ID blades (Inside Diameter) Diamond Cutting Blades – SMART CUT Series

SMART CUT  ID blades (inside diameter) diamond cutting plates are nickel bond product with diamond coating on the internal edge. Internal diameter is of the blade is what does the cutting. These blades are used for cutting large variety of ultra hard and brittle materials, with minimum amount of material loss. The high tensile strength stainless steel core provides excellent cutting quality and increased yield. SMART CUT series we provide large selecting of diamond sizes, kerf thickness, kerf shape, bond hardness for to best fit your specific application and requirements.

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ID Cropping Blade Parameters

Material

Diamond Micron Size (µm)

Blade Speed (m/s)

Feed Rate (mm/min)

Flow Cooling (l/h)

Aluminium nitride

160 µm

18

5-25

4

Aluminium oxide

160 µm

16

3-10

6

Ferrite

40 µm

18

10-50

2-4

Gallium arsenide (315)

40 µm

18

10-20

2-6

Gallium phosphide (315)

40 µm

18

10-20

2-6

Germanium

40 µm

19-21

30-70

2-6

GGG (Gadolinium Gallium Garnet)

40 µm

18

10-20

7-12

Graphite

160 µm

21

250

7-12

Indium arsenide

40 µm

18

10-20

2-6

Indium phosphite

40 µm

18

10-20

8-12

Lithium niobate

40 µm

18

20-40

2-6

Lithium tantalate

40 µm

20

3-10

6

Optical glass (BK7)

160 µm

15

5-20

8-10

Quartz

160 µm

12

15-30

8-12

Quartz glass

160 µm

15

5-20

8-10

Samarium cobalt

140 µm / 40 µm

18

10-30

7-12

Sapphire

160 µm

19

1-5

10-12

ID Saw Blades Trouble Shooting Guide

Sawmarks (Surface Quality Issues)

Sawmarks indicate irregularities in the blade’s movement, material interaction, or cooling efficiency.

Issue

Possible Cause

Solution

Overall Sawmarks

- Irregular cutting edge

- Dull cutting edge

- Blade runout too high

- Excess slurry on the blade

 

- Dress the blade regularly with a dressing stick to maintain uniformity.

- Replace or recondition the blade to avoid excessive force.

- Replace or recondition the blade to avoid excessive force.

- Ensure proper blade mounting and inspect spindle alignment.

- Adjust slurry flow and filtration to prevent buildup.

Start of Slicing Sawmarks

 

- Dull cutting edge

- Excessive feed rate

- Verify blade sharpness before slicing.

- Reduce feed rate at the beginning of the cut for smoother engagement.

End of Slicing Sawmarks

- Blade runout too high

- Dull cutting edge

- Minimize vibration by improving machine stability and balance.

- Use a sharper blade with an appropriate bond and grit size.

Bow (Material Warping During Cutting)

Material bowing or distortion can be caused by heat buildup, uneven forces, or improper machine setup.

Issue

Possible Cause

Solution

Convex Bow (Outward Warping)

- Cutting edge irregularity

- Improper coolant flow rate

- Use precision-ground blades with consistent diamond distribution.

- Adjust coolant flow to maintain uniform material cooling.

 

Concave Bow (Inward Warping)

- Dull cutting edge

- Blade runout too high

- Select a blade with sharper diamond exposure to reduce friction.

- Verify blade concentricity and use high-precision flanges.

Tapered Cut

- Excessive feed rate

- Blade runout too high

- Lower feed rate gradually instead of abrupt changes.

- Reduce vibration by ensuring proper spindle and arbor alignment.

Chipping (Edge Damage on Material)

Chipping at the start or end of a cut can result from improper blade condition, machine setup, or cutting parameters.

Issue

Possible Cause

Solution

Start of Slicing Chipping

- Excessive feed rate

- Dull cutting edge

- Coolant flow too low

- Reduce initial feed rate and gradually increase.

- Replace the blade or select a finer grit size.

- Increase coolant flow for better lubrication.

End of Slicing Chipping

- Blade runout too high

- Dull cutting edge

- Inspect blade mounting and reduce vibration.

- Ensure the blade is sharp and properly bonded.

Wafer Breakage (Catastrophic Failure of Material)

Wafer breakage can result in significant material loss, downtime, and increased costs.

Issue

Possible Cause

Solution

Breakage from Mounting Beam

- Excess slurry on blade

- Damaged blade core

- Reduce slurry concentration and clean blade frequently.

