SMART CUT® Diamond Edge Grinding Wheels (Electroplated)
6009 LOW SPEED SAW
SMART CUT® 6009 LOW SPEED SAW
Back to products
SMART CUT® Diamond Notch
SMART CUT® Diamond Notch

SMART CUT® Diamond Edge Grinding Wheels (Electroplated)

-

SMART CUT® Diamond Edge Grinding Wheels are engineered to deliver exceptional performance for precision grinding applications, providing superior results in both rough and fine grinding. These wheels are ideal for use in industries that require highly accurate EDM processing and consistent wafer-to-wafer results. Manufactured with synthetic diamond grit, SMART CUT® wheels offer improved surface roughness and extended tool life due to their tightly controlled diamond distribution and uniform bond structure.

Get A Quote
Add to wishlist
Compare
  • Description
Description
Diamond Edge Grinding Wheels
Click to enlarge
Diamond Edge Grinding Wheels

SMART CUT®
Diamond Edge Grinding Wheels (Electroplated)

SMART CUT® Diamond Edge Grinding Wheels are engineered to deliver exceptional performance for precision grinding applications, providing superior results in both rough and fine grinding. These wheels are ideal for use in industries that require highly accurate EDM processing and consistent wafer-to-wafer results. Manufactured with synthetic diamond grit, SMART CUT® wheels offer improved surface roughness and extended tool life due to their tightly controlled diamond distribution and uniform bond structure.

Get A Quote
DESCRIPTION
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
INDUSTRIES USED IN
ACCESSORIES
USAGE RECOMMENDATION
CASE STUDIES
DESCRIPTION

SMART CUT® Diamond Edge Grinding Wheels are designed for superior performance in high-precision grinding applications, especially when working with hard and brittle materials. These wheels are engineered to provide exceptional edge grinding efficiency, increased productivity, and extended tool life. Featuring multi-layer electroplated technology, SMART CUT® wheels offer more than twice the lifetime and productivity improvement compared to single-layer electroplated products.

Available in Single & Multi-Layer electroplated technology, SMART CUT® wheels offer more than twice the lifetime and productivity improvement compared to single-layer electroplated products.

SPECIFICATIONS
img
Groove Profiles: SMART CUT® wheels are available with a variety of groove profiles, including V and W shapes, ensuring versatility for different grinding tasks. Tolerances: We are capable of manufacturing with highly precise tolerances that meet or exceed customer specifications. These include radius tolerances of +0.02mm (0.0008″), half angle tolerances of ±0.5 degrees, and groove depth tolerances of ±0.004” (0.102mm).
Our edge grinding wheels feature a circular runout of less than 0.005” (0.127mm), side runout of less than 0.0001” (0.0025mm), flatness within 0.0002” (0.0051mm), and shaft perpendicularity within 0.0005” (0.0127mm). For high-precision, long-lasting edge grinding solutions, SMART CUT® Diamond Edge Grinding Wheels are the ideal choice for advanced materials and tough applications.
  • Grinding Applications: Suitable for both rough and fine grinding applications.
  • Wheel Diameter: Available in 102 mm or 202 mm sizes. Other Sizes can be produced
  • Bond Type: Nickel bond (electroplated) and Sintered (metal bond)
  • Grit Type: Synthetic diamond.
  • Grit Size: ½ μm to 40/60 μm (GRIT: 2,000 US mesh and 4,000 US mesh)
  • Groove Types: V, R, or Custom configurations to suit your specific needs.
FREQUENTLY ASKED QUESTIONS

What materials can SMART CUT Diamond Edge Grinding Wheels be used for?

SMART CUT Diamond Edge Grinding Wheels are ideal for use on hard and brittle materials, including:
⦁ Ceramics
⦁ Gallium Arsenide
⦁ Gallium Nitride
⦁ Glass
⦁ Germanium
⦁ Sapphire
⦁ Silicon
⦁ Silicon Carbide

What is the advantage of using multi-layer electroplated SMART CUT wheels?

Multi-layer electroplated SMART CUT wheels offer more than twice the lifetime and productivity improvement compared to single-layer electroplated products. This makes them highly efficient for high material yield and throughput when grinding hard and brittle materials.

What is the benefit of uniform diamond distribution in SMART CUT wheels?

The uniform diamond size and distribution throughout the wheel ensure a consistent grinding process, resulting in superior surface finishes with minimal edge chipping and subsurface damage. This helps improve the overall quality of your workpieces.

What is the maximum grit size available for SMART CUT wheels?

SMART CUT Diamond Edge Grinding Wheels are available with grit sizes ranging from 400 to 3,000 JIS, making them suitable for both rough and fine grind applications

How many grooves can SMART CUT wheels accommodate?

SMART CUT wheels can accommodate up to 10 grooves per wheel, and they are available with two grit types: rough and fine.

How are the grooves on SMART CUT wheels machined?

Each groove on SMART CUT wheels is precisely machined using the Electrical Discharge Machining (EDM) process, ensuring strict geometric tolerance control for consistent profile accuracy.

Can the groove profile be customized?

Yes, SMART CUT Diamond Edge Grinding Wheels can be tailored to your specific groove dimensions, offering V, R, or custom profiles to suit your grinding needs.

Can the hardness and bond characteristics be adjusted?

