Diamond wafering blades
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Diamond wafering blades
Item #23-4874ME (3062014)- 6"(152mm) x .020"(0.5mm) x 1/2"(12.7mm) DIAMOND WAFERING BLADES, SINTERED (METAL BOND) - SERIES 20HCU $194.00
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Item #23-4875ME (3072510)- 7″(178mm) x .025″(0.6mm) x 1/2″(12.7mm) DIAMOND WAFERING BLADES, SINTERED (METAL BOND) – SERIES 20HCU

$214.00

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Quantity Price
1 $214.00
2 $209.00
3+ $204.00
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Additional information
Weight 1.4 lbs
Dimensions 7 × 7 × 0.25 in
Diameter

7"(178mm)
Thickness

.025"(0.6mm)
Arbor Size

1/2"(12.7mm)
BUEHLER NO.

11-4237
2 pcs and 3 pcs

2 pcs – $209.00 ea

,

3pcs -$204.00 ea