- Inspect blade core integrity for cracks and replace when necessary.

Breakage During Cutting

- Dull cutting edge

- Excessive feed rate

- Coolant flow too low

- Coolant flow too high

- Use a sharp blade and avoid excessive force.

- Reduce feed rate to prevent material stress.

- Increase coolant flow to dissipate heat.

- Optimize coolant delivery to avoid excessive pressure.

Application

Equipment Used On

Universal application on all standard machines such as Meyer & Burger, TSK, STC, GMN

Advantages

ID blades
ID blades

7064701, 7064702, 7064703, 7064704, 7064705

Here are popular specifications below (other specifications can be produced upon request)

Item Number

Outside Diameter

Inside Diameter

7064701

34″ (860mm)

12″ (305mm)

7064702

27″ (690mm)

9.5″ (240mm)

7064703

22″ (560mm)

9.5″ (240mm)

7064704

22″ (560mm)

8″ (200mm)

7064705

16.6″ (420mm)

6″ (150mm)

Other specifications are available upon request

Benefits:

ID Cropping Blades Parameters

Material

Diamond Micron Size (µm)

Blade Speed (m/s)

Feed Rate (mm/min)

Flow Cooling (l/h)

Aluminium nitride

160 µm

18

5-25

4

Aluminium oxide

160 µm

16

3-10

6

Ferrite

40 µm

18

10-50

2-4

Gallium arsenide (315)

40 µm

18

10-20

2-6

Gallium phosphide (315)

40 µm

18

10-20

2-6

Germanium

40 µm

19-21

30-70

2-6

GGG (Gadolinium Gallium Garnet)

40 µm

18

10-20

7-12

Graphite

160 µm

21

250

7-12

Indium arsenide

40 µm

18

10-20

2-6

Indium phosphite

40 µm

18

10-20

8-12

Lithium niobate

40 µm

18

20-40

2-6

Lithium tantalate

40 µm

20

3-10

6

Optical glass (BK7)

160 µm

15

5-20

8-10

Quartz

160 µm

12

15-30

8-12

Quartz glass

160 µm

15

5-20

8-10

Samarium cobalt

140 µm / 40 µm

18

10-30

7-12

Sapphire

160 µm

19

1-5

10-12

Diamond Dressers
14
Precision Machining Services

Cropping Silicon Using Inside Diamond Blades

The cropping process in industrial settings often involves resizing or sectionalizing materials into more manageable or specifically sized pieces using industrial diamond blades. These blades are favored for their precision and ability to handle a variety of materials, including ceramics, metals, composites, and advanced materials.

Silicon Fabrication Guide
Silicon Fabrication Guide

Industrial diamond (ID) blades are chosen for their exceptional hardness, which allows them to cut through tough materials with minimal wear. Their cutting edges are embedded with synthetic diamond grit, which provides a combination of sharpness and durability essential for efficient cropping. The advantages of using ID blades include precision cutting, which produces cleaner cuts with tighter tolerances than conventional blades; reduced material waste, which is crucial when working with expensive materials; enhanced cutting speed, as diamond blades can operate at higher speeds without sacrificing cut quality; and versatility, as they can handle a variety of materials from soft aluminum to hard quartz or ceramics.

When using ID diamond blades for cropping, it's important to consider several factors to optimize the process. The choice of blade should be suited to the material type and desired cut quality, with considerations for diamond grit size, concentration, and the matrix material. The cutting machine should be capable of handling the size and type of blade and provide the necessary power and stability. Adjusting the feed rate to match the material’s hardness and thickness is crucial; too fast a feed rate can cause blade overheating and wear, while too slow can reduce efficiency. Using appropriate coolants can prevent overheating and remove debris from the cutting area, affecting both cut quality and blade life. Regular checks for blade wear and tear are necessary, as even high-quality diamond blades deteriorate and require dressing to restore their cutting performance.

To achieve optimal results during the cropping process with ID diamond blades, technical specifications such as RPM (rotations per minute), blade diameter, and cutting depth must be precisely aligned with the material properties and the desired outcomes. For instance, cropping a piece of sintered carbide, a very hard material, would ideally be done using a thin kerf diamond blade with a fine grit size for a smooth surface finish. The machine's RPM should be adjusted to the lower end of the blade's capability to minimize the risk of chipping the carbide, and coolants should be used to keep the cutting zone clean and cool, enhancing the blade's lifespan and the quality of the cut.

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT ® Bond Works?