SMART CUT wheels can be optimized by adjusting the diamond bond hardness and other characteristics to ensure optimal performance for your specific grinding process.

What types of support do you offer for SMART CUT wheels?

We provide onsite application support and process fine-tuning to help you achieve the best results with your SMART CUT Diamond Edge Grinding Wheels. Our team can assist in optimizing the wheel’s performance for your specific grinding needs.

What is the expected lifespan of SMART CUT Diamond Edge Grinding Wheels?

SMART CUT wheels, thanks to their multi-layer electroplated design and uniform diamond distribution, offer extended lifespans compared to single-layer products, providing longer operational use and reduced frequency of replacements.

What grinding applications are SMART CUT wheels suitable for?

SMART CUT wheels are suitable for both rough and fine grinding applications, providing versatility across different industries and material types.

Can I use SMART CUT wheels for wafer-to-wafer grinding?

Yes, SMART CUT wheels are engineered for wafer-to-wafer grinding applications, offering consistent performance and high material yield.

What is the difference between SMART CUT Diamond Edge Grinding Wheels and traditional grinding wheels?

SMART CUT Diamond Edge Grinding Wheels are specifically designed for high-precision edge grinding of hard and brittle materials. Unlike traditional grinding wheels, they offer superior performance, longer tool life, and minimal edge chipping due to their uniform diamond distribution, multi-layer electroplated structure, and engineered diamond exposure ratio.

How do SMART CUT wheels reduce edge chipping?

The uniform diamond distribution and engineered diamond exposure ratio help ensure that the cutting action is consistent and controlled, resulting in smooth grinding and reducing the risk of edge chipping. Additionally, the multi-layer electroplated construction contributes to less wear and damage during the grinding process.

What is the maximum wheel diameter available for SMART CUT wheels?

SMART CUT wheels are available in two standard wheel diameters: 102 mm and 202 mm. Custom diameters can be manufactured upon request for specific applications.

How does the EDM process ensure precision in SMART CUT wheels?

The Electrical Discharge Machining (EDM) process is used to precisely machine the grooves of SMART CUT wheels. This ensures strict control over the geometric tolerance of each groove, leading to accurate and consistent edge grind profiles, which is crucial for industries requiring high precision.

Are SMART CUT wheels suitable for both wet and dry grinding?

SMART CUT Diamond Edge Grinding Wheels are versatile and can be used in both wet and dry grinding applications. For wet grinding, we recommend using the appropriate coolant to extend tool life and improve performance.

What kind of coolant is recommended when using SMART CUT wheels?

While SMART CUT wheels can be used without coolant for dry grinding, we recommend using a high-quality coolant for wet grinding applications. The use of the correct coolant helps reduce heat build-up, improves surface finish, and prolongs the life of the grinding wheel.

What type of bond does SMART CUT use, and what are the advantages?

SMART CUT wheels use a metal bond, available in both standard and hard options. The metal bond provides excellent diamond retention, making the wheel more durable and resistant to wear, which is essential for grinding hard and brittle materials.

Can I use SMART CUT wheels for precision edge grinding on thin materials?

Yes, SMART CUT wheels are designed to handle thin and delicate materials, delivering accurate grinding results without causing significant edge damage or warping. Their precision design makes them well-suited for wafer and other thin material applications.

What is the expected yield of material when using SMART CUT wheels?

SMART CUT wheels are engineered to optimize material yield, ensuring that the maximum amount of material is utilized while minimizing waste. This makes them an excellent choice for industries where maximizing material yield is critical.

Are SMART CUT wheels customizable for specific grinding processes?

Yes, SMART CUT wheels can be tailored to meet your specific grinding needs. Custom options include adjusting the grit size, bond hardness, groove profile, and other parameters to suit the unique requirements of your grinding application.

How long does it take to break in a SMART CUT wheel?

SMART CUT wheels typically require a short break-in period to optimize diamond exposure. The exact time will depend on the specific application and grinding parameters, but generally, the wheel will reach peak performance after a brief initial use.

How do I know if SMART CUT wheels are the right choice for my grinding application?

SMART CUT wheels are ideal for high-precision edge grinding of hard and brittle materials with minimal edge chipping and high material yield. If you require a durable, consistent, and high-performance grinding solution for tough materials, SMART CUT is the right choice. We also offer expert advice and support to help you determine the best product for your needs.

How can I maintain SMART CUT wheels to extend their lifespan?

To maximize the lifespan of your SMART CUT wheels, ensure proper maintenance such as regular dressing, appropriate grinding speeds, and using the correct coolant for wet grinding. Following recommended operating parameters and  performing periodic maintenance will help preserve wheel life and performance.

Are SMART CUT wheels available in different bond strengths?

Yes, SMART CUT wheels are available in different bond strengths (standard or hard). The choice of bond strength will depend on the material being ground and the desired performance characteristics. We can help you select the appropriate bond strength for your specific application.

What makes SMART CUT wheels more effective than other grinding wheels in terms of part quality?

 SMART CUT wheels offer superior part quality due to their uniform diamond distribution, engineered diamond exposure ratio, and multi-layer electroplating. These features ensure a consistent profile, high material yield, and superior surface finishes, all while minimizing edge chipping and subsurface damage.

How does the multi-layer electroplating affect wheel performance?

The multi-layer electroplating of SMART CUT wheels enhances their durability, providing a higher diamond concentration and extended tool life. This layer ensures optimal diamond exposure, which translates into more consistent and efficient grinding over time, particularly in demanding edge grinding applications.

Can SMART CUT wheels be used for high-precision wafer grinding?

Yes, SMART CUT wheels are specifically designed for high-precision wafer grinding. Their uniform diamond distribution and ability to handle thin, delicate materials make them ideal for applications such as semiconductor wafer edge grinding and other wafer-to-wafer processes.

Are SMART CUT wheels suitable for grinding both rough and fine finishes?

SMART CUT wheels can be tailored for both rough and fine grinding, depending on the grit size chosen. The flexibility to accommodate different grinding finishes ensures that SMART CUT wheels are adaptable to a wide range of applications, from initial material removal to fine edge finishes.

What is the impact of using SMART CUT wheels on the overall grinding process?

The use of SMART CUT wheels improves the overall grinding process by increasing throughput, reducing grinding time, and enhancing the surface finish quality. With their extended lifespan and consistent performance, these wheels help improve production efficiency and minimize downtime due to tool changes.

Can SMART CUT wheels be used in automated grinding systems?

Yes, SMART CUT wheels are compatible with automated grinding systems. Their durability, uniformity, and customizable profiles make them ideal for integration into automated processes where precision, speed, and consistency are essential.

Do SMART CUT wheels require any special equipment?

No, SMART CUT wheels can be used with standard grinding equipment. However, for optimal performance, it’s recommended to use equipment that can handle the precise speed and pressure requirements specific to your application. Additionally, the use of proper coolants may be required for wet grinding applications.

How do I choose the right grit size for my SMART CUT wheels?

Choosing the right grit size depends on the material you’re grinding and the desired finish. For rough grinding, larger grits (such as 400-800) are typically used, while finer grits (such as 1,000-3,000) are ideal for achieving smooth finishes. Our technical team can assist in recommending the optimal grit size for your specific application.

What are the key advantages of using EDM (Electrical Discharge Machining) in SMART CUT wheels?

The EDM process ensures extremely tight tolerances on groove dimensions, allowing for highly accurate groove profiles. This is essential for applications requiring precise edge grinding and dimensional consistency. It also helps extend the wheel’s lifespan by reducing the likelihood of groove wear during use.

What is the expected cycle time when using SMART CUT wheels in a high-throughput environment?

In high-throughput environments, SMART CUT wheels help reduce cycle times by maintaining consistent performance across multiple grinding sessions. The increased diamond exposure and longer lifespan contribute to higher productivity without compromising surface finish quality.

Can I use SMART CUT wheels for polishing applications?

While SMART CUT wheels are optimized for grinding, they can also be used for certain polishing applications, especially when a fine finish is required. For polishing tasks that require a higher degree of smoothness, additional polishing tools or finer grit sizes may be recommended.

Are SMART CUT wheels suitable for use in industries outside of semiconductor and wafer grinding?

Yes, SMART CUT wheels are versatile and can be used in various industries beyond semiconductors, such as optics, automotive, aerospace, and precision manufacturing, where hard and brittle materials require high-precision grinding.

What are the standard customization options available for SMART CUT wheels?

Customization options for SMART CUT wheels include groove profiles (V, R, or custom), grit sizes (ranging from 400 to 3,000 JIS), bond hardness (standard or hard), and even the number of grooves per wheel. We can also tailor the bond characteristics to match your specific material and process needs.

How do SMART CUT wheels help in reducing material loss during grinding?

SMART CUT wheels are engineered for high material yield, allowing you to grind with greater precision while minimizing material loss. Their consistent grinding process ensures that parts are ground efficiently without unnecessary waste, making them a cost-effective solution for high-precision applications.

How should I store SMART CUT wheels when not in use?

To maintain the performance and longevity of SMART CUT wheels, store them in a clean, dry environment away from excessive heat or moisture. Ensure that the wheels are kept free from any contaminants, which could affect their performance when used.

Can I use SMART CUT wheels for edge grinding on fragile or thin materials?

Yes, SMART CUT wheels are ideal for grinding fragile and thin materials, including delicate wafers or ceramics. Their precision design helps ensure minimal damage to the edges and surfaces, making them perfect for industries where part integrity is critical.

How do I know when it’s time to replace my SMART CUT wheel?

You should consider replacing your SMART CUT wheel when you notice a decrease in grinding efficiency, surface finish quality, or when the wheel starts to show signs of significant wear. Regular maintenance, including dressing the wheel, can help extend its life, but eventual replacement is necessary to maintain optimal performance.

Are SMART CUT wheels environmentally friendly?

SMART CUT wheels are designed with durability and longevity in mind, helping to reduce waste and the need for frequent wheel replacements. Using these wheels can help lower the overall environmental impact by reducing material consumption and improving the efficiency of the grinding process.