Step 1
Sharpest And Finest Quality Diamonds

Sharpest And Finest Quality Diamonds

The sharpest and finest quality diamonds or CBN crystals that go into a SMART CUT® Diamond Bond, immediately penetrate into the material, grinding and polishing as they cut.

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2
Sharpest And Finest Quality Diamonds

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3
Sharpest And Finest Quality Diamonds

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

Faster

Cutting Action

ID Saw Blades made utilizing SMART CUT technology are much more aggressive than your conventional ID Blades. They can cut faster, while still leaving behind a smooth finish free of material deformation.

Longer

Life

In most cases ID saw blades manufactured utilizing SMART CUT technology, will outlast other conventional nickel bonded diamond CBN drills. SMART CUT diamond ID blades are more sturdy than Blades manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the Blades life.

More

Consistent Performance

SMART CUT®  Multi Layered Electroplated diamond cutting blade three diamond layers impregnated inside the bond matrix. Unlike Many Other Blade Types, they wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing even on the hardest to cut materials.

Best

Performance & Value on the Market

SMART CUT® Multi Layered diamond cutting blades are the best investment you can make! They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using

The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

About Nickel Bond
(Electroplated) Tools

Electroplated (nickel bond) diamond products usually have a single layer of diamonds, held by a tough durable nickel alloy. Nickel is frequently used as a base for plating diamond. Because of its excellent strength, toughness and flexibility during the plating process. Electroplated diamond products are able to retain their original shape and dimensions thought their working life. Unlike sintered (meal bond) or resin bond diamond products, where diamond particles are buried in bond and held together by metal or resin binder deep inside.

Electroplating allows diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.

Recommended Coolant for ID Saw Blades

One of the most effective coolants available for diamond wire sawing and silicon slicing applications is SMART CUT® HD Synthetic Low IFT Coolant & Lubricant. This advanced coolant is specifically formulated to:

Using SMART CUT® HD Synthetic Low IFT Coolant & Lubricant optimizes the slicing process by ensuring superior lubrication and thermal management.

Coolant Additives & Their Role

Specialized coolant such as SMART CUT® HD Synthetic Low IFT Coolant & Lubricant will significantly outperform deionized water and improve the effectiveness in the slicing process. The most commonly used coolant additives include:

It is important to note that coolant additives should always be used unless they introduce process difficulties. When properly selected, they have a positive impact on cutting speed, yield, blade longevity, and surface quality.

Coolant Nozzle Positioning & Flow Optimization

The correct placement of coolant nozzles is critical to achieving optimal coolant distribution and uniform blade wear. Coolant nozzles should be positioned to:

An even split of the coolant stream ensures that all parts of the blade receive equal cooling and lubrication, leading to consistent cutting performance and longer blade life.

Impact of Cooling Mode & Flow Rate on Cutting Performance

Research studies and industry experience have demonstrated that the mode of coolant supply and its flow rate have a significant impact on:

Key considerations when optimizing coolant supply:

SMART CUT® HD-2B

Synthetic Low IFT Coolant / Lubricant for ID Blades

SMART CUT® is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots using ID, band, and wire saws. SMART CUT® HD-2B can also be used as a non-re-circulating edge grinding coolant or lubricant for silicon wafers and ingots.

SMART CUT® HD-2B Coolant enhances cutting performance by providing exceptional cooling and lubrication. The coolant's molecules interact with the cutting area, efficiently absorbing heat to prevent overheating.

While SMART CUT® HD-2B is not specifically designed to be mixed with water, its advanced formula works effectively in "once-through" systems, where it helps maintain optimal cutting conditions by reducing friction. This results in improved tool life, superior material quality, and smoother cuts. By dissipating heat effectively, SMART CUT® HD-2B minimizes tool wear, improves cut quality, and enables faster, more efficient cutting, all while ensuring a cleaner, more environmentally friendly process.

SMART CUT® HD-2B 2B acts as both a coolant and lubricant, effectively reducing heat generated by friction and minimizing surface tension. As a lubricant, it enhances the dispersion of material swarf, ensuring that swarf particles are effectively moved away from the diamond tool and cutting zone, preventing buildup within the kerf. The coolant's advanced formula works by bonding with the cutting area, helping to penetrate the kerf and flush out material debris, preventing chipping and internal cracking. Additionally, because SMART CUT® HD-2B keeps the cutting area clean and free from debris, it minimizes the need for secondary material processing and cleaning operations, enhancing overall efficiency and reducing maintenance requirements.

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