INDUSTRIES USED IN

Tab Content

ACCESSORIES

Tab Content

USAGE RECOMMENDATION

Tab Content

CASE STUDIES
  • APPLICATION:
    Edge grinding of 200 mm silicon wafers for semiconductor device fabrication
  • WHEEL SPEC:
    • OD: 250 mm
    • ID: 150 mm
    • Diamond Grit: 600 mesh (D30)
    • Bond Type: SMART CUT® Metal Bond MB-12
    • Concentration: 75
    • Profile: Multi-step edge-grind radius profile (0.3 mm × 45° bevel)
    • Diamond Rim Width: 8.0 mm
    • Core Material: Heat-treated steel core with vibration-damping structure
  • MACHINE:
    High-precision edge-grinding system for brittle semiconductor materials, wet grinding configuration
  • RESULTS:
    img

The wheel delivered stable edge morphology with low micro-chipping (<5 µm) and maintained a consistent bevel radius throughout extended processing. Across multiple production runs, the wheel preserved form accuracy with minimal dressing requirements, supporting improved wafer handling strength and reduced reject rates. The surface quality and edge integrity remained within required specifications for advanced photolithography and deposition processes.

Features:

  • Enhanced Performance: Multi-layer electroplating significantly boosts lifetime and productivity, offering over twice the performance improvement compared to single-layer products.
  • Precision & Accuracy: With a uniform diamond size and distribution throughout the abrasive layers, SMART CUT® wheels provide superior finish quality, including minimal edge chipping and subsurface damage.
  • Tailored for High Yield: Ideal for applications requiring high material yield and throughput, particularly in the grinding of hard and brittle materials.
  • Consistent Results: Tightly controlled diamond size and high concentration ensure a consistent product that delivers high-quality results with every grind.
  • Engineered Diamond Exposure Ratio: Ensures the wheel is highly effective in maintaining consistent edge quality and performance.
  • Customizable Grooves: Each groove is machined with precision using the EDM (Electrical Discharge Machining) process for strict geometric tolerance control. SMART CUT® wheels can accommodate up to 10 grooves and 2 grit types (rough and fine) per wheel.
  • Optimized Bond Characteristics: Fine adjustments in diamond bond hardness and other characteristics can be customized for optimization to your specific grinding process.
  • Onsite Application Support: Our team provides application assistance and process fine-tuning to help you achieve the best results.

Application:

SMART CUT® Diamond Edge Grinding Wheels are suitable for use with a variety of materials, including:

  • Ceramics
  • Gallium Arsenide
  • Gallium Nitride
  • Glass
  • Germanium
  • Sapphire
  • Silicon
  • Silicon Carbide

About Nickel Bond
(Electroplated) Tools

Electroplated (nickel bond) diamond products usually have a single layer of diamonds, held by a tough durable nickel alloy. Nickel is frequently used as a base for plating diamond. Because of its excellent strength, toughness and flexibility during the plating process. Electroplated diamond products are able to retain their original shape and dimensions thought their working life. Unlike sintered (meal bond) or resin bond diamond products, where diamond particles are buried in bond and held together by metal or resin binder deep inside.

Electroplating allows diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.

Find our more
Electroplated Diamond Products Manufactured by UKAM Industrial are Multi Layered. They have 3 layers of diamonds, not just 1 layer of diamonds like conventional electroplated diamond tools. 

Multi Layered

Electroplated Diamond & CBN Coatings

They have several layers of diamonds, held by a tough durable nickel alloy. Providing high  diamond  concentration, better diamond crystal retention and maximum diamond particle (grit) exposure/protrusion ratio. This provides freer,  faster cutting  action  with  minimum heat generation. Advantages of this type of technology include: longer tool life, more uniformity in performance, less stress to material being worked on, minimum material deformation, and better preservation of true material micro structure. This is specially important for more delicate, sensitive applications such as: glass, crystals, silicon wafers, carbon composites, sapphire, etc.

Electroplating is the only bond that allows different diamond crystal protrusion/exposure through use of different coating thicknesses. Usually the exposure ratio is based on the application (materials to be cut) The final specification depends primarily on the machining task and the associated necessary chip clearance space. For high-speed grinding the coating thickness should be about 30 to 40% of the grit particle diameter, when grinding or cutting glass fibre-reinforced plastics 30 to 50%, when machining ceramic material and cemented carbide 60 to 70%, and when machining stone up to 100%.

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT ® Bond Works?

Step 1
Sharpest And Finest Quality Diamonds

Sharpest And Finest Quality Diamonds

The sharpest and finest quality diamonds or CBN crystals that go into a SMART CUT® Diamond Bond, immediately penetrate into the material, grinding and polishing as they cut.

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2
Sharpest And Finest Quality Diamonds

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3
Sharpest And Finest Quality Diamonds

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

Find our more

About Edge Grinding Process

Once the peripheral dimensions of the silicon wafers are established through peripheral grinding, attention turns to surface and edge grinding. This stage is crucial for achieving the necessary flatness and surface quality for semiconductor fabrication, which involves intricate processes like photolithography and various deposition techniques.

Surface and edge grinding play several key roles. Firstly, surface grinding ensures the wafers are perfectly flat, which is vital for the success of subsequent photolithographic processes where any deviation can cause focus issues and pattern distortions.Secondly, edge grinding targets the wafer’s outer rim to remove microscopic cracks or chips that could propagate during processing and potentially lead to wafer breakage. Lastly, both grinding methods enhance the smoothness of the wafer's surface, essential for the uniform deposition of thin films and other materials in later stages.

Manufacturing Processes for Silicon Semiconductors From Ingot to Integrated Circuit

These grinding processes use specialized machines equipped with fine-grit, diamond-coated grinding wheels, performing under tightly controlled conditions. The selection of the grinding wheel is critical; wheels with finer abrasive particles are chosen for a smoother finish, while coarser grits are used for rapid material removal. Key grinding parameters such as wheel speed, feed rate, and depth of cut are carefully optimized to balance the removal rate with surface quality, and these parameters often vary depending on the type of silicon wafer and its intended application.

Coolants play an essential role in surface and edge grinding, minimizing thermal stress and flushing away silicon particles from the grinding interface. This prevents overheating and reduces the risk of surface contamination and damage. An excellent coolant for this application.

SMART CUT® HD-2 is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots and wafers. 

Despite being routine, surface and edge grinding present several challenges. Maintaining uniform thickness across a single wafer and from one wafer to another is particularly challenging as wafer diameters increase. Grinding can also introduce sub-surface damage like micro-cracks and stresses, which must be minimized to ensure the mechanical and functional integrity of the wafers. Achieving the right balance in material removal is crucial; too much removal can weaken a wafer, while insufficient grinding may leave defects.

HD-2B Coolant
Find our more

The quality of surface and edge grinding directly impacts the subsequent steps of semiconductor device fabrication. Imperfections in flatness or surface quality can adversely affect the lithography process,potentially leading to defective circuit patterns. Moreover, the integrity of the wafer's edges is critical to prevent breakage during handling, especially as wafers become larger and thinner.

Diamond Edge Grinding Wheels:
Electroplated vs. Sintered (Metal Bond)

Diamond edge grinding wheels are essential tools for high-precision grinding applications, particularly when working with hard and brittle materials such as ceramics, glass, and semiconductor wafers. These wheels are available in two main types: electroplated and sintered (metal bond), each offering distinct advantages depending on the specific grinding requirements. Below, we explore the differences between these two types of diamond edge grinding wheels, helping you choose the right one for your application.

Electroplated Diamond Edge Grinding Wheels

Electroplated diamond wheels are made by electroplating diamond particles onto a metal core using an electrochemical process. This bonding technique results in a high concentration of diamond particles exposed at the surface of the wheel. The primary feature of electroplated wheels is their fast cutting ability, making them ideal for applications where quick material removal is necessary.

Advantages:

  • Faster Cutting Speed: Due to the high concentration of exposed diamonds, electroplated wheels offer aggressive cutting action, enabling faster material removal and higher throughput, especially for softer materials or when working with thin materials like semiconductor wafers and glass.
  • Lower Initial Cost: Electroplated wheels are typically more affordable compared to sintered wheels, making them a cost-effective option for short-term or high-volume applications where speed is prioritized over tool life.
  • Less Maintenance: These wheels typically require less frequent dressing and maintenance because of the way the diamonds are initially exposed and the high diamond retention.
  • Good for Thin Materials: Electroplated wheels excel at grinding thin or delicate materials where minimal pressure is required to avoid damage. They provide precise cuts with less heat generation compared to other types of wheels.

Disadvantages:

  • Shorter Tool Life: The high exposure of diamond particles means that electroplated wheels tend to wear out more quickly. Once the diamonds are gone, the wheel becomes ineffective, leading to more frequent replacements.
  • Potential for Edge Chipping: Due to the rapid wear of diamonds, these wheels can cause more edge chipping, especially on hard or brittle materials, reducing the overall quality of the finished surface.

Sintered (Metal Bond) Diamond Edge Grinding Wheels

Sintered diamond wheels, also known as metal bond wheels, are manufactured by embedding diamond particles into a metal matrix, which is then heated and compressed to form a solid bond. This bond type is known for its durability and gradual wear characteristics, offering consistent performance over extended periods.

Advantages:

  • Longer Tool Life: The diamond particles in sintered wheels are more securely bonded in the metal matrix, which results in slower wear and prolonged tool life. This makes them ideal for continuous grinding operations, especially when precision and consistency are needed.
  • Superior Surface Finish: Sintered wheels are known for their ability to produce high-quality surface finishes with minimal edge chipping. The gradual exposure of diamonds during grinding allows for controlled cutting, which is crucial when working with hard, brittle materials such as sapphire or ceramics.
  • Less Risk of Edge Chipping: Due to the more controlled release of diamond particles, sintered wheels generally cause less edge chipping compared to electroplated wheels, making them ideal for applications requiring fine edge grinding and minimal damage to delicate materials.
  • Higher Durability for Hard Materials: These wheels are excellent for grinding harder materials and are well-suited for applications that involve high precision and tough conditions where maximum tool life is critical.

Disadvantages:

  • Slower Cutting Speed: While sintered wheels are highly durable, they tend to have slower cutting speeds compared to electroplated wheels due to the controlled release of diamonds. This makes them less ideal for applications requiring rapid material removal.
  • Higher Initial Cost: The manufacturing process for sintered wheels is more complex, leading to a higher initial cost. However, the extended tool life makes these wheels more cost-effective over time, particularly in high-precision or heavy-duty applications.

Sintered metal bond edge grinding wheels and plated
(electroplated) edge grinding wheels:

Attribute

Sintered Metal Bond Edge Grinding Wheels

Plated (Electroplated) Edge Grinding Wheels

Bond Type 

Metal bond (sintered) 

Electroplated (diamond particles directly bonded to the core)

Cutting Speed 

 Slower cutting speed, controlled and consistent material removal

Faster cutting speed, ideal for rapid material removal

Tool Life 

Longer lifespan, gradual diamond exposure, consistent performance 

Shorter lifespan, diamonds wear out quickly, more frequent replacement

Durability 

High durability for heavy-duty grinding 

 Less durable under heavy grinding, more prone to wear

Surface Finish Quality 

 High-quality finish, minimal edge chipping, consistent results

May cause more edge chipping and surface inconsistencies, lower finish quality

Subsurface Damage 

 Lower subsurface damage due to controlled diamond release

Generally lower subsurface damage but can vary depending on wear

Chipping & Cracking 

 Minimal edge chipping, excellent for precision grinding of brittle materials 

Higher risk of edge chipping due to faster wear and less controlled cutting

Precision & Consistency

Excellent for high-precision grinding with consistent results

 May show more variation in performance over time

Grinding Efficiency 

 Moderate material removal rate, suitable for controlled, precise grinding 

High material removal rate, efficient for quick grinding

Suitability for Hard Materials 

Excellent for hard, brittle materials (e.g., ceramics, sapphire, glass) 

 Better suited for softer or thin materials (e.g., thin wafers, soft ceramics)

Risk of Edge Chipping 

Low risk, ideal for delicate edge grinding

Higher risk, especially on brittle materials

Cost 

Higher upfront cost but cost-effective in the long run due to longer lifespan 

Lower initial cost but higher long-term replacement costs

Maintenance Requirements 

 Requires more frequent dressing to maintain optimal performance 

Requires less frequent dressing, but needs more frequent replacement

Suitability for Fine Finishes

 Ideal for high-precision, fine finishes with minimal edge chipping 

Suitable for rough or medium finishes, less precise for fine work

Grinding Applications 

 Precision edge grinding, wafer processing, ceramics, hard materials 

 High-throughput grinding, thin materials, rapid material removal

Customization Options 

 Can be tailored with different grit sizes, bond strengths, and profiles

Can be customized in terms of grit size and profile but with limitations on bond strength

CASE STUDIES

APPLICATION:

Edge grinding of 200 mm silicon wafers for semiconductor device fabrication

WHEEL SPEC:

  • OD: 250 mm
  • ID: 150 mm.
  • Diamond Grit: 600 mesh (D30)
  • Bond Type: SMART CUT® Metal Bond MB-12
  • Concentration: 75
  • Profile: Multi-step edge-grind radius profile (0.3 mm × 45° bevel)
  • Diamond Rim Width: 8.0 mm
  • Core Material: Heat-treated steel core with vibration-damping structure

MACHINE:

High-precision edge-grinding system for brittle semiconductor materials, wet grinding configuration

RESULTS:

The wheel delivered stable edge morphology with low micro-chipping (<5 µm) and maintained a consistent bevel radius throughout extended processing. Across multiple production runs, the wheel preserved form accuracy with minimal dressing requirements, supporting improved wafer handling strength and reduced reject rates. The surface quality and edge integrity remained within required specifications for advanced photolithography and deposition processes.
 

Related Products

SMART CUT® Diamond Cylindrical Grinding Wheels

SMART CUT®  Diamond Cylindrical Grinding Wheels are engineered for the precise peripheral grinding of silicon ingots, making them an ideal choice for industries such as semiconductors, electronics, automotive, and photovoltaics. These high-performance grinding wheels are designed to process the outer surfaces of silicon ingots, ensuring accurate orientation flats are created, which are essential for subsequent processing steps. The addition of the orientation flat, a marked edge indicating the crystallographic plane of the wafer, is crucial for the wafer's alignment in future manufacturing processes. During the post-slicing phase, wafers undergo shaping and smoothing through peripheral grinding.
Add to wishlist
Get A Quote

-

Quick view

SMART CUT® Diamond Notch

SMART CUT® Diamond Notch Grinding Wheels in Single & Multi Layered electroplated nickel bond & sintered (metal bond) are construction are developed for high precision notch formation on semiconductor wafers. These wheels support performance requirements for Silicon, Silicon Carbide, Gallium Arsenide, and Sapphire. The electroplated structure holds diamond particles firmly on the surface, producing accurate geometry, clean edges, and stable performance during continuous wafer processing. You receive predictable grinding behavior, long wheel life, and consistent notch dimensions under demanding production conditions.
Add to wishlist
Get A Quote

-

Quick view
High-quality diamond band saw blades designed for precision cutting in various industries, offering durability and superior performance.

Diamond Band Saw Blades

Band Saw Blades Electroplated (Nickel Bond) SMART CUT® All diamond band saw blades are custom-manufactured to fit your exact material,
Add to wishlist
Get A Quote

-

Quick view

SMART CUT® Braised Bond Diamond Band Saw Blades

SMART CUT® Braised Bond Diamond Band Saw Blades SMART CUT® Braised Bond diamond band saw blades are crafted through a
Add to wishlist
Get A Quote

-

Quick view

ID blades

ID blades (Inside Diameter) Diamond Cutting Blades – SMART CUT Series SMART CUT  ID blades (inside diameter) diamond cutting plates
Add to wishlist
Get A Quote

-

Quick view
Diamond Wire
Diamond Wire

Diamond Wire

SMART CUT  Diamond wire produces minimum kerf loss, less sub-surface damage, and contamination free coolant. Used for precision cutting of various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials. Diamond Wire cutting is an environmentally friendly cutting process as it eliminates slurry recycling and disposal issues. It is widely used for slicing artificial crystals, ceramics, quartz glass, monocrystalline and polycrystalline silicon, sapphire, and specialty metals. The design provides high dimensional accuracy and smooth surfaces, often eliminating the need for extensive secondary processing.
Add to wishlist
Get A Quote

-

Quick view

SMART CUT® HD Synthetic Low IFT Coolant/Lubricant For Diamond Wire Sawing Silicon

SMART CUT® is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots using ID, band, and wire saws. SMART CUT® HD-2B can also be used as a non-re-circulating edge grinding coolant or lubricant for silicon wafers and ingots.
Add to wishlist
Get A Quote

-

Quick view
Diamond backgrinding wheels

DIAMOND BACKGRINDING WHEELS

SMART CUT®  Diamond Backgrinding Wheels are designed for precision thinning and flattening of silicon wafers, glass, and ceramic substrates. These high-performance wheels are used on backgrinding machines, including models from Disco, Okamoto, Strasbaugh, and other leading manufacturers. Available in sizes ranging from 8” to 14” O.D., they are engineered to handle a wide range of materials and applications, from semiconductor wafers to microelectronic packages.
Add to wishlist
Get A Quote

-

Quick view

    ARE YOU USING RIGHT DIAMOND EDGE GRINIDNG WHEELS

    FOR YOUR APPLICATION?

    LET US
    HELP YOU

    CONTACT US

    HAVING ISSUES WITH

    YOUR CURRENT DIAMOND

    EDGE GRINDING WHEELS

    Knowledge Center

    What you should know

    • BEFORE YOU BUY

    • BEFORE YOU USE

    • BEFORE YOU TRY

    your next diamond edge grinding wheel?

    A high-precision diamond cutting tool with an industrial-grade blade, designed for accurate and efficient material processing.
    02 Jun

    Silicon Fabrication Guide

    Share this Article with Friend or Colleague Cutting silicon wafers is a critical process in the manufacturing of semiconductor devices, where precision and control are paramount to the success of the final products. Silicon, a...

    Continue reading

    Silicon Semiconductors
    08 Jul

    Manufacturing Processes for Silicon Semiconductors From Ingot to Integrated Circuit

    Share this Article with Friend or Colleague 1. Ingot Production The journey begins with the creation of silicon ingots, which are pure silicon cylinders produced through methods like the Czochralski process. Once formed, these ingots undergo a...

    Continue reading

    Silicon Wafer
    08 Jul

    The Comprehensive Guide to the Processes of Silicon Wafers Production

    Share this Article with Friend or Colleague The production of silicon wafers, an essential component in semiconductor manufacturing, involves several intricate steps to ensure precision and quality. This article explores the detailed processes depicted in...

    Continue reading

    • Unmatched Selection For Many Applications
    • Superior Quality & Consistency
    • Immediate Worldwide Delivery
    • Technical Support & Expertise
    • American Based Manufacturer
    A clean and modern footer design showcasing contact information, social media icons, and useful links for easy website navigation.
    A collection of custom-designed diamond jewelry pieces, showcasing the artistry and craftsmanship of a designer.
    An image showcasing the products of Precision Abrasives Group, offering high-quality abrasive tools for various industries.
    • Different Product
    • Different Technology
    • Different Company
    • Expect MORE from your tools

    Let Us HELP You!

    Free Consultation

    Subscribe To Our Newsletter

    Signup for email offers, updates, and more

    Contact Us

    • 25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
    • Phone : (661) 257-2288
      FAX : (661) 257 -3833
    • lel@ukam.com
    img

    25205 & 25201 Avenue Tibbits Valencia CA 91355 USA

    img

    Phone : (661) 257-2288
    FAX : (661) 257 -3833

    img

    lel@ukam.com

    img
    • img
    • img
    • img
    • img
    • img
    An informative image representing the UKAM Gemstone Store, showcasing various precious and gemstones available for customers.

    UKAM Industrial Superhard Tools is a U.S. High Technology, Specialty Diamond Tool & Equipment manufacturer. We specialize in producing ultra thin, high precision cutting blades, precision cutting machines diamond drills, diamond micro tools, standard & custom advanced industrial diamond tools and consumables.

    • 25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
    • Phone : (661) 257-2288
      FAX : (661) 257 -3833
    • lel@ukam.com
    • 25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
    • Phone : (661) 257-2288
      FAX : (661) 257 -3833
    • lel@ukam.com

    DIAMOND TOOLS BY BOND

    • SMART CUT Technology
    • Sintered (Metal Bond) Diamond & CBN Tools
    • Resin Bond Diamond & CBN Tools
    • HYBRID Bond™ Diamond & CBN Tools
    • Electroplated (Nickel Bond) Diamond Tools
    • Braised Diamond & CBN Tools
    • Vitrified Bond Diamond & CBN Tools
    • Chemical Vapor Deposition Tools
    • Polycrystalline Diamond & CBN Tools
    • SMART CUT Technology
    • Sintered (Metal Bond) Diamond & CBN Tools
    • Resin Bond Diamond & CBN Tools
    • HYBRID Bond™ Diamond & CBN Tools
    • Electroplated (Nickel Bond) Diamond Tools
    • Braised Diamond & CBN Tools
    • Vitrified Bond Diamond & CBN Tools
    • Chemical Vapor Deposition Tools
    • Polycrystalline Diamond & CBN Tools

    EQUIPMENT

    • Precision Cutting Saws
    • Grinding / Polishing Equipment
    • Precision Cutting Saws
    • Grinding / Polishing Equipment

    KNOWLEDGE CENTER

    • All Articles
    • All Articles

    OUR PRODUCTS

    • Diamond Dicing Blades
    • Ultra Thin Precision Diamond​ Blades
    • Diamond Micro Drill​s & Tools
    • Diamond Routers, Points, Profile & Milling Tools
    • Diamond & CBN Wheels​
    • Custom Diamond & CBN Tools
    • Diamond Discs & Laps
    • Diamond Wire Blades​
    • Diamond & CBN Consumables
    • Consumables For Metallography
    • Diamond Tools For Construction
    • Diamond Band Saw Blades
    • Diamond Dressers
    • Diamond Rotary Dressers
    • Ultra Thin, High Precision & Micro Carbide Tools
    • Diamond Dicing Blades
    • Ultra Thin Precision Diamond​ Blades
    • Diamond Micro Drill​s & Tools
    • Diamond Routers, Points, Profile & Milling Tools
    • Diamond & CBN Wheels​
    • Custom Diamond & CBN Tools
    • Diamond Discs & Laps
    • Diamond Wire Blades​
    • Diamond & CBN Consumables
    • Consumables For Metallography
    • Diamond Tools For Construction
    • Diamond Band Saw Blades
    • Diamond Dressers
    • Diamond Rotary Dressers
    • Ultra Thin, High Precision & Micro Carbide Tools
    • Precision Abrasives
    • Diamond Tool Accessories
    • Process Development
    • Precision Machining Services
    • Precision Abrasives
    • Diamond Tool Accessories
    • Process Development
    • Precision Machining Services

    COMPANY

    • About Us
    • Contact Us
    • Become A Distributor
    • Become An Affiliate
    • Share Content & Receive Rewards
    • Guaranteed Trial Order
    • Best Price Gurantee
    • Sign Up For News Letter
    • About Us
    • Contact Us
    • Become A Distributor
    • Become An Affiliate
    • Share Content & Receive Rewards
    • Guaranteed Trial Order
    • Best Price Gurantee
    • Sign Up For News Letter

    CUSTOMER SERVICE

    • How to Order
    • Request Quote
    • Request Consultation
    • Frequently Asked Questions
    • Government Procurement
    • Terms & Conditions of Sale
    • JIT Inventory & Vending Solutions
    • Financing
    • My Account
    • Shipping & Deliveries
    • Returns & Exchanges
    • How to Order
    • Request Quote
    • Request Consultation
    • Frequently Asked Questions
    • Government Procurement
    • Terms & Conditions of Sale
    • JIT Inventory & Vending Solutions
    • Financing
    • My Account
    • Shipping & Deliveries
    • Returns & Exchanges
    Facebook-f Instagram Linkedin-in Youtube Tiktok

    Shipping Methods

    Various shipping methods available for efficient delivery, ensuring timely arrival of products with convenient and reliable options.
    Secure SSL Encryption

    Safe & Secure Payments

    Illustration depicting payment security measures for online transactions, showcasing encryption, secure payment and protection of sensitive financial data.

    © Copyright 1990-2025. UKAM Industrial Superhard Tools – Terms of Use

    • Menu
    • Categories
    • Contact Us
    • Contact Us
    • Contact Us
    • How To Order
    • How To Order
    • How To Order
    • Request Quote
    • Request Quote
    • Request Quote
    • Frequently Asked Questions
    • Frequently Asked Questions
    • Frequently Asked Questions
    • Return Policy Information
    • Return Policy Information
    • Return Policy Information
    • Home
    • About Us
      • About Us
      • Achievements
      • Research & Development
      • What’s New
      • Become A Distributor
      • Become An Affiliate
      • Employment
      • Custom Diamond & CBN Tools
      • Sign Up For News Letter
      • Contact Us
    • Products
    • Technologies
      • SMART CUT®
      • Sintered (Metal Bond)
      • Resin Bond
      • HYBRID Bond™
      • Electroplating (Nickel Bond)
      • Braised Bond
      • Vetrified Bond
      • Polycrystalline
      • Chemical Vapor Deposition
      • Precision Carbide
    • Industries
      • Advanced Ceramics
      • Composites
      • Concrete & Construction
      • Glass & Quartz
      • Lapidary
      • Metallography
      • Semiconductor Industry
      • Stone
      • Photonics
    • Knowledge Center
    • Shop
    • Blog
    • Customer Service
    • 0 items in quote

      No products in the Quote Basket.

    • Wishlist
    • Login / Register
    Shopping cart
    Close
    Sign in
    Close

    Lost your password?

    No account yet?

    Create an Account
    ×
    1
    Product selection
    2
    Contact information
    3
    Review information
    Wishlist
    0 items Cart
    My account

    Select at least 2 products
    to compare

    View comparison